描述
Zytel 70G13HS1L BK031 PA66 is a 13% glass fiber reinforced, heat stabilized polyamide 66 resin designed for injection molding applications. It provides higher stiffness and dimensional stability than unreinforced PA66 while maintaining good toughness, chemical resistance and processing performance.
This grade is identified as PA66-GF13 and is designed for demanding molded components used in automotive, furniture, domestic appliances, sporting goods and construction applications. It combines glass fiber reinforcement with heat stabilization, making it suitable for parts requiring improved rigidity and thermal durability.
Compared with standard PA66 grades, Zytel 70G13HS1L BK031 PA66 offers significantly improved stiffness, lower molding shrinkage and better dimensional control. Public technical data lists tensile modulus around 5500 MPa, stress at break around 120 MPa, flexural modulus around 4900 MPa, and melting temperature around 262°C.
Shenzhen Ruiqing International Trade Co., Ltd. supplies original Zytel 70G13HS1L BK031 PA66 resin with quotation support, document assistance and global delivery service.
Zytel 70G13HS1L BK031 PA66 Key Features
- 13% glass fiber reinforced PA66
- Heat stabilized formulation
- Black resin pellet form
- High stiffness and strength
- Good dimensional stability
- Lower shrinkage than unfilled PA66
- Good heat resistance
- Suitable for injection molding
Zytel 70G13HS1L BK031 PA66 Typical Applications
- Automotive injection molded parts
- Electrical and electronic components
- Appliance components
- Furniture hardware
- Sporting goods
- Construction components
- Industrial mechanical parts
- Reinforced engineering components
Advantages
Zytel 70G13HS1L BK031 PA66 is suitable for applications requiring higher stiffness and better dimensional control than unreinforced PA66. The 13% glass fiber reinforcement improves rigidity and strength while maintaining a practical balance of toughness and processability.
The heat stabilized formulation helps molded parts retain performance under elevated temperature conditions, making this grade useful for automotive, electrical and industrial applications requiring long-term reliability.
Related Products
Zytel 70G13HS1L BK031 PA66 Typical Properties
| Property | Typical Value |
|---|---|
| Material | PA66-GF13 |
| Grade | 70G13HS1L BK031 |
| Color | Black |
| Glass Fiber Content | 13% |
| Density | 1.23 g/cm³ |
| Tensile Modulus | 5500 MPa |
| Stress at Break | 120 MPa |
| Flexural Modulus | 4900 MPa |
| Flexural Strength | 190 MPa |
| Charpy Notched Impact, 23°C | 5 kJ/m² |
| Melting Temperature | 262°C |
| Molding Shrinkage, Parallel | 0.5% |
| Molding Shrinkage, Normal | 1.0% |
| Processing Method | Injection Molding |
Processing Recommendations
Zytel 70G13HS1L BK031 PA66 is recommended for injection molding. PA66 should be dried before processing to reduce moisture and maintain surface quality, mechanical performance and dimensional stability. Processing conditions should be optimized according to part thickness, mold design, glass fiber orientation and required dimensional accuracy.
Zytel 70G13HS1L BK031 PA66 FAQ
What is Zytel 70G13HS1L BK031 PA66?
It is a 13% glass fiber reinforced, heat stabilized black PA66 resin for injection molding.
What is the main advantage of this grade?
It provides higher stiffness, strength and dimensional stability than unreinforced PA66.
Is Zytel 70G13HS1L BK031 suitable for automotive applications?
Yes. It is suitable for automotive, electrical, appliance and industrial engineering components.
What does PA66-GF13 mean?
PA66-GF13 means polyamide 66 reinforced with approximately 13% glass fiber.
Can original Zytel 70G13HS1L BK031 PA66 be supplied?
Yes. Shenzhen Ruiqing International Trade Co., Ltd. can supply original Zytel PA66 materials with quotation and document support.
Request Pricing and Product Documents
Contact Shenzhen Ruiqing International Trade Co., Ltd. for pricing, stock availability and technical support for Zytel 70G13HS1L BK031 PA66 Resin.
Disclaimer
The information above is for reference only. Final material selection and processing conditions should be verified according to official technical documents and actual application requirements.
