描述
Micromax 4597R Pt/Pd/Au Solderable Conductor, High-Density Hybrids
Type: Pt/Pd/Au Solderable Conductor
Application: High-Density Hybrids
Solid Content: 80.1-81.4%
Firing: 850°C / 60 min
Shelf Life: 6 months
MacDermid Alpha Micromax 4597R is a phthalate and cadmium-free platinum/palladium/gold solderable conductor for high-density single and multilayer hybrids. Offering excellent solder acceptance, high leach resistance on alumina and dielectric, and high reliability with 850°C 60-minute firing per TDS specifications.
Micromax 4597R is a phthalate and cadmium-free solderable platinum/palladium/gold conductor specifically engineered for high-density single and multilayer hybrid circuits. This composition delivers excellent tin/lead solderability and exhibits high leach resistance on both alumina and dielectric substrates. When used on alumina or with Micromax multilayer dielectrics, the conductor offers superior solder acceptance, improved backlight density, high circuit density, and high reliability — making it ideal for demanding hybrid circuit applications.
With a solid content of 80.1-81.4% per TDS specifications, Micromax 4597R is optimized for 200-mesh stainless steel screens with 12 μm emulsion thickness and print speeds up to 30 cm/s. Drying is performed at room temperature after leveling. The paste fires at 850°C peak with a 60-minute cycle. The conductor delivers initial adhesion of ≥20N and aged adhesion of ≥14N after 48 hours at 150°C. Available in standard packaging.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We maintain stable inventory of authentic MacDermid Alpha Micromax 4597R Pt/Pd/Au solderable conductor. Factory-original TDS and batch-specific COA can be provided upon request for your high-density hybrid circuit projects.
Request Sample, TDS & Quotation
Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 4597R
- Pt/Pd/Au solderable conductor — platinum/palladium/gold metallurgy for high-reliability terminations per TDS specifications
- Phthalate and cadmium free — formulated without intentional addition of restricted substances per TDS specifications
- Excellent solder acceptance — superior tin/lead solderability for reliable terminations per TDS specifications
- High leach resistance — excellent performance on both alumina and dielectric substrates per TDS specifications
- High circuit density — designed for high-density single and multilayer hybrid circuits per TDS specifications
- High reliability — robust performance for demanding hybrid circuit applications per TDS specifications
- 80.1-81.4% solid content — high solids for efficient conductor deposition per TDS specifications
- 850°C 60-minute firing — optimized firing profile for consistent conductor performance per TDS specifications
Primary Applications
- High-density single-layer hybrids — solderable conductor for high-density hybrid circuits per TDS specifications
- Multilayer hybrids — conductor for multilayer hybrid circuit applications per TDS specifications
- High-reliability hybrid circuits — Pt/Pd/Au terminations for demanding applications
- Alumina and dielectric substrates — compatible with 96% alumina and multilayer dielectrics per TDS specifications
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Pt/Pd/Au solderable conductor | TDS: Solderable conductor |
| Application | High-density single/multilayer hybrids | TDS: high density single and multilayer hybrids |
| Packaging Specification | Standard container | — |
| Solid Content | 80.1-81.4% | TDS: 80.1 to 81.4 % |
| Recommended Mesh | 200 mesh | TDS: 200-mesh stainless steel |
| Emulsion Thickness | 12 μm | TDS: 12μm (0.5 mil) |
| Print Speed | Up to 30 cm/s | TDS: up to 30cm/s (12in/s) |
| Leveling | Allow at room temperature | TDS: level at room temperature |
| Firing Peak Temperature | 850°C | TDS: 850°C |
| Firing Cycle | 60 min | TDS: 60-minutes cycle |
| Initial Adhesion | ≥20 N | TDS: ≥20N |
| Aged Adhesion (48h/150°C) | ≥14 N | TDS: ≥14N |
| Substrate Compatibility | 96% alumina, multilayer dielectrics | TDS: alumina and dielectric |
| Thinner | Micromax 9180R | TDS: 9180R |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5-30°C | TDS: 5-30°C |
Note: All listed values are typical and may vary by batch. Independent qualification testing is required prior to production use.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Slow gentle hand-stirring with clean spatula, 0.5-1 minute | — |
| Screen Mesh | 200 mesh stainless steel | TDS: 200-mesh |
| Emulsion Thickness | 12 μm (0.5 mil) | TDS: 12μm |
| Print Speed | Up to 30 cm/s (12 in/s) | TDS: up to 30cm/s |
| Leveling | Allow to level at room temperature | TDS: level at room temperature |
| Firing Peak Temperature | 850°C | TDS: 850°C |
| Total Firing Cycle | 60 minutes | TDS: 60-minutes cycle |
| Firing Atmosphere | Belt furnace | TDS: belt furnace |
| Substrate | 96% alumina, multilayer dielectrics | TDS: alumina and dielectric |
| Thinner | Micromax 9180R | TDS: 9180R |
Handling and Storage Recommendations
| Storage Rules | Store in tightly sealed containers in clean, stable environment at 5-30°C. | TDS: 5-30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling may occur during storage. | — |
| Thinning | Not normally required; use Micromax 9180R thinner sparingly for evaporative losses. | TDS: 9180R |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 4597R original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
What is Micromax 4597R?
Micromax 4597R is a phthalate and cadmium-free solderable Pt/Pd/Au conductor for high-density single and multilayer hybrids, offering excellent solder acceptance and high leach resistance per TDS specifications.
What is the primary application of Micromax 4597R?
High-density single and multilayer hybrid circuits requiring solderable conductor terminations per TDS specifications.
What is the solid content of Micromax 4597R?
80.1-81.4% per TDS specifications.
What mesh screen is recommended for Micromax 4597R?
200 mesh stainless steel screens with 12 μm emulsion thickness per TDS specifications.
What is the firing temperature for Micromax 4597R?
850°C peak with a 60-minute firing cycle per TDS specifications.
What is the adhesion performance of Micromax 4597R?
Initial adhesion ≥20N and aged adhesion ≥14N after 48 hours at 150°C per TDS specifications.
What packaging options are available for Micromax 4597R?
Standard packaging containers are available. Contact our sales team for specific requirements.
Get MacDermid Alpha Micromax 4597R Bulk Pricing and Technical Support
We supply authentic MacDermid Alpha Micromax 4597R Pt/Pd/Au solderable conductor for high-density hybrid circuit applications. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
Inquire Bulk Price & Technical Support
Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots.
