Fortron 0203 – Very Easy Flow PPS for Compounding & Extrusion

基础信息

品名
Fortron 0203
牌号
0203
厂商
Celanese Corporation
材料类型
Unfilled Polyphenylene Sulfide (PPS)
产品形态
Pellets, Granular Powder
特点
Very easy flow; excellent chemical resistance and thermal stability; low viscosity; intended for compounding and extrusion applications not requiring high melt strength; good electrical properties

描述

Fortron 0203 is a very easy flow, unfilled polyphenylene sulfide (PPS) grade from Celanese Corporation . This grade demonstrates excellent chemical resistance and thermal stability. It is intended for extrusion applications that do not require high melt strength and for compounding with various fillers .

Fortron 0203 is available as Fortron 0203B6 (granular powder) and 0203P6 (pellets) . The material exhibits a low viscosity, making it particularly suitable for applications requiring excellent flow characteristics. Physical property data is determined using test methods established by ISO, the globally recognized standards organization.

For more PPS grades and technical information, please visit our Engineering Plastics product page.

Key Features of Fortron 0203 Resin

  • Very Easy Flow – Low viscosity for excellent processability in compounding and extrusion 

  • Excellent Chemical Resistance – Resists acids, bases, and many solvents 

  • Thermal Stability – High melting temperature of 280°C 

  • Unfilled Grade – Suitable for compounding with various fillers and reinforcements 

  • Good Electrical Properties – Volume resistivity of 1×10⁹ Ω·m 

  • Low Moisture Absorption – 0.02% water absorption 

  • Heat Stabilized – Designed for melt blown processing 

  • Versatile Processing – Suitable for injection molding and extrusion 

  • Low Viscosity – Intended for applications requiring easy flow 

Typical Applications for Fortron 0203 Resin

Industry Typical Components & Considerations
Compounding Base resin for compounding with fillers and reinforcements 
Extrusion Melt blown extrusion applications 
Automotive Under-the-hood components, clips, fasteners 
Electrical & Electronics Components requiring chemical resistance and thermal stability
Chemical Processing Parts exposed to aggressive chemicals

Typical Properties of Fortron 0203 Resin

Property Value Test Method
Physical
Density 1.35 – 1.40 g/cm³ ISO 1183 
Water Absorption (24 hrs) 0.01% ASTM D570 
Water Absorption (Saturation) 0.02% ISO 62 
Mechanical
Tensile Modulus 4200 MPa ISO 527 
Tensile Stress at Break 33 MPa ISO 527 
Tensile Strain at Break 1% ISO 527 
Flexural Modulus 3900 – 4100 MPa ISO 178 
Flexural Strength 140 MPa ISO 178 
Impact
Notched Izod Impact (23°C) 2 kJ/m² ISO 180/1A 
Unnotched Izod Impact (23°C) 8 kJ/m² ISO 180/1U 
Thermal
Melting Temperature 280°C ISO 11357 
Glass Transition Temperature 90°C ISO 11357 
HDT @ 1.80 MPa 120°C ISO 75 
HDT @ 8.00 MPa 95°C ISO 75 
CTE, Parallel 55 × 10⁻⁶/K ISO 11359 
CTE, Transverse 53 × 10⁻⁶/K ISO 11359 
Electrical
Volume Resistivity 1×10⁹ Ω·m IEC 62631 
Dielectric Strength 17 kV/mm IEC 60243 
Relative Permittivity (1MHz) 4 IEC 62631 
Dissipation Factor (1MHz) 84 × 10⁻⁴ IEC 62631 
Comparative Tracking Index (CTI) 100 IEC 60112 

Important Notes on Typical Data:

Values listed are typical and sourced from manufacturer data sheets . They do not constitute binding product specification.

Batch-to-batch deviations may exist. For critical applications, validate performance with batch-specific COA certificate.

Final performance depends on processing conditions and part design.

Manufacturer official TDS shall serve as definitive technical reference. Request the latest official TDS from our sales team.

Processing Guidelines for Fortron 0203 Resin

Step Process
Processing Methods Injection molding, extrusion (compounding, melt blown) 
Drying Recommended Yes 
Drying Temperature 110°C 
Drying Time 2 – 4 hours 
Suggested Max Moisture ≤ 0.02% 
Optimum Melt Temperature 315°C 
Min. Melt Temperature 275°C 
Max. Melt Temperature 320°C 
Screw Tangential Speed 0.2 – 0.3 m/s 
Storage Store in original, sealed packaging in a cool, dry place away from direct sunlight

Critical Processing Warnings:

Drying: Fortron 0203 requires drying prior to processing. Dry at 110°C for 2–4 hours. The time between drying and processing should be as short as possible .

Moisture Control: Maximum residual moisture content should be ≤ 0.02%. Use of dry air dryers with dew point ≤ -30°C is recommended .

Low Viscosity: This grade has very easy flow characteristics, which may require adjusted processing parameters for optimal results .

Storage: Store in original, sealed packaging in a cool, dry place away from direct sunlight. For subsequent storage, the material should be stored dry in the dryer until processed (≤ 60 hours) .

Related Products

Explore Engineering Plastics – Browse all engineering plastic materials

About Our Company – Learn more about our supply capabilities and quality assurance

Technical Documents for Fortron 0203 Resin

Document Type Description & Source
Manufacturer Official TDS Complete physical, thermal, and mechanical properties of Fortron 0203
Manufacturer Official SDS GHS-compliant safety documentation
COA (Certificate of Analysis) Batch-specific quality certification
UL Yellow Card UL safety certification

Request any document above by:

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Online form: Our contact page

We reply within one working business day. Please clearly state product (Fortron 0203) and document type you require.

FAQ about Fortron 0203 Resin

Q1: What is Fortron 0203?
A: Fortron 0203 is a very easy flow, unfilled polyphenylene sulfide (PPS) grade from Celanese Corporation. It demonstrates excellent chemical resistance and thermal stability, intended for extrusion and compounding applications .

Q2: What are the key features of Fortron 0203?
A: Very easy flow, low viscosity, excellent chemical resistance, thermal stability (melting point 280°C), unfilled grade suitable for compounding, good electrical properties, and low moisture absorption .

Q3: What are the typical applications for Fortron 0203?
A: Compounding with various fillers, melt blown extrusion, and automotive under-the-hood components .

Q4: What is the melting temperature of Fortron 0203?
A: The melting temperature is 280°C .

Q5: What is the recommended drying condition for Fortron 0203?
A: Dry at 110°C for 2–4 hours with maximum moisture content ≤ 0.02% .

Q6: What is the density of Fortron 0203?
A: The density is 1.35–1.40 g/cm³ .

Q7: Is Fortron 0203 suitable for compounding?
A: Yes, Fortron 0203 is intended for compounding with various fillers and reinforcements .

Q8: What regions is Fortron 0203 available in?
A: North America, Europe, Latin America, Africa & Middle East .

Q9: What is the difference between Fortron 0203B6 and 0203P6?
A: Fortron 0203B6 is granular powder form, while 0203P6 is pellet form .

Q10: What is the CTI rating of Fortron 0203?
A: The Comparative Tracking Index (CTI) is 100 .

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After-Sales Support

Service Details
Quality Inspection Period All quality-related claims must be submitted within 7 working days after delivery, supported by test data and photographic evidence.
Return / Exchange Policy Confirmed product defects caused by our side trigger replacement or refund. Terms and conditions apply.
Logistics Damage Report shipping damage directly to carrier immediately upon goods receipt. We assist with claim-document preparation.
Technical Support Remote technical guidance available. On-site troubleshooting can be arranged upon special request.
Export Documentation We supply commercial invoice, packing list, bill of lading, COA, and additional compliance certificates on request.

Disclaimer

DISCLAIMER: All technical data is referenced from original manufacturer typical values for Fortron 0203. Our company acts as supplier/trader rather than original manufacturer. Final performance depends on processing conditions and part design. Buyers shall independently validate product suitability for individual applications. Our firm bears no liability for product failure caused by improper processing or improper usage. Always reference the latest manufacturer official TDS of Fortron 0203 as the definitive specification.

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