描述
MacDermid Alpha Micromax 5436F Low-Firing Acid-Resistant Glass Encapsulant for Chip Resistors
Type: Glass Encapsulant
Application: Chip Resistor
Color: Black
Solids: 75–81%
Shelf Life: 6 months
Micromax 5436F is a screen printable, low temperature firing protective glass encapsulant for chip resistors. It is acid resistant, withstands acidic nickel plating conditions, fires at 620–640°C on a 30-minute profile, has less influence on resistor performance, and offers excellent printability. Lead, cadmium, nickel, and phthalate free.
Micromax 5436F from MacDermid Alpha is a screen printable, low temperature firing protective glass encapsulant developed for chip resistors. It provides a black protective layer over the resistor body and is engineered to withstand acidic nickel plating conditions, which matters when the component goes through plating after encapsulation. Its low firing temperature of 620–640°C reduces thermal influence on the resistor element, helping preserve target TCR and resistance values. The formulation is lead, cadmium, nickel, and phthalate free.
The paste carries 75–81% solids and a viscosity range of 200–290 Pa.s. Micromax 8218 is the listed solvent or thinner. Print with a 325 mesh stainless steel screen to a dried thickness of 18–20 μm, giving a minimum fired thickness of 10 μm. Mix thoroughly by slow, gentle hand stirring 1–2 minutes with a clean burr-free spatula, taking care to avoid air bubble entrapment. Allow prints to level at room temperature for 5–10 minutes, then dry at 150°C for 10 minutes. Fire in a belt furnace on a 30-minute cycle with a peak temperature of 620–640°C held for 5–10 minutes. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5436F glass encapsulant paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5436F
- Screen printable, low temperature firing glass encapsulant for chip resistors
- Acid resistant and withstands acidic nickel plating conditions
- Low firing temperature: 620–640°C on a 30-minute profile
- Less influence on resistor performance during firing
- Excellent printability for consistent encapsulation coverage
- Black color for clean resistor body appearance
- Lead, cadmium, nickel, and phthalate free (no intentional addition)
- Solids 75–81% for stable deposition
- Viscosity 200–290 Pa.s for consistent screen printing
- Screen: 325 mesh stainless steel; dried thickness 18–20 μm
- Minimum fired thickness 10 μm
- Thinner Micromax 8218
Primary Applications
- Chip resistor glass encapsulation — protective layer over resistor body
- Acidic nickel plating lines — where encapsulation must resist plating chemistry
- Low-firing resistor builds — where thermal influence on the element must be minimized
- Black-body chip resistors — for consistent appearance after firing
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Protective glass encapsulant for chip resistors | TDS: Glass Encapsulant |
| Application | Encapsulant | TDS: Encapsulant |
| Solvent or Thinner | Micromax 8218 | TDS: Micromax 8218 |
| Solid Content | 75 to 81 % | TDS: 75 to 81 % |
| Viscosity | 200 to 290 Pa.s | TDS: Brookfield HBT, UC&SP, 10 rpm |
| Mask Mesh | 325 | TDS: 325 |
| Color | Black | TDS: Product benefits |
| Dried Thickness | 18 to 20 μm | TDS: 18-20μm dried |
| Minimum Fired Thickness | 10 μm | TDS: minimum fired thickness of 10μm |
| Leveling Time | 5 to 10 minutes at room temperature | TDS: 5-10 minutes |
| Drying Schedule | 10 minutes at 150°C | TDS: 10 minutes at 150°C |
| Firing Peak Temperature | 620 to 640 °C | TDS: 620-640°C |
| Firing Peak Hold | 5 to 10 minutes | TDS: 5-10 min |
| Total Firing Cycle | 30 minutes | TDS: 30-minute cycle |
| Acid Resistance | Withstands acidic nickel plating conditions | TDS: Product benefits |
| Lead, Cadmium, Nickel, Phthalate Free | Yes (no intentional addition) | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Lead, Cadmium, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Slow, gentle hand stirring 1–2 minutes with a clean burr-free spatula; avoid air bubble entrapment | TDS: 1-2 minutes |
| Screen Mesh | 325 mesh stainless steel | TDS: 325-mesh stainless steel |
| Dried Thickness | 18–20 μm (min. fired 10 μm) | TDS: 18-20μm / 10μm fired |
| Leveling | 5–10 minutes at room temperature | TDS: 5-10 minutes |
| Drying | 150°C for 10 minutes | TDS: 150°C for 10 min |
| Firing | 30-minute cycle, peak 620–640°C for 5–10 minutes, belt furnace | TDS: 620-640°C, 5-10 min, 30 min cycle |
| Thinner | Micromax 8218 | TDS: Micromax 8218 |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5436F original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why does 5436F fire so low at 620–640°C?
The TDS lists a low firing temperature of 620–640°C on a 30-minute profile. This helps reduce thermal influence on the resistor element underneath, which supports stable resistance and TCR values after encapsulation.
Does 5436F survive acidic nickel plating?
Yes. The TDS lists acid resistance as a product benefit and states that 5436F withstands acidic nickel plating conditions. This matters when the encapsulated resistor goes through subsequent plating steps.
What dried and fired thickness should I target for 5436F?
Print to a dried thickness of 18–20 μm using a 325 mesh stainless steel screen. That yields a minimum fired thickness of 10 μm, which supports reliable encapsulation coverage.
What color is 5436F after firing?
The TDS lists black color as a product benefit. The black body gives the chip resistor a consistent appearance after encapsulation.
How should 5436F be mixed before printing?
Slow, gentle hand stirring with a clean burr-free spatula (flexible plastic or stainless steel) for 1–2 minutes. Take care to avoid air bubble entrapment during mixing.
Is 5436F free of lead, cadmium, nickel and phthalate?
Per the TDS, lead, cadmium, nickel, and phthalate are not intentional ingredients and are not intentionally added. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
What thinner should be used with 5436F?
Micromax 8218 is the listed solvent or thinner. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.
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We supply authentic MacDermid Alpha Micromax 5436F glass encapsulant paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Lead, Cadmium, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
