描述
MacDermid Alpha Micromax 5426 Thinner Print Platable Ag/Pd Termination for Chip Resistors
Type: Platable Ag/Pd Termination
Application: Chip Resistor
Screen: 250 mesh
Shelf Life: 6 months
Micromax 5426 is a platable silver/palladium termination for chip resistors requiring low cost and high performance. It delivers excellent post-plating adhesion, high acid resistance, thinner prints, a dense fired film, and fast firing on an 850°C / 30 min profile. Cadmium-free, and co-fireable with Micromax 00X0A chip resistors.
Micromax 5426 from MacDermid Alpha is a platable silver/palladium termination paste developed specifically for chip resistor applications that need low cost and high performance. It supports thinner prints, which helps reduce material usage per part without giving up post-plating adhesion or acid resistance. The fired film is dense and the paste is co-fireable with Micromax 00X0A chip resistors. The formulation is cadmium-free, and lead and cadmium are not intentionally added.
The paste has a viscosity range of 200–280 Pa.s and uses Micromax 8250(T) as the recommended thinner. Reported properties are based on 96% alumina substrates, printed with a 250 mesh stainless steel screen with approximately 10 μm emulsion to a dried thickness of 20 ± 2 μm. Allow prints to level at room temperature for 5–10 minutes, then dry at 150°C for 10 minutes. Fire using a 30-minute cycle with 10 minutes at a peak of 850°C. Arcosolv PNP (1-propoxy, 2-propanol), a non-CFC alternative, is the recommended clean-up solvent. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5426 platable Ag/Pd termination paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5426
- Platable silver/palladium termination for chip resistor applications
- Excellent post-plating adhesion for reliable plating results
- High acid resistance for demanding plating processes
- Thinner prints to reduce material usage per part
- Dense fired film for reliable termination performance
- Fast firing: 850°C / 30 min profile
- Cadmium-free formulation (no intentional addition)
- Co-fireable with Micromax 00X0A chip resistors
- Viscosity 200–280 Pa.s for stable screen printing
- Screen: 250 mesh stainless steel, ~10 μm emulsion; dried print 20 ± 2 μm
- Thinner Micromax 8250(T); clean-up Arcosolv PNP
- Substrate 96% alumina
Primary Applications
- Chip resistor edge termination — platable Ag/Pd termination layer
- Resistor termination — per TDS application field
- Co-fired chip resistor builds — compatible with Micromax 00X0A resistors
- Cost-sensitive chip resistor production — thinner prints reduce material consumption
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Platable silver/palladium termination paste | TDS: Silver/Palladium |
| Application | Resistor termination | TDS: Resistor termination |
| Solvent or Thinner | Micromax 8250(T) | TDS: Micromax 8250(T) |
| Viscosity | 200 to 280 Pa.s | TDS: Brookfield HBT, UC&SP, 10 rpm, 25°C±1°C |
| Mask Mesh | 250 | TDS: 250 |
| Mask Emulsion | 10 μm | TDS: 10 μm |
| Dried Print Thickness | 20 ± 2 μm | TDS: 20±2 μm |
| Leveling Time | 5 to 10 minutes at room temperature | TDS: 5-10 minutes |
| Drying | 150°C for 10 minutes | TDS: 150°C for 10 minutes |
| Firing Profile | 30-minute cycle with 10 minutes at 850°C peak | TDS: 850°C x 10 min, 30 min cycle |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Clean-up Solvent | Arcosolv PNP (1-propoxy, 2-propanol), non-CFC alternative recommended; traditional cleaners also work | TDS: Arcosolv PNP |
| Cadmium Free | Yes (no intentional addition) | TDS: Product benefits |
| Co-fireable | Micromax 00X0A chip resistors | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Lead and cadmium free” as used herein means these substances are not intentionally added to the referenced product. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Thoroughly mix to redisperse solids | TDS: thoroughly mix |
| Screen Mesh | 250 mesh stainless steel with approx. 10 μm emulsion | TDS: 250 mesh, 10 μm |
| Dried Print Thickness | 20 ± 2 μm | TDS: 20±2 μm |
| Leveling | 5–10 minutes at room temperature | TDS: 5-10 minutes |
| Drying | 150°C for 10 minutes | TDS: 150°C for 10 min |
| Firing | 30-minute cycle, 10 min at 850°C peak | TDS: 850°C x 10 min, 30 min cycle |
| Thinner | Micromax 8250(T) | TDS: Micromax 8250(T) |
| Clean-up Solvent | Arcosolv PNP (1-propoxy, 2-propanol), non-CFC alternative | TDS: Arcosolv PNP |
| Substrates | 96% alumina; other compositions may vary | TDS: 96% alumina |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5426 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
What does “thinner prints” mean for 5426?
The TDS lists thinner prints as a product benefit. Combined with a 250 mesh screen and 20 ± 2 μm dried print thickness, thinner prints help reduce material consumption per part without sacrificing post-plating adhesion or acid resistance.
Can 5426 be co-fired with Micromax chip resistors?
Yes. The TDS lists 5426 as co-fireable with Micromax 00X0A chip resistors. This lets both the resistor and the termination fire together in a single cycle, which simplifies the process flow.
Why is Arcosolv PNP recommended for clean-up?
Arcosolv PNP (1-propoxy, 2-propanol) is a non-CFC alternative recommended in the TDS. Traditional cleaners also work with 5426, but Arcosolv PNP supports non-CFC cleaning processes.
How does 5426 handle post-plating steps?
The TDS lists excellent post-plating adhesion and high acid resistance as product benefits. Both matter when the termination goes through plating chemistries, where poor adhesion or low acid resistance can cause defects.
What screen configuration is recommended for 5426?
A 250 mesh stainless steel screen with approximately 10 μm emulsion, printed to a dried thickness of 20 ± 2 μm. Reported properties are based on 96% alumina substrates.
Is 5426 free of lead and cadmium?
Per the TDS, lead and cadmium are not intentionally added to 5426. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
What thinner should be used with 5426?
Micromax 8250(T) is the listed solvent or thinner. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.
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We supply authentic MacDermid Alpha Micromax 5426 platable Ag/Pd termination paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Lead and cadmium free” as used herein means these substances are not intentionally added to the referenced product. Trace amounts may be present.
