描述
MacDermid Alpha Micromax 5951 Multilayer Interconnect Dielectric for Up to Seven Metal Levels
Type: Multilayer Interconnect Dielectric
Application: Up to Seven Metal Levels
Viscosity: 220–295 Pa.s
Shelf Life: 6 months
Micromax 5951 is a multilayer interconnect dielectric and part of a thick film ink system for building smaller multilayer interconnect circuits with up to seven metal levels. It offers 40–50 μm total dielectric thickness between metal levels after three fired layers, dielectric constant 6–10, dissipation factor ≤0.5%, and 12 mil nominal via retention.
Micromax 5951 from MacDermid Alpha is a multilayer interconnect dielectric developed as part of a thick film ink system for building smaller multilayer interconnect circuits with up to seven metal levels. It is positioned as a high reliability dielectric, with the dielectric constant and dissipation factor data supporting use in multilayer builds where controlled electrical behavior between metal layers matters. Via retention of 12 mil nominal is listed as a typical physical property, which supports reliable interconnect geometry in high-density circuits.
The paste has a viscosity range of 220–295 Pa.s and uses Micromax 9179 as the recommended solvent or thinner. Print with a 325 mesh screen. To achieve a total dielectric thickness of 40–50 μm between metal levels, print, dry, and fire three layers of dielectric, with via filling after the first and third layers. Single wet-pass printing is possible. Allow prints to level 5–10 minutes before drying at 150°C for 15 minutes. Fire each dielectric print after drying, using a 30-minute profile with an 850°C peak temperature held for 10 minutes. Recommended film thickness is 40–60 μm. Dielectric constant is 6–10, and dissipation factor is ≤0.5%. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5951 multilayer dielectric paste. Original factory TDS and batch-specific COA are available on request for your multilayer interconnect programs.
Request Sample, TDS & Quotation
Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5951
- Multilayer interconnect dielectric for thick film systems
- Supports multilayer interconnect circuits with up to seven metal levels
- Dielectric constant 6–10 for controlled electrical behavior
- Dissipation factor ≤0.5%
- Total dielectric thickness 40–50 μm between metal levels (three fired layers)
- Via retention 12 mil nominal
- Via filling after first and third layers
- Single wet-pass printing possible
- Viscosity 220–295 Pa.s for stable screen printing
- Screen: 325 mesh
- Drying: 150°C for 15 minutes after 5–10 minutes leveling
- Firing: 30-minute profile, 850°C peak held for 10 minutes
Primary Applications
- Multilayer interconnect circuits — dielectric layer between metal levels
- Up to seven metal level builds — high-density thick film designs
- High reliability dielectric — per TDS application field
- Via-fill interconnection — via filling after first and third dielectric layers
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Multilayer interconnect dielectric | TDS: Multilayer Dielectric |
| Application | High reliability dielectric | TDS: High reliability dielectric |
| Solvent or Thinner | Micromax 9179 | TDS: Micromax 9179 |
| Viscosity | 220 to 295 Pa.s | TDS: Brookfield 2xHAT, UC&SP, 10 rpm, 25°C |
| Mask Mesh | 325 | TDS: 325 |
| Drying Time | 15 minutes | TDS: 15 min |
| Drying Temperature | 150 °C | TDS: 150 °C |
| Recommended Film Thickness | 40 to 60 μm | TDS: 40 to 60 μm (3 fired layers) |
| Leveling Time | 5 to 10 minutes | TDS: 5 to 10 min |
| Dielectric Constant | 6 to 10 | TDS: 6 to 10 at 100 VDC |
| Dissipation Factor | ≤ 0.5 % | TDS: ≤0.5 % at 25.4 μm |
| Via Retention | 12 mil nominal | TDS: 12 mil nominal |
| Firing Profile | 30-minute profile, 850°C peak held for 10 minutes | TDS: 850°C peak for 10 min |
| Total Dielectric Thickness | 40 to 50 μm between metal levels | TDS: three fired layers |
| Printing Process | Three layers, via filling after first and third layers; single wet-pass printing possible | TDS: Printing |
| Metal Level Support | Up to seven metal levels | TDS: Product Description |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Thoroughly mix to redisperse solids | TDS: thoroughly mix |
| Screen Mesh | 325 mesh | TDS: 325 mesh |
| Number of Layers | Three layers of dielectric, with via filling after first and third layers | TDS: Printing |
| Single Wet-Pass Printing | Possible | TDS: Printing |
| Leveling | 5–10 minutes before drying | TDS: 5-10 minutes |
| Drying | 150°C for 15 minutes | TDS: 150°C for 15 min |
| Firing | 30-minute profile, 850°C peak held for 10 minutes; each dielectric print fired after drying | TDS: 850°C for 10 min |
| Thinner | Micromax 9179 | TDS: Micromax 9179 |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5951 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
How many metal levels can 5951 support?
The TDS states that 5951 is part of a thick film ink system for building smaller multilayer interconnect circuits with up to seven metal levels. Combined with the total dielectric thickness of 40–50 μm between metal levels, this supports high-density multilayer builds.
How does 5951 handle via filling?
The recommended process is to print, dry, and fire three layers of dielectric, with via filling after the first and third layers. Via retention is 12 mil nominal, and single wet-pass printing is also possible.
What electrical performance does 5951 offer?
Dielectric constant is 6–10 (measured at 100 VDC), and dissipation factor is 0.5% or less. This supports controlled interlayer electrical behavior in multilayer interconnect circuits.
What firing profile does 5951 use?
Each dielectric print is fired after drying, using a 30-minute profile with an 850°C peak temperature held for 10 minutes. This is consistent with standard thick film firing on 96% alumina and similar substrates.
What is the difference between 5951 and 5704 or 5704J?
All three are screen printable dielectrics. 5951 is specifically a multilayer interconnect dielectric positioned for up to seven metal levels, with dielectric constant 6–10 and dissipation factor ≤0.5%. 5704 and 5704J are positioned more generally for multilayer circuits with a pinhole-free smooth surface and via resolution, without the seven-metal-level or dielectric-constant specification.
What thinner should be used with 5951?
Micromax 9179 is the listed solvent or thinner. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.
How should 5951 be stored?
Store tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.
Get MacDermid Alpha Micromax 5951 Bulk Pricing and Technical Support
We supply authentic MacDermid Alpha Micromax 5951 multilayer interconnect dielectric for high-density thick film programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
Inquire Bulk Price & Technical Support
Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots.
