描述
MacDermid Alpha Micromax 5427 Ultra-Precision Anti-Sulfuration Platable Ag/Pd Termination
Type: Platable Ag/Pd Termination
Application: Chip Resistor
Pd Content: 10%
Shelf Life: 6 months
Micromax 5427 is a platable silver/palladium termination developed for chip resistor applications requiring ultra-precision and anti-sulfuration performance. The 10% palladium content provides solid anti-sulfuration, and the paste is compatible with the Micromax XL resistor series for ultra-precision grade. Good TCR control on ≥0402 chip sizes and/or lower resistivity range, plus dense fired film and high acid resistance.
Micromax 5427 from MacDermid Alpha is a platable silver/palladium termination paste developed specifically for chip resistor applications that require ultra-precision and anti-sulfuration performance. It is designed to work with the Micromax XL resistor series for ultra-precision grade. The 10% palladium content delivers solid anti-sulfuration, which matters in sulfur-containing environments where silver-rich terminations can degrade over time. The paste also offers good TCR control on ≥0402 chip sizes and/or lower resistivity range, a dense fired film, high acid resistance, and good post-plating adhesion.
The paste carries 74.8–76.8% solids and a viscosity range of 200–280 Pa.s. Micromax 8250(T) is the listed solvent or thinner. Firing follows the standard Micromax profile of 850°C peak with a 10-minute holding time on a 30-minute cycle. Solder wettability is good, and the fired film is dense. Cadmium, nickel oxide, and phthalate are not intentionally added. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5427 platable Ag/Pd termination paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5427
- Platable silver/palladium termination for chip resistor applications
- 10% palladium content for solid anti-sulfuration performance
- Compatible with Micromax XL resistor series for ultra-precision grade
- Good TCR control on ≥0402 chip sizes and/or lower resistivity range
- Dense fired film for reliable termination performance
- High acid resistance and post-plating adhesion
- Good solder wettability
- Cadmium, nickel oxide, and phthalate free formulation (no intentional addition)
- Solids 74.8–76.8% for consistent deposition
- Viscosity 200–280 Pa.s for stable screen printing
- Firing: standard 850°C x 10 min peak, 30-minute cycle
- Thinner Micromax 8250(T)
Primary Applications
- Ultra-precision chip resistor termination — with Micromax XL resistor series
- Sulfur-sensitive environments — 10% Pd for solid anti-sulfuration
- Small chip sizes — ≥0402 with good TCR control
- Post-plating processes — where high acid resistance and post-plating adhesion matter
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Platable silver/palladium termination paste | TDS: Platable Silver/Palladium Termination for Chip Resistor Applications |
| Application | Termination | TDS: Termination |
| Solvent or Thinner | Micromax 8250(T) | TDS: Micromax 8250(T) |
| Solid Content | 74.8 to 76.8 % | TDS: 74.8 to 76.8 % |
| Viscosity | 200 to 280 Pa.s | TDS: 200 to 280 Pa.s |
| Pd Content | 10 % | TDS: 10% palladium content |
| Compatible Resistor Series | Micromax XL resistor series (ultra-precision grade) | TDS: Product benefits |
| TCR Control | Good TCR control on ≥0402 chip sizes and/or lower resistivity range | TDS: Product benefits |
| Anti-Sulfuration | Solid anti-sulfuration performance with 10% Pd | TDS: Product benefits |
| Firing Profile | Standard 850°C x 10 min peak, 30-minute cycle | TDS: Typical 850°C 30 Minute Firing Profile |
| Ascending Rate (300°C → 500°C) | 100 °C/min | TDS: 100°C/min |
| Descending Rate (700°C → 300°C) | -100 °C/min | TDS: -100°C/min |
| Cadmium, Nickel Oxide, Phthalate Free | Yes (no intentional addition) | TDS: Product benefits |
| Solder Wettability | Good | TDS: Product benefits |
| Post-Plating Adhesion | High acid resistance and post-plating adhesion | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium, Nickel oxide and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Thoroughly mix to redisperse solids | TDS: thoroughly mix |
| Firing Peak | 850 °C | TDS: 850°C Peak |
| Firing Holding Time | 10 minutes | TDS: 10 min at Peak |
| Total Firing Cycle | 30 minutes | TDS: 30 min |
| Ascending Rate (300°C → 500°C) | 100 °C/min | TDS: 100°C/min |
| Descending Rate (700°C → 300°C) | -100 °C/min | TDS: -100°C/min |
| Thinner | Micromax 8250(T) | TDS: Micromax 8250(T) |
| Substrates | Chip resistor substrates; TDS does not list a specific substrate | TDS: not specified |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5427 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why does 5427 use 10% Pd?
The 10% palladium content delivers solid anti-sulfuration performance. In sulfur-containing environments, silver-rich terminations can degrade, and higher Pd content helps resist that attack.
Which resistor series is 5427 designed for?
The TDS lists compatibility with the Micromax XL resistor series for ultra-precision grade. It also provides good TCR control on ≥0402 chip sizes and/or lower resistivity range.
What firing profile is recommended for 5427?
The standard Micromax profile: 850°C peak with 10-minute holding time on a 30-minute cycle. Ascending rate is 100°C/min from 300°C to 500°C, and descending rate is -100°C/min from 700°C to 300°C.
How does 5427 perform in post-plating steps?
The TDS lists high acid resistance and post-plating adhesion, plus good solder wettability. These characteristics support reliable performance through plating and soldering processes.
What is the solid content and viscosity of 5427?
Solid content is 74.8 to 76.8 percent. Viscosity is 200 to 280 Pa.s. These values support consistent screen printing.
Is 5427 free of cadmium, nickel oxide and phthalate?
Per the TDS, cadmium, nickel oxide, and phthalate are not intentional ingredients and are not intentionally added. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
What thinner should be used with 5427?
Micromax 8250(T) is the listed solvent or thinner. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.
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We supply authentic MacDermid Alpha Micromax 5427 platable Ag/Pd termination paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium, Nickel oxide and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
