TPX DX560M – Heat-Resistant PMP Resin by Mitsui Chemicals

基础信息

品名
TPX DX560M
牌号
DX560M
厂商
Mitsui Chemicals, Inc.
材料类型
Polymethylpentene (PMP) Copolymer – Transparent Grade
产品形态
Resin Pellets
特点
Heat resistant (MP 222°C); low density (0.856 g/cm³); excellent transparency equivalent to glass and acrylic; superior releasability; good chemical & steam resistance; high gas permeability; low dielectric properties; FDA compliant; halogen-free

描述

TPX DX560M Resin is an opaque, heat resistant, low density polymethylpentene (PMP) manufactured by Mitsui Chemicals. TPX is the trade name for poly(4-methylpentene-1), a unique olefin copolymer with a molecular structure distinct from conventional polyolefins .

This grade exhibits excellent heat resistance with a melting point of 222°C and a Vicat softening temperature of 87°C . TPX DX560M boasts superior releasability and is one of the lightest polymer materials among thermoplastic plastics, with a density of 856 kg/m³ . Physical property data is determined using test methods established by ISO, the globally recognized standards organization.

For more TPX grades and technical information, please visit our TPX product page.

Key Features of TPX DX560M Resin

  • Opaque & Heat Resistant – Melting point of 222°C and Vicat softening temperature of 87°C for demanding thermal applications 

  • Lowest Density Among Thermoplastics – Density of 0.856 g/cm³ (856 kg/m³) for maximum lightweighting 

  • Superior Releasability – Excellent release from various materials, ideal for molding and release applications 

  • Excellent Chemical & Steam Resistance – High durability against acids, alkalis, and alcohol; withstands steam sterilization 

  • Excellent Processability – High flow with MFR of 33 g/10min (260°C/5.0kg) for efficient processing 

  • Low Dielectric Properties – Dielectric constant of 2.12–2.16 at 1MHz; dielectric breakdown voltage of 30 kV/mm 

  • Low Water Absorption – <0.01% water absorption (24 hrs) 

  • Excellent Gas Permeability – Suitable for gas separation applications 

  • Food Contact Compliant – Suitable for food containers and food packaging applications 

  • Versatile Processing – Supports injection molding, mandrel/pipe/profile extrusion, cast film extrusion, and blow molding 

Typical Applications for TPX DX560M Resin

Industry Typical Components & Considerations
Flexible Printed Circuits (FPC) Release film for FPC manufacturing – superior releasability, heat resistance, chemical resistance 
Rubber & Hose Manufacturing Mandrels and sheaths for high-pressure rubber hose – heat resistance, chemical resistance, easy release 
LED Manufacturing LED mold cups – heat resistance, release properties 
Synthetic Leather Release paper for synthetic leather manufacturing – superior releasability 
Food Packaging Food wraps, baking cartons, microwave oven tableware – food contact compliant, heat resistance 
Composite Molding Release interfaces and tooling – thermal and chemical stability 
Industrial Animal cages, experimental apparatuses, hollow fiber – low density, chemical resistance 

Typical Properties of TPX DX560M Resin

Property Value Test Method
Physical
Density 0.856 g/cm³ (856 kg/m³) MCI Method 
Melt Mass-Flow Rate (MFR) (260°C/5.0kg) 33 g/10min MCI Method 
Water Absorption <0.01% (24 hrs)
Refractive Index 1.463
Mechanical
Flexural Modulus 190 MPa ISO 178 
Flexural Strength 6 MPa ISO 178 
Tensile Strength at Yield 7 MPa ISO 527 
Fractured Strain 238–319% ISO 527 
Notched Izod Impact No Break ISO 180 
Thermal
Melting Point 222°C DSC / MCI Method 
Vicat Softening Temperature 87°C ISO 306 
Deflection Temperature @ 0.46 MPa (66 psi) 53°C ISO 75 
Electrical
Dielectric Breakdown Voltage 30 kV/mm (2mm) IEC 60243-1 
Dielectric Constant 2.12–2.16 (1MHz) IEC 60250 
Volume Resistivity >10¹⁵ ohm-cm IEC 60093 
Processing
Processing Methods Injection molding, extrusion (mandrel, pipe, profile), blow molding, cast film extrusion 
Drying Temperature 80 – 100°C
Drying Time 2 – 4 hours
Recommended Melt Temperature 260 – 300°C
Mold Temperature 40 – 80°C

Important Notes on Typical Data:

Values listed are typical and sourced from manufacturer data sheets. They do not constitute binding product specification.

Batch-to-batch deviations may exist. For critical applications, validate performance with batch-specific COA certificate.

Final performance depends on processing conditions and part design.

Manufacturer official TDS shall serve as definitive technical reference. Request the latest official TDS from our sales team.

Processing Guidelines for TPX DX560M Resin

Step Process
Processing Methods Injection molding, mandrel/pipe/profile extrusion, cast film extrusion, blow molding 
Drying Temperature 80 – 100°C
Drying Time 2 – 4 hours
Recommended Melt Temperature 260 – 300°C
Mold Temperature 40 – 80°C
Storage Store in original, sealed packaging in a cool, dry place away from direct sunlight

Critical Processing Warnings:

Versatile Processing: TPX DX560M supports multiple processing methods including injection molding, mandrel/pipe/profile extrusion, cast film extrusion, and blow molding .

Drying: Proper drying is critical to prevent hydrolysis and achieve optimal mechanical properties.

High Flow: With an MFR of 33 g/10min (260°C/5.0kg), this grade offers excellent flow for efficient processing .

Mold Release: TPX DX560M offers superior releasability for easy part ejection .

Storage: Store in original, sealed packaging in a cool, dry place away from direct sunlight.

Related Products

Explore TPX Transparent Heat Resistant Resin – Browse all TPX grades

About Our Company – Learn more about our supply capabilities and quality assurance

Technical Documents for TPX DX560M Resin

Document Type Description & Source
Manufacturer Official TDS Complete physical, thermal, and mechanical properties of TPX DX560M
Manufacturer Official SDS GHS-compliant safety documentation 
COA (Certificate of Analysis) Batch-specific quality certification
Food Contact Compliance Documentation Food contact compliance certificates

Request any document above by:

Email: ruiqingchem@gmail.com

Online form: Our contact page

We reply within one working business day. Please clearly state product (TPX DX560M) and document type you require.

FAQ about TPX DX560M Resin

Q1: What is TPX DX560M?

A: TPX DX560M Resin is an opaque, heat resistant, low density polymethylpentene (PMP) manufactured by Mitsui Chemicals. It is a 4-methylpentene-1-based olefin copolymer with high heat resistance, superior releasability, and one of the lowest densities among thermoplastic polymers .

Q2: What are the key features of TPX DX560M?

A: Lowest density among thermoplastics (0.856 g/cm³), melting point of 222°C, superior releasability, excellent chemical & steam resistance (acids, alkalis, alcohol), low dielectric properties (2.12–2.16 at 1MHz), high gas permeability, low water absorption (<0.01% in 24 hrs), and food contact compliant .

Q3: What are the typical applications for TPX DX560M?

A: FPC release film, rubber hose mandrels and sheaths, LED mold cups, synthetic leather release paper, food containers and microwave tableware, composite molding tooling, and industrial applications such as animal cages and experimental apparatuses .

Q4: What is the density of TPX DX560M?

A: The density is 0.856 g/cm³ (856 kg/m³), which is among the lowest of all thermoplastic polymers .

Q5: What is the melting point of TPX DX560M?

A: The melting point is 222°C .

Q6: What is the recommended processing method for TPX DX560M?

A: Injection molding, mandrel/pipe/profile extrusion, cast film extrusion, and blow molding. Recommended melt temperature: 260–300°C. Drying: 80–100°C for 2–4 hours .

Q7: What regions is TPX DX560M available in?

A: North America and Africa & Middle East .

Q8: Is TPX DX560M food contact compliant?

A: Yes, TPX DX560M is suitable for food contact applications including food containers, microwave oven tableware, and food packaging .

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After-Sales Support

Service Details
Quality Inspection Period All quality-related claims must be submitted within 7 working days after delivery, supported by test data and photographic evidence.
Return / Exchange Policy Confirmed product defects caused by our side trigger replacement or refund. Terms and conditions apply.
Logistics Damage Report shipping damage directly to carrier immediately upon goods receipt. We assist with claim-document preparation.
Technical Support Remote technical guidance available. On-site troubleshooting can be arranged upon special request.
Export Documentation We supply commercial invoice, packing list, bill of lading, COA, and additional compliance certificates on request.

Disclaimer

DISCLAIMER: All technical data is referenced from original manufacturer typical values for TPX DX560M. Our company acts as authorized distributor/trader rather than original manufacturer. Final performance depends on processing conditions and part design. Buyers shall independently validate product suitability for individual applications. Our firm bears no liability for product failure caused by improper processing or improper usage. Always reference the latest manufacturer official TDS of TPX DX560M as the definitive specification.

Technical Documents

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