描述
MacDermid Alpha Micromax 5747 Single-Print Gold Via Fill Conductor for Multilayer Gold Hybrids
Type: Gold Via Fill Conductor
Application: Multilayer Gold Hybrids
Solids: 84.5–86.5%
Shelf Life: 6 months
Micromax 5747 is a cadmium-free gold via fill composition used to fill vias in high-density multi-layer gold hybrids. It is capable of via filling two to three dielectric layers with a single print, which reduces print passes and cycle time. When used with Micromax multi-layer dielectrics, it delivers good top surface co-planarity across the filled via field.
Micromax 5747 from MacDermid Alpha is a cadmium-free gold conductor composition developed specifically as a via fill paste for high-density multi-layer gold hybrids. It fills vias in multilayer gold circuitry, where the top surface of the filled via must remain co-planar enough to support subsequent dielectric printing and firing. A key process advantage is that 5747 can via fill two to three dielectric layers with a single print, which reduces the number of passes needed compared with filling each layer separately. When used with Micromax multi-layer dielectrics, it delivers good top surface co-planarity across the filled via field.
The paste carries 84.5–86.5% solids and a viscosity range of 180–230 Pa.s. Micromax 4577 is the listed solvent or thinner. Reported properties are based on 96% alumina substrates. Mix thoroughly before use by slow, gentle hand stirring 30 seconds to 1 minute with a clean burr-free flexible plastic spatula. Printing should be carried out in a clean, well-ventilated area at 20–23°C; a 325 mesh stainless steel screen is recommended for best via fill. Allow prints to level 5–10 minutes at room temperature in a clean environment, then dry 10–15 minutes at 150°C in a well-ventilated oven or conveyor dryer. Micromax 5747 may be fired in either a 30 or 60 minute firing cycle to a peak temperature of 850°C held for 10 minutes. Ensure that no halogenated solvent vapors enter the furnace muffle, and that air supply is clean, dry and contaminant-free, with oxidizing conditions maintained within the muffle. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5747 gold via fill conductor. Original factory TDS and batch-specific COA are available on request for your multilayer hybrid programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5747
- Cadmium-free gold via fill conductor
- Developed for high-density multi-layer gold hybrids
- Capable of via filling two to three dielectric layers with a single print
- Good top surface co-planarity when used with Micromax multi-layer dielectrics
- Solids 84.5–86.5% for consistent via fill deposition
- Viscosity 180–230 Pa.s for stable screen printing
- Screen: 325 mesh stainless steel recommended for best via fill
- Drying: 150°C for 10–15 minutes after 5–10 minutes leveling
- Firing: 30 or 60 minute cycle, 850°C peak for 10 minutes
- Thinner Micromax 4577; substrate 96% alumina
- Requires clean, dry, contaminant-free air supply and oxidizing conditions in muffle
- Store at 5–30°C; 6-month shelf life unopened
Primary Applications
- High-density multi-layer gold hybrids — via fill between gold conductor layers
- High reliability Au conductor — per TDS application field
- Multilayer via fill builds — 2–3 dielectric layers filled in a single print
- Circuits using Micromax multi-layer dielectrics — for good top surface co-planarity
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Gold via fill conductor | TDS: Gold Via Fill Conductor |
| Application | High reliability Au conductor | TDS: High reliability Au conductor |
| Solvent or Thinner | Micromax 4577 | TDS: Micromax 4577 |
| Solid Content | 84.5 to 86.5 % | TDS: 84.5 to 86.5 % |
| Viscosity | 180 to 230 Pa.s | TDS: Brookfield HAT, US&SP, SC4-14/6R, 10 rpm, 25°C |
| Mask Mesh | 325 | TDS: 325 |
| Drying Time | 10 to 15 minutes | TDS: 10 to 15 min |
| Drying Temperature | 150 °C | TDS: 150 °C |
| Theoretical Coverage | 64 cm²/g | TDS: 64 cm²/g (based on 15μm dried thickness) |
| Leveling Time | 5 to 10 minutes | TDS: 5 to 10 min |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Screen Type | 325 mesh stainless steel | TDS: 325 mesh stainless steel |
| Printing Room Temperature | 20 to 23 °C | TDS: 20-23°C |
| Firing Profile | 30 or 60 minute cycle, 850°C peak held for 10 minutes | TDS: 850°C peak, 10 min |
| Furnace Conditions | Clean, dry, contaminant-free air supply; oxidizing conditions in muffle; no halogenated solvent vapors | TDS: Firing |
| Via Fill Capability | Two to three dielectric layers with a single print | TDS: Product benefits |
| Top Surface Co-planarity | Good when used with Micromax multi-layer dielectrics | TDS: Product benefits |
| Cadmium Free | Yes (no intentional addition) | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Slow, gentle hand stirring 30 seconds–1 minute with a clean burr-free flexible plastic spatula; avoid air entrapment | TDS: 30 seconds – 1 minute |
| Room Temperature Before Printing | 20 to 23 °C | TDS: 20-23°C |
| Screen Mesh | 325 mesh stainless steel | TDS: 325 mesh stainless steel |
| Printing Environment | Clean, well-ventilated area | TDS: Printing |
| Leveling | 5–10 minutes at room temperature in a clean environment | TDS: 5-10 minutes |
| Drying | 150°C for 10–15 minutes in a well-ventilated oven or conveyor dryer | TDS: 150°C for 10-15 min |
| Firing | 30 or 60 minute cycle, 850°C peak held for 10 minutes | TDS: 30 or 60 min cycle, 850°C, 10 min |
| Furnace Atmosphere | Clean, dry, contaminant-free air; oxidizing conditions in muffle; no halogenated solvent vapors; no exhaust gases into room | TDS: Firing |
| Thinner | Micromax 4577 | TDS: Micromax 4577 |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5747 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why is single-print via fill important for 5747?
The TDS states that 5747 is capable of via filling two to three dielectric layers with a single print. Compared with filling each layer separately, this reduces the number of print passes and helps shorten the build cycle in high-density multilayer gold hybrids.
What top surface quality does 5747 provide?
When used with Micromax multi-layer dielectrics, 5747 provides good top surface co-planarity across the filled via field. This matters for subsequent dielectric printing, since uneven via tops can affect layer stacking and yield.
What screen and mixing parameters work with 5747?
A 325 mesh stainless steel screen is recommended for best via fill. Mix thoroughly by slow, gentle hand stirring 30 seconds to 1 minute with a clean burr-free flexible plastic spatula, and print at 20–23°C.
What firing profile does 5747 use?
5747 may be fired in either a 30 or 60 minute firing cycle to a peak temperature of 850°C held for 10 minutes. The furnace muffle must maintain oxidizing conditions, with clean, dry, contaminant-free air supply and no halogenated solvent vapors entering the muffle.
Does 5747 replace via fill in all gold conductor systems?
The TDS positions 5747 specifically for filling vias in high-density multi-layer gold hybrids. It is designed as a via fill paste, not a general top-layer conductor. For a different conductor role, refer to the appropriate Micromax gold conductor product.
Is 5747 cadmium free?
Per the TDS, cadmium is not intentionally added to 5747. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
How should 5747 be stored?
Store tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.
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We supply authentic MacDermid Alpha Micromax 5747 gold via fill conductor for multilayer hybrid programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.
