MacDermid Alpha Micromax 5499A Fast-Curing Black Thermoset Encapsulant for Hybrid Circuits & Chip Components

基础信息

品名
MacDermid Alpha Micromax 5499A Fast-Curing Black Thermoset Encapsulant
牌号
Micromax 5499A
厂商
Element Solutions/MacDermid Alpha
材料类型
Thermoset Epoxy Encapsulant
产品形态
Paste
特点
Halogen Free (per IEC 61249-2-21); Thermoset process (180°C, 5 min); High adhesion; Non use of Pb/Cd component as designed; Black color prior to and after curing; Co-curing process with edge termination/encapsulant/marking is possible; Lead, Cadmium, Nickel and Phthalate free (no intentional addition)

描述




MacDermid Alpha Micromax 5499A Fast-Curing Black Thermoset Encapsulant for Hybrid Circuits & Chip Components

Product: Micromax 5499A
Type: Thermoset Epoxy Encapsulant
Application: Hybrid Circuits, Chip Components
Color: Black
Solids: 73–83%
Shelf Life: 3 months refrigerated

⚡ Fast-Curing Black Thermoset Encapsulant with 5-Minute Cure at 180°C
Micromax 5499A is a black thermoset epoxy encapsulant for hybrid circuits, resistor networks, and chip components. It offers shorter curing time at 180°C (5 minutes) with improved printability compared to Micromax 5499. Halogen free, with lead, cadmium, nickel, and phthalate not intentionally added. Co-curing with edge termination, encapsulant, and marking is possible.

Micromax 5499A from MacDermid Alpha is a black thermoset epoxy encapsulant intended for encapsulation on hybrid circuits, resistor networks, and chip components. It is designed as a faster-curing variant of Micromax 5499, with a cure schedule of 180°C for just 5 minutes instead of 20–30 minutes. Printability is also improved over 5499. The polymer is applied to ceramic substrates by screen printing and cured to a black film that stays black both before and after curing. Lead and cadmium components are not used by design, and the product is halogen free per IEC 61249-2-21. A key feature is that co-curing with edge termination, encapsulant, and marking is possible, which can consolidate process steps in hybrid circuit production.

The paste carries 73–83% solids and uses Micromax 8779 as the recommended thinner and clean-up solvent. Allow prints to level 5–10 minutes at room temperature, then dry at 150°C for 10 minutes. Cure at 180°C for 5 minutes; conditions should be optimized for the type of dryer used. As with other 5499-series products, thorough mixing before use is recommended to redisperse any settled solids. Store refrigerated at 0–5°C; unopened shelf life is 3 months from date of shipment.

Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5499A black thermoset epoxy encapsulant. Original factory TDS and batch-specific COA are available on request for your hybrid circuit and chip component programs.

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Complete TDS, COA, and regulatory documentation available

Key Features of MacDermid Alpha Micromax 5499A

  • Black, single-component thermoset epoxy encapsulant
  • Fast cure at 180°C for 5 minutes
  • Improved printability compared to Micromax 5499
  • Halogen free per IEC 61249-2-21
  • Co-curing process possible with edge termination, encapsulant, and marking
  • Black color prior to and after curing for consistent appearance
  • High adhesion on ceramic substrates
  • Non-use of Pb/Cd component as designed
  • Lead, cadmium, nickel, and phthalate free (no intentional addition)
  • Solids 73–83% for higher film build
  • Thinner and clean-up solvent: Micromax 8779
  • Refrigerated storage at 0–5°C; 3-month shelf life unopened

Primary Applications

  • Hybrid circuit encapsulation — protective layer over hybrid circuit assemblies
  • Resistor networks — encapsulation for network-type resistor components
  • Chip components — encapsulation for chip-type electronic components
  • Fast-cure production lines — 5-minute cure at 180°C for high throughput

Full Technical Specifications

Property Typical Value TDS Reference
Product Type Thermoset epoxy encapsulant TDS: Polymer Encapsulant Composition
Application Encapsulant TDS: Encapsulant
Color Black TDS: Black
Solvent or Thinner Micromax 8779 TDS: Micromax 8779
Solid Content 73 to 83 % TDS: 73 to 83 %
Leveling Time 5 to 10 minutes at room temperature TDS: 5-10 minutes
Drying Schedule 10 minutes at 150°C TDS: 150°C for 10 min
Curing Schedule 180°C for 5 minutes TDS: 180°C for 5 min
Halogen Free Yes (per IEC 61249-2-21) TDS: Product benefits
Co-Curing Process Possible with edge termination, encapsulant, and marking TDS: Product benefits
Lead, Cadmium, Nickel, Phthalate Free Yes (no intentional addition) TDS: Product benefits
Shelf Life 3 months TDS: 3 months
Storage Temperature 0 to 5 °C refrigerated TDS: 0°C – 5°C

Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Halogen free” per IEC 61249-2-21; trace amounts may be present. “Lead, Cadmium, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.

Recommended Processing Conditions

Parameter Recommended Value TDS Reference
Mixing Prior to Use Thoroughly mix to redisperse solids TDS: thoroughly mix
Thinning Not normally required; Micromax 8779 for minor adjustment TDS: Micromax 8779
Leveling 5–10 minutes at room temperature TDS: 5-10 minutes
Drying 150°C for 10 minutes TDS: 150°C for 10 min
Curing 180°C for 5 minutes TDS: 180°C for 5 min
Clean-up Solvent Micromax 8779 TDS: Micromax 8779
Co-Curing Possible with edge termination, encapsulant, and marking TDS: Product benefits

Handling and Storage Recommendations

Storage Rules Store tightly sealed in a clean, stable environment at refrigerated temperature between 0°C and 5°C. Room temperature storage is not recommended. TDS: 0°C – 5°C
Shelf Life 3 months in unopened containers from date of shipment. TDS: 3 months
Ageing Behavior Gradual polymerization with viscosity increase and mechanical separation can be expected over a few months. TDS: Storage and shelf life
Refrigerated Handling Allow material to equilibrate to room temperature before opening to prevent moisture pickup from condensation. TDS: Storage and shelf life
Transportation Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. TDS: normal shipping conditions

Official Technical Documentation

Document Type Document Introduction Document Request
TDS MacDermid Alpha Micromax 5499A original factory technical data sheet Request TDS
COA Batch-specific certificate of analysis Request COA
SDS Safety Data Sheet for handling and storage Request SDS

Frequently Asked Questions

How fast is the cure for 5499A?

The TDS specifies a cure at 180°C for just 5 minutes. This is much faster than Micromax 5499, which cures at 180°C for 20–30 minutes. The shorter cure supports higher throughput on hybrid circuit lines.

How does 5499A differ from 5499?

The TDS positions 5499A as a variant with shorter curing time at 180°C (5 minutes) and improved printability compared to Micromax 5499. Both share black color, halogen-free design, and co-curing capability with edge termination, encapsulant, and marking.

Is 5499A halogen free?

Yes. The TDS states that 5499A is halogen free as defined in IEC 61249-2-21. Trace amounts may be present.

What does co-curing mean for 5499A?

The TDS lists co-curing with edge termination, encapsulant, and marking as a product benefit. Multiple layers can potentially be cured together in a single cycle, consolidating process steps in hybrid circuit production.

What is the solid content of 5499A?

Solid content is 73–83%. This supports a higher film build compared with lower-solids encapsulants.

Is 5499A free of lead, cadmium, nickel and phthalate?

Per the TDS, lead, cadmium, nickel, and phthalate are not intentional ingredients and are not intentionally added. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.

What thinner and clean-up solvent should be used with 5499A?

Micromax 8779 is listed as both the recommended thinner and the clean-up solvent. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.

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We supply authentic MacDermid Alpha Micromax 5499A black thermoset epoxy encapsulant for hybrid circuit and chip component programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.

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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Halogen free” per IEC 61249-2-21; trace amounts may be present. “Lead, Cadmium, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.

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