描述
Fortron CES51 N is a 20% glass fiber reinforced polyphenylene sulfide (PPS) injection molding grade from Celanese Corporation. This grade features low chlorine content and offers excellent adhesion to metal with nano molding technology (NMT) treatment .
The “N” in the grade designation indicates this version is specifically optimized for nano molding technology applications, which is the primary difference between Fortron CES51 and Fortron CES51 N . The low chlorine content makes it particularly suitable for consumer electronics applications where halogen contamination can cause corrosion of sensitive components .
As a linear, semi-crystalline PPS, Fortron CES51 N provides high dimensional stability, excellent mechanical properties, creep resistance at high temperatures, a high continuous use temperature (up to 240°C) , and very low moisture absorption (<0.02%) . The material demonstrates excellent resistance to corrosion, hydrolysis, and oxidation .
This grade exhibits excellent chemical resistance to all solvents below 200°C, acids, bases, automotive fuels, and petroleum fluids . The material is RoHS compliant and suitable for precision component applications .
For more PPS grades and technical information, please visit our PPS/Polyphenylene Sulfide product page. You can also explore Celanese’s official Fortron PPS portfolio for additional manufacturer insights.
Key Features of Fortron CES51 N
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20% Glass Fiber Reinforcement – Enhanced mechanical properties and dimensional stability
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Low Chlorine Content – Reduces risk of corrosion in sensitive electronic components
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Excellent Metal Adhesion – Good adhesion to metal with nano molding technology (NMT) treatment
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High Strength – Tensile strength of 110 MPa
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High Stiffness – Tensile modulus of 7,200 MPa; flexural modulus of 7,000 MPa
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Excellent Heat Resistance – HDT of 240°C at 1.80 MPa; melting temperature ~280°C
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Good Impact Resistance – Unnotched Charpy impact of 50 kJ/m²; notched of 17 kJ/m²
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Inherent Flame Retardancy – V-0 flame retardant (halogen-free)
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Excellent Chemical Resistance – Resists solvents, acids, bases, and automotive fuels below 200°C
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Very Low Moisture Absorption – <0.02% water absorption
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Good Dimensional Stability – Low shrinkage: 0.2% parallel, 0.4% transverse
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Volkswagen Approved – Meets Volkswagen unspecified specification
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Global Supply – Available across North America, Europe, Asia Pacific, Latin America, Africa & Middle East
Typical Applications for Fortron CES51 N
| Industry | Typical Components & Considerations |
|---|---|
| Nano Molding Technology (NMT) | Integrated metal-plastic hybrid components – utilizing excellent adhesion to metal with NMT treatment for bonding with aluminum, stainless steel, and magnesium alloys |
| Consumer Electronics | Smartphone frames, antenna brackets, camera module brackets, smartwatch housings – utilizing low chlorine content and NMT capability |
| Connectors & Sockets | Type-C connectors, SIM card slots, memory card sockets – requiring SMT compatibility and dimensional stability |
| Automotive | Under-the-hood components, sensors, pump housings, EGR valves – requiring chemical resistance and heat stability |
| Electrical & Electronics | Relay bases, connector housings with metal inserts, bobbins – requiring good sealing and V-0 flammability |
| Industrial | Pump components, valves, precision mechanical parts – requiring high stiffness and chemical resistance |
Typical Properties of Fortron CES51 N
| Property | Value | Test Method |
|---|---|---|
| Physical | ||
| Density | 1.42 g/cm³ (1420 kg/m³) | ISO 1183 |
| Molding Shrinkage – Parallel | 0.2% | ISO 294-4 |
| Molding Shrinkage – Transverse | 0.4% | ISO 294-4 |
| Mechanical | ||
| Tensile Modulus | 7,200 MPa | ISO 527 |
| Tensile Strength at Break | 110 MPa | ISO 527 |
| Tensile Strain at Break | 2.5% | ISO 527 |
| Flexural Modulus | 7,000 MPa | ISO 178 |
| Flexural Strength | 175-180 MPa | ISO 178 |
| Impact | ||
| Charpy Unnotched Impact (23°C) | 50 kJ/m² | ISO 179/1eU |
| Charpy Notched Impact (23°C) | 17 kJ/m² | ISO 179/1eA |
| Thermal | ||
| HDT @ 1.80 MPa | 240°C | ISO 75-1/-2 |
| Continuous Use Temperature | Up to 240°C | — |
| Processing | ||
| Drying Temperature | 130°C | |
| Drying Time | 2 – 4 hours | |
| Suggested Max Moisture | ≤ 0.02% | |
| Melt Temperature (Optimum) | 330°C | |
| Melt Temperature (Min/Max) | 310-340°C | |
| Mold Temperature (Optimum) | 150°C | |
| Mold Temperature (Min/Max) | 140-160°C | |
| Hold Pressure Range | 30 – 70 MPa | |
| Back Pressure | ≤ 3 MPa |
Important Notes on Typical Data
📌 Values are typical – The data listed above is sourced from manufacturer data sheets for reference only and does not constitute binding product specifications for Fortron CES51 N .
📌 Batch variations – Batch-to-batch deviations may exist. For critical applications, validate performance with batch-specific COA certificates.
📌 Final performance – Actual performance depends on processing conditions and part design. Refer to ISO testing standards for detailed methodology.
📌 Authoritative reference – The manufacturer’s official TDS shall serve as the definitive technical reference for Fortron CES51 N. Request the latest official TDS from our sales team.
Processing Guidelines for Fortron CES51 N
| Step | Process |
|---|---|
| Processing Methods | Injection Molding |
| Drying Recommended | Yes |
| Drying Temperature | 130°C |
| Drying Time | 2 – 4 hours |
| Suggested Max Moisture | ≤ 0.02% |
| Optimum Melt Temperature | 330°C |
| Min. Melt Temperature | 310°C |
| Max. Melt Temperature | 340°C |
| Optimum Mold Temperature | 150°C |
| Min. Mold Temperature | 140°C |
| Max. Mold Temperature | 160°C |
| Hold Pressure Range | 30 – 70 MPa |
| Back Pressure | ≤ 3 MPa |
| Screw Tangential Speed | 0.2 – 0.3 m/s |
| Storage | Store in original, sealed packaging in a cool, dry place away from direct sunlight |
Critical Processing Warnings for Fortron CES51 N
⚠️ Drying Requirement – Fortron CES51 N requires drying prior to processing. Predrying in a dehumidified air dryer at 130°C for 2–4 hours is recommended . The time between drying and processing should be as short as possible.
⚠️ Moisture Control – Maximum residual moisture content should be ≤ 0.02% . Proper drying is essential to prevent void formation and ensure optimal part quality.
⚠️ Melt Temperature – The recommended melt temperature range is 310–340°C, with an optimum of 330°C . Avoid exceeding 340°C to prevent material degradation.
⚠️ Nano Molding Technology – Fortron CES51 N offers excellent adhesion to metal with nano molding technology treatment . For optimal bonding, ensure proper surface treatment of metal inserts (aluminum, stainless steel, magnesium alloys) to create nano-scale pores for mechanical interlocking .
⚠️ Low Chlorine Grade – This grade’s low chlorine content makes it suitable for applications where halogen contamination is a concern .
⚠️ Reinforced Grade – Contains 20% glass fiber reinforcement, which may require consideration for equipment wear and proper screw design.
⚠️ Storage – Store in original, sealed packaging in a cool, dry place away from direct sunlight. For subsequent storage, the material should be stored dry until processed.
Comparison: Fortron CES51 N vs. Fortron CES51
| Feature | Fortron CES51 N | Fortron CES51 |
|---|---|---|
| Glass Fiber Content | 20% | 20% |
| Key Feature | Optimized for NMT applications | Standard low chlorine |
| Primary Application | Nano molding technology, consumer electronics | Consumer electronics |
| Note | The “N” designation indicates optimization for nano molding technology | — |
Related Products
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PPS/Polyphenylene Sulfide – View our full range of PPS products
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Fortron CES51 – 20% glass reinforced low chlorine PPS (standard version)
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Fortron CES 6145 LCG – 45% glass/mineral reinforced low chlorine PPS
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Explore Engineering Plastics – Browse all engineering plastic materials
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About Our Company – Learn more about our supply capabilities and quality assurance
Technical Documents for Fortron CES51 N
| Document Type | Description & Source |
|---|---|
| Manufacturer Official TDS | Complete physical, thermal, and mechanical properties of Fortron CES51 N |
| Manufacturer Official SDS | GHS-compliant safety documentation |
| COA (Certificate of Analysis) | Batch-specific quality certification for Fortron CES51 N |
| UL Yellow Card | UL safety certification |
Request any document above by:
📧 Email: ruiqingchem@gmail.com
📝 Online form: Our contact page
We reply within one working business day. Please clearly state product (Fortron CES51 N) and document type you require.
FAQ about Fortron CES51 N
Q1: What is Fortron CES51 N?
A: Fortron CES51 N is a 20% glass fiber reinforced PPS injection molding grade from Celanese with low chlorine content, offering excellent adhesion to metal with nano molding technology (NMT) treatment .
Q2: What does the “N” in Fortron CES51 N mean?
A: The “N” designation indicates this version is specifically optimized for nano molding technology (NMT) applications .
Q3: What are the key features of Fortron CES51 N?
A: 20% glass reinforcement; low chlorine; excellent adhesion to metal with NMT; tensile strength 110 MPa; tensile modulus 7,200 MPa; HDT 240°C; V-0 flame retardant; excellent chemical resistance .
Q4: What are the typical applications for Fortron CES51 N?
A: Nano molding technology (NMT) applications, consumer electronics (smartphone frames, antenna brackets), connectors, automotive sensors, and industrial components .
Q5: What is the recommended drying condition for Fortron CES51 N?
A: Dry at 130°C for 2–4 hours using a dehumidified air dryer. Maximum residual moisture should be ≤ 0.02% .
Q6: What is the density of Fortron CES51 N?
A: 1.42 g/cm³ (1420 kg/m³) .
Q7: What is the HDT @ 1.80 MPa of Fortron CES51 N?
A: 240°C .
Q8: What regions is Fortron CES51 N available in?
A: North America, Europe, Asia Pacific, Latin America, Africa & Middle East .
Q9: Is Fortron CES51 N flame retardant?
A: Yes, it is inherently flame-retardant (V-0) .
Q10: Is Fortron CES51 N suitable for nano molding technology?
A: Yes, it offers excellent adhesion to metal with nano molding technology treatment .
Q11: What metals can Fortron CES51 N bond with using NMT?
A: It is designed for bonding with aluminum, stainless steel, and magnesium alloys through nano molding technology .
Q12: What is the color of Fortron CES51 N?
A: Black (SD3002) .
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Sample Policy:
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Samples of Fortron CES51 N are for laboratory validation tests only, not for production use.
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Buyer bears international sample-shipping freight.
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If bulk-product performance deviates from sample reference, the manufacturer’s official TDS serves as the authoritative benchmark.
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After-Sales Support
| Service | Details |
|---|---|
| Quality Inspection Period | All quality-related claims must be submitted within 7 working days after delivery, supported by test data and photographic evidence. |
| Return / Exchange Policy | Confirmed product defects caused by our side trigger replacement or refund. Terms and conditions apply. |
| Logistics Damage | Report shipping damage directly to carrier immediately upon goods receipt. We assist with claim-document preparation. |
| Technical Support | Remote technical guidance available. On-site troubleshooting can be arranged upon special request. |
| Export Documentation | We supply commercial invoice, packing list, bill of lading, COA, and additional compliance certificates on request. |
Disclaimer
DISCLAIMER: All technical data is referenced from original manufacturer typical values for Fortron CES51 N . Our company acts as supplier/trader rather than original manufacturer. Final performance depends on processing conditions and part design. Buyers shall independently validate product suitability for individual applications. Our firm bears no liability for product failure caused by improper processing or improper usage. Always reference the latest manufacturer official TDS of Fortron CES51 N as the definitive specification.
