描述
MacDermid Alpha Micromax 5771 Cadmium-Free Gold Conductor for Multilayer Dielectrics
Type: Cadmium-Free Gold Conductor
Application: High-Density Hybrids
Solids: 83.7–85.7%
Shelf Life: 6 months
Micromax 5771 is a cadmium-free, screen printable gold conductor used as a gold wire bondable conductor in high-density hybrids. It is capable of good automatic gold wire bonding yields with 1-mil and 2-mil gold wire, and works well over multilayer dielectrics such as Micromax QM44. Fires at 850°C peak for 10 minutes on a 30-minute cycle with stable performance after multiple refirings.
Micromax 5771 from MacDermid Alpha is a cadmium-free, screen printable gold conductor developed for use as a gold wire bondable conductor in high-density hybrid circuits. It is capable of good automatic gold wire bonding yields with both 1-mil and 2-mil gold wire. A key feature is that Micromax 5771 works well over multilayer dielectrics, such as Micromax QM44, making it suitable for multilayer hybrid builds where the conductor layer sits above one or more dielectric layers. The composition is cadmium free, with cadmium not intentionally added.
The paste carries 83.7–85.7% solids and a viscosity range of 350–500 Pa.s. Micromax 8672 is the listed solvent or thinner. Reported properties are based on 96% alumina substrates. A 325 mesh stainless steel screen with 12 μm (0.5 mil) emulsion thickness is recommended, and printing speeds up to 15 cm/s (6 in/s) can be achieved. Allow the wet print to level at room temperature, then dry at 150°C for 15 minutes. Fire dried prints in a belt furnace on a 30-minute cycle with a peak temperature of 850°C for 10 minutes. No significant changes in performance characteristics were seen after multiple refirings at 850°C. Bonding was tested on Hughes 2460-III with 1.0 mil Au wire (tensile 8 g min), Hughes 2456-III with 2.0 mil Au wire (tensile 40–45 g), and a K&S Model 4123 Ultrasonic Wedge Bonder with 1.0 mil Al wire (1% silicon). Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5771 gold conductor paste. Original factory TDS and batch-specific COA are available on request for your high-density hybrid programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5771
- Cadmium-free, screen printable gold conductor
- Developed for gold wire bondable applications in high-density hybrids
- Good automatic gold wire bonding yields with 1-mil and 2-mil gold wire
- Works well over multilayer dielectrics such as Micromax QM44
- Stable after multiple refirings at 850°C
- Solids 83.7–85.7% for consistent deposition
- Viscosity 350–500 Pa.s for stable screen printing
- Screen: 325 mesh stainless steel with 12 μm (0.5 mil) emulsion
- Printing speeds up to 15 cm/s (6 in/s)
- Drying: 150°C for 15 minutes
- Firing: 30-minute cycle, 850°C peak for 10 minutes
- Thinner Micromax 8672; substrate 96% alumina
Primary Applications
- High-density hybrids — gold wire bondable conductor layer
- High reliability Au conductor — per TDS application field
- Multilayer dielectric builds — works well over Micromax QM44 and similar dielectrics
- Au and Al wire bonding — 1-mil and 2-mil Au wire, plus 1 mil Al wire
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Cadmium-free gold conductor | TDS: Gold Conductor |
| Application | High reliability Au conductor | TDS: High reliability Au conductor |
| Solvent or Thinner | Micromax 8672 | TDS: Micromax 8672 |
| Solid Content | 83.7 to 85.7 % | TDS: 83.7 to 85.7 % |
| Viscosity | 350 to 500 Pa.s | TDS: Brookfield 2xHAT, SC4-14/6R, 10 rpm, 25°C |
| Mask Mesh | 325 | TDS: 325 |
| Mask Emulsion | 12 μm (0.5 mil) | TDS: 12 μm |
| Drying Time | 15 minutes | TDS: 15 min |
| Drying Temperature | 150 °C | TDS: 150 °C |
| Theoretical Coverage | 50 to 80 cm²/g | TDS: 50 to 80 cm²/g |
| Substrate Compatibility | 96% alumina; compatible with Micromax QM44 multilayer dielectrics | TDS: 96% alumina; QM44 |
| Screen Type | 325 mesh stainless steel with 12 μm (0.5 mil) emulsion | TDS: 325 mesh stainless steel, 12 μm |
| Printing Speed | Up to 15 cm/s (6 in/s) | TDS: 15 cm/s (6 in/s) |
| Firing Profile | 30-minute cycle, 850°C peak for 10 minutes | TDS: 30 min cycle, 850°C for 10 min |
| Refiring Stability | No significant changes after multiple refirings at 850°C | TDS: Firing |
| Au Wire Bonding | Good automatic gold wire bonding yields with 1-mil and 2-mil wire | TDS: Product Description |
| Al Wire Bonding | K&S 4123 Ultrasonic Wedge Bonder, 1.0 mil Al wire (1% silicon) | TDS: Bonding conditions |
| Bonding Test 1.0 mil Au | Hughes 2460-III, stage 150°C, ceramic tool, tensile 8 g min, elongation 3–5% | TDS: Bonding conditions |
| Bonding Test 2.0 mil Au | Hughes 2456-III, stage 150°C, ceramic tool, tensile 40–45 g, elongation 3–5% | TDS: Bonding conditions |
| Multilayer Dielectric Compatibility | Works well over Micromax QM44 multilayer dielectrics | TDS: Product Description |
| Cadmium Free | Yes (no intentional addition) | TDS: Product Description |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Thoroughly mix to redisperse solids | TDS: thoroughly mix |
| Screen Mesh | 325 mesh stainless steel with 12 μm (0.5 mil) emulsion | TDS: 325 mesh, 12 μm |
| Printing Speed | Up to 15 cm/s (6 in/s) | TDS: 15 cm/s |
| Leveling and Drying | Level at room temperature, then dry at 150°C for 15 minutes | TDS: level then dry, 150°C for 15 min |
| Firing | 30-minute cycle, 850°C peak for 10 minutes, belt furnace | TDS: 30 min cycle, 850°C for 10 min |
| Refiring | Stable after multiple refirings at 850°C | TDS: Firing |
| Thinner | Micromax 8672 | TDS: Micromax 8672 |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5771 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why is 5771 suited to multilayer dielectric builds?
The TDS states that 5771 works well over multilayer dielectrics, such as Micromax QM44. This makes it suitable for high-density hybrid builds where the gold conductor sits above one or more dielectric layers rather than directly on the base substrate.
How does 5771 compare with 5744R for wire bonding?
Both are cadmium-free gold conductors. 5744R is specifically positioned for bonding pads on alumina and on Micromax 5704 dielectric in Pd/Ag crossover and simple multilayer circuits using silver bearing conductors. 5771 is positioned for high-density hybrids over multilayer dielectrics such as QM44, with documented Au and Al wire bonding conditions.
What wire sizes and test conditions does 5771 support?
Good automatic gold wire bonding yields are shown with 1-mil and 2-mil gold wire. 1.0 mil Au tests use Hughes 2460-III with 8 g min tensile; 2.0 mil Au tests use Hughes 2456-III with 40–45 g tensile. Al wire bonding uses a K&S Model 4123 Ultrasonic Wedge Bonder with 1.0 mil Al wire (1% silicon).
How stable is 5771 after refiring?
No significant changes in performance characteristics were seen after multiple refirings at 850°C. This supports multilayer builds where the conductor layer is fired more than once.
What screen setup works with 5771?
A 325 mesh stainless steel screen with 12 μm (0.5 mil) emulsion thickness is recommended. Printing speeds up to 15 cm/s (6 in/s) can be achieved.
Is 5771 cadmium free?
Per the TDS, cadmium is not intentionally added to 5771. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
How should 5771 be stored?
Store tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.
