描述
MacDermid Alpha Micromax 6002F High-Conductivity Copper Conductor for Through-Hole Printing
Type: Copper Conductor Paste
Application: Through-Hole Printing and Soldering
Solids: 86–89%
Shelf Life: 6 months
Micromax 6002F is a high-conductivity copper conductor printed on 96% alumina substrates and fired at 600°C in a nitrogen atmosphere. It is particularly suitable for applications requiring through-hole printing and soldering, and can print thick tracks with good resolution. The formulation is cadmium and nickel free.
Micromax 6002F from MacDermid Alpha is a high-conductivity copper conductor paste developed for nitrogen-fired thick film circuits on 96% alumina substrates. It is particularly suitable for applications requiring through-hole printing and soldering, making it a useful choice for hybrid circuits that need both printed tracks and through-hole interconnects. It is also used to print thick tracks with good resolution, which supports circuit designs with higher current-carrying requirements. The composition is cadmium and nickel free, with these substances not intentionally added.
The paste carries 86–89% solids and a viscosity range of 200–300 Pa.s. Micromax 7502 is the listed solvent or thinner. Print with a 200–325 mesh stainless steel screen with 11–13 μm emulsion build-up. Mix thoroughly before use by slow, gentle hand stirring with a clean burr-free flexible plastic spatula for less than 1 minute, avoiding air entrapment. Optimum printing characteristics are generally achieved at 20–23°C, so bring the material to that temperature before printing. Allow prints to level 2–5 minutes at room temperature, then dry in a well-ventilated oven or conveyor dryer at 120°C in air or 150°C in nitrogen. Fire the dried prints in a conveyor furnace at 600°C peak held for 5 minutes on a 30-minute cycle in a nitrogen atmosphere, with an oxygen level of 5–10 ppm. Initial solder adhesion is ≥25 N, and aged solder adhesion after 48 hours at 150°C remains ≥20 N. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 6002F copper conductor paste. Original factory TDS and batch-specific COA are available on request for your thick film hybrid programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 6002F
- High-conductivity copper conductor for nitrogen-fired thick film circuits
- Printed on 96% alumina substrates and fired at 600°C in nitrogen
- Particularly suitable for through-hole printing and soldering
- Prints thick tracks with good resolution
- Excellent thermal and electrical conductivity
- Good solderability with initial adhesion ≥25 N
- Aged solder adhesion ≥20 N after 48 hrs at 150°C
- Cadmium and nickel free (no intentional addition)
- Solids 86–89%; viscosity 200–300 Pa.s
- Screen: 200–325 mesh stainless steel, 11–13 μm emulsion
- Firing: 600°C peak, 5-minute hold, 30-minute cycle in nitrogen (5–10 ppm O2)
- Thinner Micromax 7502
Primary Applications
- Through-hole printing and soldering — hybrid circuits requiring printed tracks and through-hole interconnects
- Copper conductor — per TDS application field
- Thick track printing — higher current-carrying or lower resistance paths
- Nitrogen-fired thick film circuits — on 96% alumina substrates
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Copper conductor paste | TDS: Copper Conductor Composition |
| Application | Copper conductor | TDS: Copper conductor |
| Solvent or Thinner | Micromax 7502 | TDS: Micromax 7502 |
| Solid Content | 86 to 89 % | TDS: 86 to 89 % |
| Viscosity | 200 to 300 Pa.s | TDS: Brookfield HBT, UC&S, 10 rpm, 25°C |
| Mask Mesh | 200 to 325 | TDS: 200 to 325 |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Screen Type | 200–325 mesh stainless steel with 11–13 μm emulsion build up | TDS: 200-325 mesh, 11-13 μm |
| Printing Room Temperature | 20 to 23 °C | TDS: 20-23°C |
| Leveling Time | 2 to 5 minutes at room temperature | TDS: 2-5 minutes |
| Drying (Air) | 120 °C in air | TDS: 120°C in air |
| Drying (N2) | 150 °C in nitrogen | TDS: 150°C in N2 |
| Firing Peak | 600 °C held for 5 minutes | TDS: 600°C peak, 5 min |
| Firing Cycle | 30 minutes in nitrogen atmosphere | TDS: 30 min cycle, N2 |
| Firing Oxygen Level | 5–10 ppm | TDS: 5-10 ppm |
| Initial Solder Adhesion | ≥ 25 N | TDS: ≥25 N |
| Aged Solder Adhesion (48 hrs at 150°C) | ≥ 20 N | TDS: ≥20 N |
| Thermal and Electrical Conductivity | Excellent | TDS: Product benefits |
| Through-Hole Printable | Yes | TDS: Product benefits |
| Cadmium and Nickel Free | Yes (no intentional addition) | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium and nickel free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Slow, gentle hand stirring with a clean burr-free flexible plastic spatula for less than 1 minute; avoid air entrapment | TDS: <1 minute |
| Room Temperature Before Printing | 20 to 23 °C | TDS: 20-23°C |
| Screen Mesh | 200–325 mesh stainless steel with 11–13 μm emulsion build up | TDS: 200-325 mesh, 11-13 μm |
| Leveling | 2–5 minutes at room temperature | TDS: 2-5 minutes |
| Drying | 120°C in air or 150°C in nitrogen, in a well-ventilated oven or conveyor dryer | TDS: 120°C air / 150°C N2 |
| Firing | 600°C peak held for 5 minutes on a 30-minute cycle in nitrogen, with oxygen level 5–10 ppm | TDS: 600°C peak, 5 min, 30 min cycle, N2 |
| Furnace Atmosphere | Conveyor furnace in nitrogen; exhaust into efficient extraction system; avoid oxidizing conditions in muffle | TDS: Firing |
| Thinner | Micromax 7502 | TDS: Micromax 7502 |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 6002F original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why does 6002F need a nitrogen firing atmosphere?
6002F is a copper conductor, and copper oxidizes in air at firing temperatures. The TDS specifies firing in a nitrogen atmosphere at 600°C peak, with an oxygen level of 5–10 ppm. The furnace must be exhausted into an efficient extraction system to avoid oxidizing conditions in the muffle.
What solder adhesion does 6002F deliver over heat aging?
Initial solder adhesion is 25 N or more. After aging at 150°C for 48 hours, aged solder adhesion remains 20 N or more. This supports reliable solder joints in hybrid circuits that see sustained thermal exposure.
What is through-hole printing and why does 6002F support it?
The TDS states that 6002F is particularly suitable for applications requiring through-hole printing and soldering. This makes it useful in hybrid circuits where printed tracks need to reach through drilled vias or interconnect with through-hole components.
Can 6002F print thick tracks?
Yes. The TDS states that 6002F is also used to print thick tracks with good resolution. This supports circuit designs that need thicker conductor paths for current-carrying or lower-resistance requirements.
What drying options does 6002F support?
The TDS lists two drying options: 120°C in air, or 150°C in nitrogen. Allow prints to level 2–5 minutes at room temperature before drying in a well-ventilated oven or conveyor dryer.
Is 6002F cadmium and nickel free?
Per the TDS, cadmium and nickel are not intentionally added to 6002F. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
How should 6002F be stored?
Store tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.
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We supply authentic MacDermid Alpha Micromax 6002F copper conductor paste for nitrogen-fired thick film and through-hole soldering programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium and nickel free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
