描述
MacDermid Alpha Micromax 5440 Platable Carbon Conductive Paste for Chip Resistor Sulfur Protection
Type: Platable Carbon Conductive Paste
Application: Sulfur-Proof Layer
Solids: 50%
Shelf Life: 3 months refrigerated
Micromax 5440 is a polymer-based, platable carbon paste applied over fired-on silver to provide a sulfur-proof layer for chip components. It delivers excellent adhesion on both fired silver and alumina substrates, good pliability, and good printability, and can be electroplated in conventional processes.
Micromax 5440 from MacDermid Alpha is a polymer-based, platable carbon paste printable on a variety of substrates. In chip component builds it is typically applied over fired-on silver, where it acts as a sulfur-proof layer. The composition offers excellent adhesion on both fired silver and alumina substrates, plus good pliability and good printability, which support reliable coverage over the underlying silver termination. The formulation is cadmium, lead, nickel, and phthalate free.
The paste carries 50% solids and a viscosity range of 80–120 Pa.s. Micromax 9245 is the listed solvent or thinner. Substrates are 96% alumina and glass. Print with a 200 mesh stainless steel screen with 30–35 μm emulsion to a cured thickness of 10–15 μm. Allow wet prints to level for 5 minutes at room temperature, then dry at 150°C for 10 minutes in a well-ventilated oven or belt dryer. Drying can be skipped and the part directly cured, depending on the application. The composition is best cured at 200°C for 30 minutes. Chips terminated with 5440 and processed as recommended can be electroplated in conventional processes. Store refrigerated at 0–5°C; unopened shelf life is 3 months from date of shipment.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5440 platable carbon conductive paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5440
- Platable carbon conductive paste, polymer-based formulation
- Applied over fired-on silver to provide a sulfur-proof layer for chip components
- Excellent adhesion on both fired silver and alumina substrates
- Good pliability for reliable coverage around chip terminations
- Good printability for consistent deposition
- Cadmium, lead, nickel, and phthalate free (no intentional addition)
- Solids 50% for stable deposition
- Viscosity 80–120 Pa.s for consistent screen printing
- Screen: 200 mesh stainless steel, 30–35 μm emulsion; cured thickness 10–15 μm
- Curing: 200°C for 30 minutes
- Electroplatable in conventional processes
- Thinner Micromax 9245; substrates 96% alumina and glass
Primary Applications
- Chip component sulfur protection — carbon layer over fired silver terminations
- Resistor termination — per TDS application field
- Electroplating lines — chips terminated with 5440 can be electroplated conventionally
- Alumina and glass substrates — where adhesion and pliability matter
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Platable carbon conductive paste | TDS: Carbon Conductive Composition |
| Application | Resistor termination | TDS: Resistor termination |
| Solvent or Thinner | Micromax 9245 | TDS: Micromax 9245 |
| Solid Content | 50 % | TDS: 50 % |
| Viscosity | 80 to 120 Pa.s | TDS: Brookfield RVT, #14 spindle, UC&S, 10 rpm, 25°C |
| Mask Mesh | 200 | TDS: 200 |
| Mask Emulsion | 30 to 35 μm | TDS: 30 to 35 μm |
| Substrate Compatibility | 96% alumina, glass | TDS: 96% alumina, glass |
| Cured Thickness | 10 to 15 μm | TDS: 10-15 μm cured |
| Leveling Time | 5 minutes at room temperature | TDS: 5 minutes |
| Drying Schedule | 10 minutes at 150°C (may be skipped depending on application) | TDS: 10 min at 150°C |
| Curing Schedule | 200°C for 30 minutes | TDS: 200°C for 30 minutes |
| Plating | Electroplatable in conventional processes | TDS: Plating |
| Cadmium, Lead, Nickel, Phthalate Free | Yes (no intentional addition) | TDS: Product benefits |
| Shelf Life | 3 months | TDS: 3 months |
| Storage Temperature | 0 to 5 °C refrigerated | TDS: 0°C – 5°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium, Lead, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Screen Mesh | 200 mesh stainless steel with 30–35 μm emulsion | TDS: 200 mesh, 30-35 μm |
| Cured Thickness | 10–15 μm | TDS: 10-15 μm cured |
| Leveling | 5 minutes at room temperature | TDS: 5 minutes |
| Drying | 150°C for 10 minutes in well-ventilated oven or belt dryer; may be skipped depending on application | TDS: 150°C for 10 min |
| Curing | 200°C for 30 minutes | TDS: 200°C for 30 min |
| Plating | Chips terminated with 5440 can be electroplated in conventional processes | TDS: Plating |
| Thinner | Micromax 9245 | TDS: Micromax 9245 |
| Substrates | 96% alumina, glass | TDS: 96% alumina, glass |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at refrigerated temperature between 0°C and 5°C. Room temperature storage is not recommended. | TDS: 0°C – 5°C |
| Shelf Life | 3 months in unopened containers from date of shipment. | TDS: 3 months |
| Ageing Behavior | Gradual polymerization with viscosity increase and mechanical separation can be expected over a few months. | TDS: Storage and shelf life |
| Refrigerated Handling | Allow material to equilibrate to room temperature before opening to prevent moisture pickup from condensation. | TDS: Storage and shelf life |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5440 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
How does 5440 provide sulfur protection?
The TDS states that 5440 is usually applied over fired-on silver to provide a sulfur-proof layer for chip components. The carbon layer shields the underlying silver from sulfur attack in the operating environment.
Can the drying step be skipped with 5440?
Yes. The TDS notes that the drying process can be skipped and the part directly cured, depending on the application. When drying is used, it is 10 minutes at 150°C in a well-ventilated oven or belt dryer.
Does 5440 need to be refrigerated?
Yes. The TDS recommends storage at refrigerated temperature between 0°C and 5°C. Room temperature storage is not recommended. Allow the material to equilibrate to room temperature before opening to prevent moisture pickup from condensation.
How should 5440 be cured?
The TDS recommends curing at 200°C for 30 minutes. Variation in curing temperature and/or time at temperature may result in variation in the final properties.
Can 5440 be electroplated?
Yes. The TDS states that chips terminated with Micromax 5440 and processed as recommended can be electroplated in conventional processes.
Is 5440 free of cadmium, lead, nickel and phthalate?
Per the TDS, cadmium, lead, nickel, and phthalate are not intentional ingredients and are not intentionally added. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
What thinner and substrates are recommended for 5440?
Micromax 9245 is the listed solvent or thinner. Substrates are 96% alumina and glass. A 200 mesh stainless steel screen with 30–35 μm emulsion gives a cured thickness of 10–15 μm.
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We supply authentic MacDermid Alpha Micromax 5440 platable carbon conductive paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium, Lead, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
