描述
MacDermid Alpha Micromax 5463 Palladium-Free Pure Silver C1 Termination for Chip Resistors
Type: Pure Silver C1 Termination
Application: Chip Resistor
Pd Content: Palladium-Free
Shelf Life: 6 months
Micromax 5463 is a platable, lead-free, cadmium-free pure silver C1 termination for chip resistors. It is cost effective without containing palladium, offers high yield at large volume manufacturing, excellent TCR control on small chip sizes, high acid resistance, and excellent solder leach resistance with lead-free solder.
Micromax 5463 from MacDermid Alpha is a platable lead-free, cadmium-free pure silver C1 termination paste developed specifically for chip resistor applications. It is positioned for green, high performance, and low cost requirements. The formulation does not contain palladium, which keeps material cost down while still delivering excellent TCR control on small chip sizes. High yield at large volume manufacturing, high acid resistance, and excellent solder leach resistance with lead-free solder make it suited to volume chip resistor production. It is compatible with the Micromax 00X1Z (00X0) and OFxxA resistor series.
The paste carries fineness of grind at ≤20 μm and ≤10 μm, and a viscosity range of 250–320 Pa.s. Micromax 4553 is the listed solvent or thinner. Reported properties are based on 96% alumina substrates, printed with a 325 mesh stainless steel screen with approximately 10 μm emulsion to a dried thickness of 13 ± 2 μm. Recommended film thickness is 11–15 μm. Allow wet prints to level 5–10 minutes at room temperature, then dry 10–15 minutes at 150°C. Fire in a belt furnace on a 30-minute cycle with a peak temperature of 850°C for 10 minutes. Resistivity is ≤8 mΩ/sq at 10μm. Clean-up uses Micromax 8246 or THF. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5463 pure silver C1 termination paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5463
- Platable pure silver C1 termination for chip resistor applications
- Palladium-free formulation for cost effectiveness
- Lead-free and cadmium-free (no intentional addition)
- High yield at large volume manufacturing
- Compatible with Micromax 00X1Z (00X0) and OFxxA resistor series
- Excellent TCR control on small chip sizes
- High acid resistance and platable
- Excellent solder leach resistance with lead-free solder
- Fineness of grind ≤20 μm and ≤10 μm
- Viscosity 250–320 Pa.s for stable screen printing
- Screen: 325 mesh stainless steel, ~10 μm emulsion; dried print 13 ± 2 μm
- Resistivity ≤8 mΩ/sq at 10μm; firing 850°C x 10 min, 30-min cycle
Primary Applications
- Chip resistor C1 termination — platable pure silver termination layer
- Small chip sizes — excellent TCR control on small footprint resistors
- Volume chip resistor lines — high yield at large volume manufacturing
- Lead-free assemblies — designed for lead-free solder processes
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Platable pure silver C1 termination paste | TDS: Platable Termination For Chip Resistor Applications |
| Application | Resistor termination | TDS: Resistor termination |
| Solvent or Thinner | Micromax 4553 | TDS: Micromax 4553 |
| Fineness of Grind | ≤ 20 μm; ≤ 10 μm | TDS: ≤20 μm; ≤10 μm |
| Viscosity | 250 to 320 Pa.s | TDS: Brookfield HBT, #14 spindle, UC&S, 10 rpm, 25°C |
| Mask Mesh | 325 | TDS: 325 |
| Mask Emulsion | 10 μm | TDS: 10 μm |
| Drying Time | 10 to 15 minutes | TDS: 10 to 15 min |
| Drying Temperature | 150 °C | TDS: 150 °C |
| Recommended Film Thickness | 11 to 15 μm | TDS: 11 to 15 μm |
| Leveling Time | 5 to 10 minutes | TDS: 5 to 10 min |
| Resistivity | ≤ 8 mΩ/sq at 10μm | TDS: ≤8 mOhm per square |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Screen Type | 280 mesh stainless steel | TDS: 280-mesh stainless steel |
| Dried Print Thickness | 13 ± 2 μm | TDS: 13±2 μm |
| Firing Profile | 30-minute cycle, 850°C peak for 10 minutes | TDS: 850°C x 10 min, 30 min cycle |
| Clean-up Solvent | Micromax 8246, THF | TDS: Micromax 8246, THF |
| Compatible Resistor Series | Micromax 00X1Z (00X0) and OFxxA | TDS: Product benefits |
| Palladium Free | Yes | TDS: Product benefits |
| Lead Free / Cadmium Free | Yes (no intentional addition) | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Lead and Cadmium free” as used herein means these substances are not intentionally added to the referenced product. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Thoroughly mix to redisperse solids | TDS: thoroughly mix |
| Screen Mesh | 325 mesh stainless steel with approx. 10 μm emulsion | TDS: 325 mesh, 10 μm |
| Dried Print Thickness | 13 ± 2 μm (recommended film 11–15 μm) | TDS: 13±2 μm dried |
| Leveling | 5–10 minutes at room temperature | TDS: 5-10 minutes |
| Drying | 150°C for 10–15 minutes | TDS: 10-15 minutes at 150°C |
| Firing | 30-minute cycle, 850°C peak for 10 minutes, belt furnace | TDS: 850°C x 10 min, 30 min cycle |
| Thinner | Micromax 4553 | TDS: Micromax 4553 |
| Clean-up Solvent | Micromax 8246, THF | TDS: Micromax 8246, THF |
| Substrates | 96% alumina; other compositions may vary | TDS: 96% alumina |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5463 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
What does palladium-free mean for 5463?
The TDS states that 5463 is cost effective without containing palladium. This keeps material cost down compared with Ag/Pd termination platforms, while still delivering excellent TCR control on small chip sizes and high acid resistance.
Why is 5463 suitable for large volume manufacturing?
The TDS lists high yield at large volume manufacturing as a product benefit. Combined with lead-free and cadmium-free positioning, this makes 5463 well suited to volume chip resistor production.
Which resistor series are compatible with 5463?
The TDS lists compatibility with Micromax 00X1Z (00X0) and OFxxA resistor series. This makes 5463 suitable for chip resistor builds that already use those resistor systems.
Does 5463 work with lead-free solder?
Yes. The TDS lists excellent solder leach resistance with lead-free solder. Combined with the lead-free and cadmium-free positioning, this supports lead-free chip resistor assembly.
What is the resistivity of 5463?
Resistivity is 8 mΩ/sq or less at 10μm. This supports low-resistance termination performance in chip resistor assemblies.
What clean-up solvent should be used with 5463?
The TDS lists Micromax 8246 and THF as clean-up solvents. Using the specified solvent helps maintain screen and equipment condition between runs.
Is 5463 free of lead and cadmium?
Per the TDS, lead and cadmium are not intentionally added to 5463. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
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We supply authentic MacDermid Alpha Micromax 5463 pure silver C1 termination paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Lead and Cadmium free” as used herein means these substances are not intentionally added to the referenced product. Trace amounts may be present.
