描述
Fortron FX530T4 is a 30% glass fiber reinforced, impact modified polyphenylene sulfide (PPS) injection molding grade from Celanese Corporation. This grade offers good thermal shock resistance combined with excellent heat and chemical resistance, making it suitable for demanding applications in automotive, electrical, and industrial sectors.
With 30% glass fiber reinforcement and impact modification, Fortron FX530T4 delivers improved toughness compared to standard glass-filled PPS grades while maintaining excellent dimensional stability and heat resistance. The impact modification provides enhanced thermal shock resistance, making it ideal for components subject to rapid temperature cycling.
As a linear, semi-crystalline PPS, Fortron FX530T4 provides excellent chemical resistance to all solvents below 200°C, acids, bases, automotive fuels, and petroleum fluids at elevated temperatures. The material is inherently flame-retardant and RoHS compliant.
For more PPS grades and technical information, please visit our PPS/Polyphenylene Sulfide product page. You can also explore Celanese’s official Fortron PPS portfolio for additional manufacturer insights.
Key Features of Fortron FX530T4
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30% Glass Fiber Reinforcement – Enhanced mechanical properties and dimensional stability
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Impact Modified – Good impact resistance with Charpy notched impact of 10 kJ/m² at 23°C and 9 kJ/m² at -30°C
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Excellent Thermal Shock Resistance – Good resistance to rapid temperature cycling
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High Stiffness – Tensile modulus of 10,000 MPa
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High Strength – Tensile strength of 140-145 MPa
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Excellent Heat Resistance – HDT of 260°C at 1.80 MPa
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Inherent Flame Retardancy – V-0 flame retardant (halogen-free)
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Good Dimensional Stability – Low moisture absorption and low shrinkage
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Excellent Chemical Resistance – Resists solvents, acids, bases, and automotive fuels below 200°C
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Very Low Moisture Absorption – <0.02% water absorption
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Good Electrical Properties – Volume resistivity >1×10¹³ Ω·m; dielectric strength 21 kV/mm
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Suitable for Lead-Free Soldering – Compatible with lead-free soldering processes
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Global Supply – Available across North America, Europe, Asia Pacific, Latin America, Africa & Middle East
Typical Applications for Fortron FX530T4
| Industry | Typical Components & Considerations |
|---|---|
| Automotive | Engine components, EGR valves, turbocharger components, sensors, connectors – requiring thermal shock resistance and chemical resistance to fuels at elevated temperatures |
| Electrical & Electronics | Connectors, coil bobbins, relay housings, sensors, SMT components – requiring V-0 flammability and heat resistance |
| Industrial | Pump and valve components, chemical processing equipment – requiring corrosion resistance and dimensional stability |
| Consumer Appliances | Microwave oven components, coffee maker parts, hair dryers – requiring heat resistance and durability |
| Metal Replacement | Applications requiring lighter, tougher alternative to metal |
| Lead-Free Soldering | Electronic components suitable for lead-free soldering processes |
Typical Properties of Fortron FX530T4
| Property | Value | Test Method |
|---|---|---|
| Physical | ||
| Density | 1.50 g/cm³ (1500 kg/m³) | ISO 1183 |
| Mechanical | ||
| Tensile Modulus | 10,000 MPa | ISO 527 |
| Tensile Stress at Break | 140-145 MPa | ISO 527 |
| Tensile Strain at Break | 2% | ISO 527 |
| Flexural Modulus | 9,700 MPa | ISO 178 |
| Flexural Strength | 200 MPa | ISO 178 |
| Poisson’s Ratio | 0.34 | — |
| Impact | ||
| Charpy Notched Impact (23°C) | 10 kJ/m² | ISO 179/1eA |
| Charpy Notched Impact (-30°C) | 9 kJ/m² | ISO 179/1eA |
| Thermal | ||
| HDT @ 1.80 MPa | 260°C | ISO 75-1/-2 |
| Electrical | ||
| Volume Resistivity | >1×10¹³ Ω·m | IEC 62631-3-1 |
| Surface Resistivity | 1×10¹¹ Ω | IEC 62631-3-2 |
| Dielectric Strength | 21 kV/mm | IEC 60243-1 |
| Comparative Tracking Index (CTI) | 125 | IEC 60112 |
Important Notes on Typical Data
📌 Values are typical – The data listed above is sourced from manufacturer data sheets for reference only and does not constitute binding product specifications for Fortron FX530T4.
📌 Batch variations – Batch-to-batch deviations may exist. For critical applications, validate performance with batch-specific COA certificates.
📌 Final performance – Actual performance depends on processing conditions and part design. Refer to ISO testing standards for detailed methodology.
📌 Authoritative reference – The manufacturer’s official TDS shall serve as the definitive technical reference for Fortron FX530T4. Request the latest official TDS from our sales team.
Processing Guidelines for Fortron FX530T4
| Step | Process |
|---|---|
| Processing Methods | Injection Molding |
| Drying Recommended | Yes |
| Drying Temperature | 130°C |
| Drying Time (Dehumidified Dryer) | 2 – 4 hours |
| Suggested Max Moisture | ≤ 0.02% |
| Dew Point Requirement | ≤ -30°C |
| Optimum Melt Temperature | 330°C |
| Min. Melt Temperature | 310°C |
| Max. Melt Temperature | 340°C |
| Optimum Mold Temperature | 150°C |
| Min. Mold Temperature | 140°C |
| Max. Mold Temperature | 160°C |
| Screw Tangential Speed | 0.2 – 0.3 m/s |
| Hold Pressure Range | 30 – 70 MPa |
| Back Pressure | ≤ 3 MPa |
| Storage | Store in original, sealed packaging in a cool, dry place away from direct sunlight |
Critical Processing Warnings for Fortron FX530T4
⚠️ Drying Requirement – Fortron FX530T4 requires drying prior to processing. Because of the necessary low maximum residual moisture content, the use of dry air dryers is recommended. The dew point should be ≤ -30°C. The time between drying and processing should be as short as possible.
⚠️ Moisture Control – Maximum residual moisture content should be ≤ 0.02%. Proper drying is essential to prevent void formation and ensure optimal part quality.
⚠️ Melt Temperature – The recommended melt temperature range is 310–340°C, with an optimum of 330°C. Avoid exceeding 340°C to prevent material degradation.
⚠️ Mold Temperature – Minimum mold wall temperature of 140°C is required for optimal crystallization and part properties.
⚠️ Impact Modified Grade – This grade is specifically formulated for impact resistance and thermal shock resistance. Processing parameters should be optimized to maintain impact modification performance.
⚠️ Thermal Shock Applications – Fortron FX530T4 is designed for applications requiring good thermal shock resistance. Ensure proper part design to maximize performance under thermal cycling conditions.
⚠️ Storage – Store in original, sealed packaging in a cool, dry place away from direct sunlight. For subsequent storage, the material should be stored dry until processed.
Comparison: Fortron FX530T4 vs. Fortron FX515T1
| Feature | Fortron FX530T4 | Fortron FX515T1 |
|---|---|---|
| Glass Fiber Content | 30% | 15% |
| Key Feature | Impact modified + Thermal shock resistance | Impact modified + Food contact |
| Tensile Modulus | 10,000 MPa | 6,000 MPa |
| Tensile Strength | 140-145 MPa | 100 MPa |
| HDT @ 1.80 MPa | 260°C | 220°C |
| Charpy Notched Impact (23°C) | 10 kJ/m² | 10 kJ/m² |
| Density | 1.50 g/cm³ | 1.37 g/cm³ |
| Food Contact | — | FDA/EU Compliant |
| Primary Application | Thermal shock resistance | Automotive + Food processing |
Related Products
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PPS/Polyphenylene Sulfide – View our full range of PPS products
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Fortron FX515T1 – 15% glass filled, impact modified PPS with food contact compliance
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Fortron 1140L4 – 40% glass reinforced PPS, standard injection molding grade
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Fortron 1140L6 – 40% glass reinforced PPS, easy flow for thin-wall applications
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Explore Engineering Plastics – Browse all engineering plastic materials
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About Our Company – Learn more about our supply capabilities and quality assurance
Technical Documents for Fortron FX530T4
| Document Type | Description & Source |
|---|---|
| Manufacturer Official TDS | Complete physical, thermal, and mechanical properties of Fortron FX530T4 |
| Manufacturer Official SDS | GHS-compliant safety documentation |
| COA (Certificate of Analysis) | Batch-specific quality certification for Fortron FX530T4 |
| UL Yellow Card | UL safety certification |
Request any document above by:
📧 Email: ruiqingchem@gmail.com
📝 Online form: Our contact page
We reply within one working business day. Please clearly state product (Fortron FX530T4) and document type you require.
FAQ about Fortron FX530T4
Q1: What is Fortron FX530T4?
A: Fortron FX530T4 is a 30% glass fiber reinforced, impact modified PPS injection molding grade from Celanese, offering good thermal shock resistance.
Q2: What are the key features of Fortron FX530T4?
A: 30% glass reinforcement; impact modified for thermal shock resistance; tensile modulus 10,000 MPa; tensile strength 140-145 MPa; HDT 260°C; Charpy notched impact 10 kJ/m²; V-0 flame retardant.
Q3: What are the typical applications for Fortron FX530T4?
A: Automotive under-hood components, engine parts, electrical connectors, coil bobbins, industrial components, and consumer appliances.
Q4: What is the recommended drying condition?
A: Dry at 130°C for 2–4 hours using a dehumidified air dryer with dew point ≤ -30°C. Maximum residual moisture should be ≤ 0.02%.
Q5: What is the density of Fortron FX530T4?
A: 1.50 g/cm³ (1500 kg/m³).
Q6: What is the HDT @ 1.80 MPa of Fortron FX530T4?
A: 260°C.
Q7: What regions is Fortron FX530T4 available in?
A: North America, Europe, Asia Pacific, Latin America, Africa & Middle East.
Q8: Is Fortron FX530T4 flame retardant?
A: Yes, it is inherently flame-retardant (V-0).
Q9: What is the tensile modulus of Fortron FX530T4?
A: 10,000 MPa.
Q10: What is the Charpy notched impact strength?
A: 10 kJ/m² at 23°C and 9 kJ/m² at -30°C.
Q11: Is Fortron FX530T4 suitable for lead-free soldering?
A: Yes, it is suitable for lead-free soldering processes.
Q12: What is the CTI of Fortron FX530T4?
A: The Comparative Tracking Index (CTI) is 125.
Q13: Is Fortron FX530T4 suitable for thermal shock applications?
A: Yes, it is specifically designed for good thermal shock resistance.
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Sample Policy:
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Samples of Fortron FX530T4 are for laboratory validation tests only, not for production use.
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Buyer bears international sample-shipping freight.
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If bulk-product performance deviates from sample reference, the manufacturer’s official TDS serves as the authoritative benchmark.
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After-Sales Support
| Service | Details |
|---|---|
| Quality Inspection Period | All quality-related claims must be submitted within 7 working days after delivery, supported by test data and photographic evidence. |
| Return / Exchange Policy | Confirmed product defects caused by our side trigger replacement or refund. Terms and conditions apply. |
| Logistics Damage | Report shipping damage directly to carrier immediately upon goods receipt. We assist with claim-document preparation. |
| Technical Support | Remote technical guidance available. On-site troubleshooting can be arranged upon special request. |
| Export Documentation | We supply commercial invoice, packing list, bill of lading, COA, and additional compliance certificates on request. |
Disclaimer
DISCLAIMER: All technical data is referenced from original manufacturer typical values for Fortron FX530T4. Our company acts as supplier/trader rather than original manufacturer. Final performance depends on processing conditions and part design. Buyers shall independently validate product suitability for individual applications. Our firm bears no liability for product failure caused by improper processing or improper usage. Always reference the latest manufacturer official TDS of Fortron FX530T4 as the definitive specification.
