描述
MacDermid Alpha Micromax 5907 High Silver Content Pt/Ag Conductor for Single Layer Hybrids
Type: High Silver Content Pt/Ag Conductor
Application: Single Layer Hybrids, Resistor Termination
Viscosity: 150–210 Pa.s
Shelf Life: 6 months
Micromax 5907 is a high silver content platinum/silver thick film conductor for all-purpose use on single layer hybrids, termination for Micromax 00X0 network and chip resistor series, and electrodes for Micromax thick film capacitors. It offers high conductivity, excellent adhesion and solder acceptance with 10Sn/88Pb/2Ag solder, and excellent 1 and 2 mil gold wire bondability.
Micromax 5907 from MacDermid Alpha is a high silver content platinum/silver thick film conductor developed for demanding hybrid circuit applications. It is positioned as an all-purpose conductor on single layer hybrids, a termination conductor for Micromax 00X0 network and chip resistor series, and an electrode for Micromax thick film capacitor compositions. The high silver content supports high conductivity while remaining cost effective, and the paste delivers excellent adhesion and solder acceptance with 10Sn/88Pb/2Ag solder. Gold wire bondability is also excellent with both 1 and 2 mil wire.
The paste has a viscosity range of 150–210 Pa.s and uses Micromax 4553 as the recommended solvent or thinner. Reported properties are based on 96% alumina substrates. Print with a 325 mesh stainless steel screen with 15 μm (0.6 mil) emulsion to obtain a minimum of 10 μm fired thickness. Printing speeds up to 20 cm/s (8 in/s) can be used. Allow the wet print to level 10–15 minutes at room temperature, then dry at 150°C for 10 minutes. Fire dried parts in a belt furnace on a 30-minute cycle with a peak temperature of 850°C for 10 minutes. Solder acceptance is >95% (10Sn/88Pb/2Ag, 330°C, 5-second dip), and solder leach resistance is >7 dips at 10 seconds per dip. Initial adhesion is 20–25 N (2.5–3.0 kg), and aged adhesion after 1,000 hours at 150°C remains >20 N. Migration resistance is 3–5 seconds in a water drop test with a 508/508 μm lines/space pattern at 20 VDC. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5907 Pt/Ag conductor paste. Original factory TDS and batch-specific COA are available on request for your hybrid circuit programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5907
- High silver content Pt/Ag thick film conductor
- All-purpose conductor for single layer hybrids
- Termination conductor for Micromax 00X0 network and chip resistor series
- Electrode for Micromax thick film capacitor compositions
- High conductivity and cost effective
- Excellent adhesion and solder acceptance with 10Sn/88Pb/2Ag solder
- Excellent 1 and 2 mil gold wire bondability
- Solder acceptance >95% at 330°C, 5-second dip
- Solder leach resistance >7 dips at 10 seconds per dip
- Initial adhesion 20–25 N (2.5–3.0 kg); aged adhesion >20 N after 1,000 hrs at 150°C
- Migration resistance 3–5 seconds in water drop test at 20 VDC
- Screen: 325 mesh stainless steel, 15 μm emulsion; thinner Micromax 4553
Primary Applications
- Single layer hybrids — all-purpose conductor layer
- Resistor termination — for Micromax 00X0 network and chip resistor series
- Thick film capacitors — electrode for Micromax capacitor compositions
- Gold wire bonding — 1 and 2 mil gold wire
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | High silver content Pt/Ag thick film conductor | TDS: Pt/Ag Conductor |
| Application | Resistor termination | TDS: Resistor termination |
| Solvent or Thinner | Micromax 4553 | TDS: Micromax 4553 |
| Viscosity | 150 to 210 Pa.s | TDS: Brookfield HBT, SC4-14/6R, 10 rpm, 25°C |
| Mask Mesh | 325 | TDS: 325 |
| Mask Emulsion | 15 μm (0.6 mil) | TDS: 15 μm |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Printing Speed | Up to 20 cm/s (8 in/s) | TDS: 20 cm/s (8 in/s) |
| Recommended Fired Thickness | Minimum 10 μm | TDS: minimum of 10 μm fired thickness |
| Leveling Time | 10 to 15 minutes at room temperature | TDS: 10-15 minutes |
| Drying Schedule | 10 minutes at 150°C | TDS: 150°C for 10 min |
| Firing Profile | 30-minute cycle, 850°C peak for 10 minutes | TDS: 30 min cycle, 850°C for 10 min |
| Solder Acceptance | >95% (10Sn/88Pb/2Ag, 330°C, dip 5 sec) | TDS: >95 |
| Solder Leach Resistance | >7 dips (10 sec/dip, 10Sn/88Pb/2Ag at 330°C) | TDS: >7 dips |
| Initial Adhesion | 20-25 N (2.5-3.0 kg) | TDS: 20-25 N |
| Aged Adhesion (150°C, 1,000 hrs) | >20 N (2.5-3.0 kg) | TDS: >20 N |
| Migration Resistance | 508/508 μm lines/space pattern, 20 VDC, 3-5 seconds | TDS: 3-5 seconds |
| Gold Wire Bondability | Excellent with 1 and 2 mil gold wire | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Thoroughly mix to redisperse solids | TDS: thoroughly mix |
| Screen Mesh | 325 mesh stainless steel with 15 μm (0.6 mil) emulsion | TDS: 325 mesh, 15 μm |
| Printing Speed | Up to 20 cm/s (8 in/s) | TDS: 20 cm/s |
| Fired Thickness | Minimum 10 μm | TDS: minimum 10 μm |
| Leveling | 10–15 minutes at room temperature | TDS: 10-15 minutes |
| Drying | 150°C for 10 minutes | TDS: 150°C for 10 min |
| Firing | 30-minute cycle, 850°C peak for 10 minutes, belt furnace | TDS: 30 min cycle, 850°C for 10 min |
| Thinner | Micromax 4553 | TDS: Micromax 4553 |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5907 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why is 5907 considered a high silver content conductor?
The TDS describes 5907 as a high silver content platinum/silver thick film composition. This high silver content supports high conductivity, making it suitable for all-purpose conductor layers on single layer hybrids, termination for 00X0 series resistors, and electrodes for thick film capacitors.
How does 5907 perform in solder leach testing?
Solder leach resistance is greater than 7 dips at 10 seconds per dip with 10Sn/88Pb/2Ag solder at 330°C. Solder acceptance is also greater than 95% under the same solder at 5-second dip. This supports reliable soldering in hybrid assembly.
What adhesion does 5907 maintain after thermal aging?
Initial adhesion is 20–25 N (2.5–3.0 kg). After aging at 150°C for 1,000 hours, adhesion remains greater than 20 N (2.5–3.0 kg). This supports long-term reliability in hybrid circuits.
Can 5907 be used for gold wire bonding?
Yes. The TDS lists excellent 1 and 2 mil gold wire bondability. Combined with the high conductivity and solder performance, this makes 5907 suitable for hybrid circuits that require both wire bonding and soldering.
What is the migration resistance of 5907?
In a water drop test with a 508/508 μm lines/space pattern at 20 VDC, migration resistance is 3–5 seconds. This test gives an indication of the conductor’s resistance to electrochemical migration under humidity and bias.
What screen setup and fired thickness does 5907 use?
A 325 mesh stainless steel screen with 15 μm (0.6 mil) emulsion is recommended to obtain a minimum of 10 μm fired thickness. Printing speeds up to 20 cm/s (8 in/s) can be used.
How should 5907 be stored?
Store tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.
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We supply authentic MacDermid Alpha Micromax 5907 Pt/Ag conductor paste for hybrid circuit and resistor termination programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots.
