MacDermid Alpha Micromax 5775 Au and Al Wire Bondable Gold Conductor for Multilayer Dielectrics

基础信息

品名
MacDermid Alpha Micromax 5775 Au and Al Wire Bondable Gold Conductor
牌号
Micromax 5775
厂商
Element Solutions/MacDermid Alpha
材料类型
Gold Conductor
产品形态
Paste
特点
Cadmium free (no intentional addition); Au and Al wire bondable; Outstanding aged adhesion of aluminum wire bonds distinguishes it from other aluminum wire bondable products; For use over 96% alumina and multilayer dielectrics

描述




MacDermid Alpha Micromax 5775 Au and Al Wire Bondable Gold Conductor for Multilayer Dielectrics

Product: Micromax 5775
Type: Au and Al Wire Bondable Gold Conductor
Application: 96% Alumina, Multilayer Dielectrics
Viscosity: 240–400 Pa.s
Shelf Life: 6 months

⚡ Au and Al Wire Bondable Gold Conductor with Outstanding Aged Al Wire Adhesion
Micromax 5775 is a cadmium-free, screen printable gold conductor used as a gold and aluminum wire bondable conductor over 96% alumina and multilayer dielectrics. Outstanding aged adhesion of aluminum wire bonds distinguishes it from other aluminum wire bondable products. Fires at 850°C peak for 10 minutes on a 60-minute cycle with stable performance after multiple refirings.

Micromax 5775 from MacDermid Alpha is a cadmium-free, screen printable gold conductor developed for gold and aluminum wire bonding applications over 96% alumina and multilayer dielectrics. Its key differentiator is outstanding aged adhesion of aluminum wire bonds, which sets it apart from other aluminum wire bondable products and matters for hybrid circuits that must maintain bond integrity over extended service life. The conductor works over both bare alumina and multilayer dielectric stacks, giving flexibility in high-reliability hybrid design. The composition is cadmium free, with cadmium not intentionally added.

The paste has a viscosity range of 240–400 Pa.s and uses Micromax 8672 as the recommended solvent or thinner. Reported properties are based on 96% alumina substrates. A 325 mesh stainless steel screen with 12 μm (0.5 mil) emulsion thickness is recommended, with printing speeds up to 15 cm/s (6 in/s). Recommended film thickness is 7–10 μm, with print resolution of 100 μm using special screens designed for fine line printing. Theoretical coverage is 50–80 cm²/g at 10 μm fired thickness. Allow the wet print to level 10–15 minutes at room temperature, then dry at 150°C for 15 minutes. Fire dried prints in a belt furnace on a 60-minute cycle with a peak temperature of 850°C for 10 minutes. No significant changes in performance characteristics were seen after multiple refirings at 850°C. Store sealed at 5–30°C; unopened shelf life is 6 months.

Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5775 gold conductor paste. Original factory TDS and batch-specific COA are available on request for your high-density hybrid programs.

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Complete TDS, COA, and regulatory documentation available

Key Features of MacDermid Alpha Micromax 5775

  • Cadmium-free, screen printable gold conductor
  • Au and Al wire bondable
  • Outstanding aged adhesion of aluminum wire bonds
  • Developed for use over 96% alumina and multilayer dielectrics
  • Stable after multiple refirings at 850°C
  • Viscosity 240–400 Pa.s for stable screen printing
  • Screen: 325 mesh stainless steel with 12 μm (0.5 mil) emulsion
  • Printing speeds up to 15 cm/s (6 in/s)
  • Recommended film thickness 7–10 μm
  • Print resolution 100 μm using fine-line screens
  • Drying: 150°C for 15 minutes after 10–15 minutes leveling
  • Firing: 60-minute cycle, 850°C peak for 10 minutes; thinner Micromax 8672

Primary Applications

  • High reliability Au conductor — per TDS application field
  • Au and Al wire bonding — 1-mil and 2-mil class hybrid circuits
  • Circuits over 96% alumina — bare ceramic substrates
  • Circuits over multilayer dielectrics — where the conductor sits above dielectric layers

Full Technical Specifications

Property Typical Value TDS Reference
Product Type Cadmium-free gold conductor TDS: Gold Conductor
Application High reliability Au conductor TDS: High reliability Au conductor
Solvent or Thinner Micromax 8672 TDS: Micromax 8672
Viscosity 240 to 400 Pa.s TDS: Brookfield 2xHAT, UC&SP, SC4-14/6R, 10 rpm, 25°C
Mask Mesh 325 TDS: 325
Mask Emulsion 12 μm (0.5 mil) TDS: 12 μm
Drying Time 15 minutes TDS: 15 min
Drying Temperature 150 °C TDS: 150 °C
Theoretical Coverage 50 to 80 cm²/g TDS: 50 to 80 cm²/g (@10μm fired thickness)
Recommended Film Thickness 7 to 10 μm TDS: 7 to 10 μm
Print Resolution 100 μm TDS: 100 μm using special fine-line screens
Substrate Compatibility 96% alumina; multilayer dielectrics TDS: 96% alumina; multilayer dielectrics
Screen Type 325 mesh stainless steel with 12 μm (0.5 mil) emulsion TDS: 325 mesh, 12 μm
Printing Speed Up to 15 cm/s (6 in/s) TDS: 15 cm/s (6 in/s)
Leveling Time 10 to 15 minutes at room temperature TDS: 10 to 15 min
Firing Profile 60-minute cycle, 850°C peak for 10 minutes TDS: 60 min cycle, 850°C for 10 min
Refiring Stability No significant changes after multiple refirings at 850°C TDS: Firing
Wire Bonding Au and Al wire bondable TDS: Product Description
Aged Al Wire Bond Adhesion Outstanding; distinguishes 5775 from other Al wire bondable products TDS: Product Description
Cadmium Free Yes (no intentional addition) TDS: Product Description
Shelf Life 6 months TDS: 6 months
Storage Temperature 5 – 30 °C TDS: 5°C – 30°C

Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.

Recommended Processing Conditions

Parameter Recommended Value TDS Reference
Mixing Prior to Use Thoroughly mix to redisperse solids TDS: thoroughly mix
Screen Mesh 325 mesh stainless steel with 12 μm (0.5 mil) emulsion TDS: 325 mesh, 12 μm
Printing Speed Up to 15 cm/s (6 in/s) TDS: 15 cm/s (6 in/s)
Recommended Film Thickness 7 to 10 μm TDS: 7 to 10 μm
Leveling 10–15 minutes at room temperature TDS: 10-15 minutes
Drying 150°C for 15 minutes TDS: 150°C for 15 min
Firing 60-minute cycle, 850°C peak for 10 minutes, belt furnace TDS: 60 min cycle, 850°C for 10 min
Refiring Stable after multiple refirings at 850°C TDS: Firing
Thinner Micromax 8672 TDS: Micromax 8672

Handling and Storage Recommendations

Storage Rules Store tightly sealed in a clean, stable environment at 5-30°C. TDS: 5°C – 30°C
Shelf Life 6 months in unopened containers from date of shipment. TDS: 6 months
Pre-use Preparation Thoroughly mix prior to use. Some settling of solids may occur during storage. TDS: thoroughly mix
Transportation Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. TDS: normal shipping conditions

Official Technical Documentation

Document Type Document Introduction Document Request
TDS MacDermid Alpha Micromax 5775 original factory technical data sheet Request TDS
COA Batch-specific certificate of analysis Request COA
SDS Safety Data Sheet for handling and storage Request SDS

Frequently Asked Questions

What sets 5775 apart from other Al wire bondable products?

The TDS states that outstanding aged adhesion of aluminum wire bonds distinguishes 5775 from other aluminum wire bondable products. This matters for hybrid circuits that must maintain bond integrity over extended service life, especially where Al wire bonding is used.

Where can 5775 be used in a hybrid build?

5775 is used over 96% alumina and multilayer dielectrics, so it can serve as the Au/Al wire bondable conductor both on bare ceramic substrates and on top of dielectric stacks in high-reliability hybrid circuits.

What film thickness and print resolution does 5775 offer?

Recommended film thickness is 7–10 μm, with theoretical coverage of 50–80 cm²/g at 10 μm fired thickness. Print resolution is 100 μm when using special screens designed for fine line printing.

What firing profile does 5775 use?

Fire dried prints in a belt furnace on a 60-minute cycle with a peak temperature of 850°C for 10 minutes. No significant changes in performance characteristics were seen after multiple refirings at 850°C.

What screen setup works with 5775?

A 325 mesh stainless steel screen with 12 μm (0.5 mil) emulsion thickness is recommended. Printing speeds up to 15 cm/s (6 in/s) can be achieved.

Is 5775 cadmium free?

Per the TDS, cadmium is not intentionally added to 5775. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.

How should 5775 be stored?

Store tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.

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We supply authentic MacDermid Alpha Micromax 5775 gold conductor paste for high-density hybrid programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.

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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.

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