描述
Zytel BM70G20HSLX BK537 PA66 is a 20% glass fiber reinforced polyamide 66 resin developed by Celanese for blow molding applications. Unlike standard injection molding PA66 grades, this material is optimized for producing hollow molded components while maintaining the high strength and heat resistance characteristics of nylon 66.
The 20% glass fiber reinforcement improves stiffness, mechanical strength and dimensional stability, while the heat stabilization system helps maintain performance under elevated temperature conditions. The material also provides good chemical resistance, humidity resistance and durability for demanding industrial environments.
Zytel BM70G20HSLX BK537 is suitable for automotive, appliance, construction and industrial applications where blow molded nylon components require reliable mechanical performance.
Shenzhen Ruiqing International Trade Co., Ltd. supplies original Zytel BM70G20HSLX BK537 PA66 resin, providing material quotation, TDS, SDS and technical support.
Zytel BM70G20HSLX BK537 PA66 Key Features
- 20% glass fiber reinforced PA66
- Heat stabilized formulation
- Blow molding grade
- High mechanical strength
- Good stiffness and toughness balance
- Excellent dimensional stability
- Good creep resistance
- Good chemical resistance
- Good humidity resistance
- Suitable for hollow molded components
Zytel BM70G20HSLX BK537 PA66 Typical Applications
- Automotive air ducts
- Automotive fluid reservoirs
- Engine compartment components
- Industrial hollow parts
- Appliance components
- Protective housings
- Structural blow molded parts
Advantages
Zytel BM70G20HSLX BK537 combines the performance advantages of PA66 with blow molding capability.
Compared with unreinforced nylon materials, the 20% glass fiber reinforcement improves rigidity, strength and dimensional accuracy. The heat stabilized formulation enables long-term use in higher temperature environments.
This grade is suitable for applications requiring lightweight hollow structures with engineering plastic performance.
Related Products
Zytel BM70G20HSLX BK537 PA66 Typical Properties
| Property | Dry | Conditioned |
|---|---|---|
| Material | PA66-GF20 | PA66-GF20 |
| Grade | BM70G20HSLX BK537 | BM70G20HSLX BK537 |
| Color | Black | Black |
| Glass Fiber Content | 20% | 20% |
| Density | 1.25 g/cm³ | — |
| Tensile Modulus | 6500 MPa | 4000 MPa |
| Tensile Strength at Break | 120 MPa | 75 MPa |
| Tensile Strain at Break | 4% | 13% |
| Flexural Modulus | 6000 MPa | 3600 MPa |
| Charpy Impact Strength | 80 kJ/m² | 80 kJ/m² |
| Melting Temperature | 260–262°C | — |
| Processing Method | Blow Molding | Blow Molding |
Processing Recommendations
Drying Conditions
| Item | Recommended Value |
|---|---|
| Drying Temperature | 80°C |
| Drying Time | 2–4 h |
| Processing Moisture | ≤0.20% |
Processing Conditions
| Item | Recommended Value |
|---|---|
| Melt Temperature | 285–305°C |
| Optimum Melt Temperature | 295°C |
| Drying Temperature | 80°C |
| Blow Molding Process | Suitable |
Celanese Zytel PA Official Website
Zytel BM70G20HSLX BK537 PA66 FAQ
What is Zytel BM70G20HSLX BK537 PA66?
Zytel BM70G20HSLX BK537 is a 20% glass fiber reinforced heat stabilized PA66 resin designed specifically for blow molding applications.
What does GF20 mean?
GF20 means the material contains approximately 20% glass fiber reinforcement, improving stiffness, strength and dimensional stability.
What does HSLX mean?
HSLX indicates a heat stabilized formulation designed for improved long-term thermal performance and durability.
Is Zytel BM70G20HSLX BK537 suitable for injection molding?
This grade is primarily designed for blow molding applications rather than conventional injection molding.
What are the advantages of glass fiber reinforced PA66?
Glass fiber reinforcement improves mechanical strength, rigidity, creep resistance and dimensional stability compared with unfilled PA66.
Can original Zytel BM70G20HSLX BK537 be supplied?
Yes. Shenzhen Ruiqing International Trade Co., Ltd. supplies original Zytel PA66 materials with TDS, SDS, quotation support and delivery service.
