描述
Zytel XMP70G50HSLR BK314LM is a 50% glass fiber reinforced, heat stabilized, hydrolysis resistant polyamide 66 (PA66) resin supplied by Celanese Corporation (formerly DuPont Performance Polymers). This grade is specifically engineered for demanding applications requiring outstanding mechanical performance, exceptional fatigue resistance, and long-term durability in harsh environments .
Zytel XMP70G50HSLR BK314LM delivers a tensile modulus of 18,000 MPa (dry) and tensile strength at break of 270 MPa (dry), making it an excellent choice for metal replacement and structural components . The material is formulated with a heat stabilization package to maintain properties at elevated temperatures and hydrolysis resistance to withstand moisture-rich environments. Additionally, its laser markable feature enables permanent, high-contrast part identification for traceability and branding purposes .
With a melting temperature of 262°C and heat deflection temperature (HDT) of 256°C at 1.80 MPa, this grade offers outstanding thermal performance for under-hood automotive applications and other high-temperature environments .
Zytel XMP70G50HSLR BK314LM Key Features
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50% Glass Fiber Reinforcement: Delivers exceptional rigidity and strength with tensile modulus of 18,000 MPa and tensile stress at break of 270 MPa
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Heat Stabilized: Maintains mechanical properties at elevated temperatures for long-term thermal performance
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Hydrolysis Resistant: Formulated to withstand moisture degradation, suitable for humid and wet environments
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Laser Markable: Enables permanent, high-contrast part identification and traceability
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Outstanding Fatigue Performance: Developed for applications requiring long-term cyclic loading resistance
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Excellent Dimensional Stability: Low shrinkage (flow direction 0.20%) and low coefficient of thermal expansion
Zytel XMP70G50HSLR BK314LM Applications
Automotive Industry: Engine peripheral components, sensor housings, intake manifolds, fuel system elements, chassis brackets, suspension mounts, structural connectors requiring high strength and thermal resistance
Electronics & Electrical: High-reliability connectors, relay housings, coil bobbins, switch components, laser-markable precision parts for traceability
Industrial Equipment: Gears, bearings, shafts, wear-resistant transmission components utilizing high rigidity and fatigue resistance
Zytel XMP70G50HSLR BK314LM Technical Specifications
| Property | Test Condition | Standard | Dry | Conditioned | Unit |
|---|---|---|---|---|---|
| Density | — | ISO 1183 | 1.58 | — | g/cm³ |
| Molding Shrinkage (Flow) | — | ISO 294-4 | 0.20 | — | % |
| Molding Shrinkage (Transverse) | — | ISO 294-4 | 0.80 | — | % |
| Water Absorption | Saturation, 23°C, 2.00mm | ISO 62 | 4.0 | — | % |
| Water Absorption | Equilibrium, 50% RH | ISO 62 | 1.2 | — | % |
| Tensile Modulus | 23°C | ISO 527-1 | 18,000 | 13,300 | MPa |
| Tensile Stress at Break | 23°C | ISO 527-2/5 | 270 | 190 | MPa |
| Tensile Strain at Break | 23°C | ISO 527-2/5 | 2.5 | 5.0 | % |
| Flexural Modulus | 23°C | ISO 178 | 17,800 | 12,000 | MPa |
| Flexural Stress | 23°C | ISO 178 | 430 | — | MPa |
| Charpy Notched Impact | 23°C | ISO 179/1eA | 19 | 20 | kJ/m² |
| Charpy Notched Impact | -40°C | ISO 179/1eA | 18 | 17 | kJ/m² |
| Charpy Unnotched Impact | 23°C | ISO 179/1eU | 110 | 99 | kJ/m² |
| HDT (0.45 MPa) | Unannealed | ISO 75-2/B | 263 | — | °C |
| HDT (1.80 MPa) | Unannealed | ISO 75-2/A | 256 | — | °C |
| Melting Temperature | — | ISO 11357-3 | 262 | — | °C |
| Glass Transition Temp | — | ISO 11357-3 | 71.0 | 19.0 | °C |
| CLTE (Flow) | — | ISO 11359-2 | 1.4×10⁻⁵ | — | cm/cm/°C |
| CLTE (Transverse) | — | ISO 11359-2 | 9.2×10⁻⁵ | — | cm/cm/°C |
| Melt Viscosity | 280°C, 1000 sec⁻¹ | ISO 11443 | 260 | — | mPa·s |
| Ejection Temperature | — | — | 210 | — | °C |
Processing Guide
| Parameter | Recommended Value |
|---|---|
| Drying Temperature | 80°C |
| Drying Time (Hot Air Dryer) | 2.0 – 4.0 hours |
| Suggested Max Moisture | < 0.20% |
| Melt Temperature Range | 290 – 310°C |
| Optimum Melt Temperature | ~300°C |
| Mold Temperature Range | 70 – 120°C |
| Optimum Mold Temperature | ~100°C |
| Holding Pressure | 50 – 100 MPa |
| Holding Pressure Time | ~3.0 s/mm |
| Max Screw Tangential Speed | < 12 m/min |
| Drying Recommended | Yes |
Zytel XMP70G50HSLR BK314LM FAQ
Q: What is Zytel XMP70G50HSLR BK314LM?
A: It is a 50% glass fiber reinforced, heat stabilized, hydrolysis resistant, laser markable PA66 resin from Celanese for injection molding applications requiring outstanding mechanical and fatigue performance .
Q: What are the mechanical properties of this material?
A: It offers tensile modulus of 18,000 MPa, tensile stress at break of 270 MPa, and Charpy notched impact strength of 19 kJ/m² at 23°C .
Q: What does “HSLR” stand for?
A: HSLR stands for Heat Stabilized, Hydrolysis Resistant, indicating the material’s enhanced thermal stability and resistance to moisture degradation .
Q: Is this material laser markable?
A: Yes, Zytel XMP70G50HSLR BK314LM is specially formulated for laser marking, enabling permanent high-contrast identification on finished parts .
Q: What are the recommended processing conditions?
A: Melt temperature 290–310°C, mold temperature 70–120°C, with material dried to below 0.20% moisture content prior to processing .
Q: What applications is this material suitable for?
A: It is widely used in automotive engine components, structural parts, high-reliability connectors, and industrial gears and bearings .
