描述
MacDermid Alpha Micromax 1029 Ag/Pt Conductor Paste, Solderable LTCC
Type: Ag/Pt Conductor Paste
Pack: 100G / 1000G
Solid: 82-85%
Viscosity: 1350-450 Pa.s
Firing: 850°C / 30 min
Shelf Life: 6 months
MacDermid Alpha Micromax 1029 delivers high conductivity with excellent solderability and high leach resistance — engineered for post-firing LTCC conductor applications with 850°C firing and plateable performance.
MacDermid Alpha Micromax 1029 is an Ag/Pt conductor paste specifically developed for post-firing on LTCC substrates. This solderable conductor offers high conductivity for reliable electrical performance, high solderability for robust component attach, and high leach resistance to withstand demanding soldering processes. The material is plateable for additional processing flexibility.
This Ag/Pt conductor paste is optimized for 325 stainless steel mesh screens with 12-14 μm emulsion thickness. It supports drying at 150°C and firing at 850°C peak temperature with a 30-minute total cycle in air atmosphere. The phthalate-free, cadmium-free and nickel oxide-free formulation meets international environmental standards including RoHS and REACH. Standard packaging options are 100G and 1000G.
Genuine MacDermid Alpha Micromax Imported Stock and Technical Support
We maintain stable inventory of authentic MacDermid Alpha Micromax 1029 Ag/Pt conductor paste. Factory-original TDS and batch-specific COA can be provided upon request for LTCC and hybrid circuit manufacturing projects.
Request Sample, TDS & Quotation
Complete TDS, COA, and regulatory documentation available
Core Advantages of MacDermid Alpha Micromax 1029
- High conductivity — reliable electrical performance for LTCC conductor applications
- High solderability — robust component attach with 62Sn/36Pb/2Ag solder
- High leach resistance — withstands demanding soldering processes
- Plateable — additional processing flexibility for complex circuit designs
- Post-firing on LTCC — designed for LTCC substrate conductor applications
- Fast firing profile — 850°C peak with 30-minute total cycle for high throughput
- 325 mesh print optimized — 12-14 μm emulsion thickness for fine line printing
- RoHS, REACH compliant; Phthalate/Cadmium/Nickel oxide free — satisfies global environmental regulations
Main Applications
- LTCC Conductors — post-firing conductor on LTCC substrates
- Component Attach — solderable pads for component mounting
- Hybrid Circuits — conductor traces in hybrid microcircuits
- Multilayer Circuits — conductor layers in complex multilayer designs
Full Technical Parameters
| Property | Typical Value | Test / Reference |
| Product Type | Ag/Pt conductor paste | — |
| Application | LTCC conductor, post-firing | — |
| Packaging Specification | 100G, 1000G | Standard packing |
| Solid Content | 82-85% | — |
| Viscosity (Brookfield HBT 10 rpm) | 1350-450 Pa.s | SC4-14/6R, 25°C |
| Recommended Screen | 325 stainless steel mesh | 12-14 μm emulsion |
| Leveling Time | 10 min | Room temperature |
| Drying Temperature | 150°C | >10 minutes |
| Firing Peak Temperature | 850°C | 10 min at peak, 30 min total |
| Firing Atmosphere | Air | — |
| Conductivity | High | — |
| Solderability | High | 62Sn/36Pb/2Ag, 230°C |
| Leach Resistance | High | 10s dip, 500μm lines |
| Plateable | Yes | — |
| Substrate Compatibility | LTCC substrates, 96% alumina | — |
| Environmental Compliance | RoHS, REACH, Phthalate free, Cadmium free, Nickel oxide free | — |
| Shelf Life | 6 months in unopened containers | — |
| Storage Temperature | 5-30°C | — |
Note: All listed values are typical and may vary by batch. Independent qualification testing is required prior to production use.
Recommended Processing Conditions
| Parameter | Recommended Value |
| Mixing Prior to Use | Slow gentle hand-stirring, 1-2 minutes |
| Optimal Printing Temperature | 20-23°C |
| Screen Mesh | 325 stainless steel mesh |
| Emulsion Thickness | 12-14 μm |
| Leveling Time | 10 minutes |
| Drying Temperature | 150°C |
| Drying Time | >10 minutes |
| Firing Peak Temperature | 850°C |
| Total Firing Cycle | 30 minutes (10 min at peak) |
| Firing Atmosphere | Air |
| Substrate | LTCC substrates, 96% alumina |
Handling and Storage Recommendations
| Storage Rules | Store in tightly sealed containers in clean, stable environment at 5-30°C. |
| Shelf Life | 6 months in unopened containers from date of shipment. |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling may occur. |
| Thinning | Not normally required; use Micromax 4553 thinner sparingly for evaporative losses. |
| Printing Environment | Class 10,000 printing area recommended for complex hybrids |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 1029 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
What is MacDermid Alpha Micromax 1029?
MacDermid Alpha Micromax 1029 is an Ag/Pt conductor paste designed for post-firing on LTCC substrates. It offers high conductivity, high solderability, high leach resistance, and is plateable for component attach applications.
What is the viscosity of Micromax 1029?
Micromax 1029 has a viscosity range of 1350-450 Pa.s (Brookfield HBT, SC4-14/6R, 10 rpm, 25°C).
What is the recommended screen mesh for Micromax 1029?
Micromax 1029 is optimized for 325 stainless steel mesh screens with 12-14 μm emulsion thickness.
What is the recommended drying and firing profile for Micromax 1029?
Micromax 1029 should be leveled for 10 minutes, dried at 150°C for more than 10 minutes, then fired at 850°C peak temperature held for 10 minutes on a 30-minute total cycle in air atmosphere.
What is the soldering performance of Micromax 1029?
Micromax 1029 offers high solderability and high leach resistance with 62Sn/36Pb/2Ag solder at 230°C. Solder coverage is tested after a 5s dip in solder using Alpha 611 flux.
Is Micromax 1029 environmentally compliant?
Yes. Micromax 1029 is phthalate free, cadmium free, and nickel oxide free, meeting global environmental compliance standards including RoHS and REACH.
What substrates are compatible with Micromax 1029?
Micromax 1029 is designed for post-firing on LTCC substrates. Properties are based on tests with 96% alumina substrates. Substrates of other compositions may yield variation in performance.
What packaging sizes are available for Micromax 1029?
Micromax 1029 is available in 100G and 1000G standard packaging. Contact our sales team for bulk supply options.
Get MacDermid Alpha Micromax 1029 Bulk Pricing and Technical Support
We supply genuine MacDermid Alpha Micromax 1029 Ag/Pt conductor paste for LTCC and hybrid circuit manufacturing. Contact us for bulk pricing, sample availability, technical documents, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots.
