MacDermid Alpha Micromax 5744R Cadmium-Free Gold Conductor for Au and Al Wire Bonding

基础信息

品名
MacDermid Alpha Micromax 5744R Cadmium-Free Gold Conductor
牌号
Micromax 5744R
厂商
Element Solutions/MacDermid Alpha
材料类型
Gold Conductor Composition
产品形态
Paste
特点
Cadmium free and Phthalate free (no intentional addition); Wide bonding window; Suitable for manual and automatic gold and aluminum wire bonding; High wire pull strengths after storage at 150°C for 1,000 hours using Au and Al wires

描述




MacDermid Alpha Micromax 5744R Cadmium-Free Gold Conductor for Au and Al Wire Bonding

Product: Micromax 5744R
Type: Cadmium-Free Gold Conductor
Wire Bonding: Au and Al
Viscosity: 280–350 Pa.s
Shelf Life: 6 months

⚡ Cadmium-Free Gold Conductor with Wide Au and Al Wire Bonding Window
Micromax 5744R is a cadmium-free, phthalate-free gold conductor developed specifically for automatic wire bonding with both Al and Au wires. It is used for bonding pads on alumina and on Micromax 5704 dielectric, and can be employed in single layer and crossover Pd/Ag circuits as well as simple multilayer circuits using silver bearing conductors. High wire pull strengths are maintained after storage at 150°C for 1,000 hours.

Micromax 5744R from MacDermid Alpha is a cadmium-free and phthalate-free gold conductor developed specifically for automatic wire bonding with both Al and Au wires. It is used for bonding pads on alumina and on Micromax 5704 dielectric, and as such can be employed in single layer and crossover Pd/Ag circuits as well as simple multilayer circuits using silver bearing conductors. The conductor offers a wide bonding window and is suitable for both manual and automatic gold and aluminum wire bonding. High wire pull strengths are maintained after storage at 150°C for 1,000 hours using Au and Al wires.

The paste has a viscosity range of 280–350 Pa.s and uses Micromax 9450 as the recommended solvent or thinner. Reported properties are based on 96% alumina substrates. In crossover and simple multilayer circuits using silver bearing conductors, 5744R is compatible with many materials; however, when mixing conductors of different metallurgy (including Pd-Ag and Ag with Au), caution should be exercised—consult your Micromax representative for design and processing recommendations. A 325 stainless steel screen with 12 μm emulsion build-up is recommended, with optimum printing at 20–23°C. A Class 10,000 printing area is recommended for complex hybrids and multilayer circuits. Mix thoroughly before use by slow, gentle hand stirring 1–2 minutes with a clean burr-free spatula, avoiding air entrapment. Allow prints to level at room temperature, then dry. Fire at 850°C peak held for 10 minutes on a 30–60 minute cycle in an air atmosphere, in a well-ventilated belt, conveyor or static furnace with oxidizing conditions in the muffle. Store sealed at 5–30°C; unopened shelf life is 6 months.

Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5744R gold conductor paste. Original factory TDS and batch-specific COA are available on request for your hybrid circuit and wire bonding programs.

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Complete TDS, COA, and regulatory documentation available

Key Features of MacDermid Alpha Micromax 5744R

  • Cadmium-free and phthalate-free gold conductor
  • Developed specifically for automatic wire bonding with Al and Au wires
  • Wide bonding window for both manual and automatic bonding
  • Suitable for Au and Al wire bonding
  • High wire pull strengths after storage at 150°C for 1,000 hours
  • Bonding pads on alumina and on Micromax 5704 dielectric
  • Usable in single layer and crossover Pd/Ag circuits
  • Usable in simple multilayer circuits using silver bearing conductors
  • Viscosity 280–350 Pa.s for stable screen printing
  • Screen: 325 stainless steel with 12 μm emulsion build-up
  • Firing: 850°C peak for 10 minutes, 30–60 minute cycle, air atmosphere
  • Thinner Micromax 9450

Primary Applications

  • High reliability Au conductor — per TDS application field
  • Bonding pads on alumina — Au and Al wire bonding
  • Bonding pads on Micromax 5704 dielectric — multilayer crossover circuits
  • Pd/Ag crossover circuits — single layer and crossover designs
  • Simple multilayer circuits — using silver bearing conductors

Full Technical Specifications

Property Typical Value TDS Reference
Product Type Cadmium-free gold conductor for Au and Al wire bonding TDS: Gold Conductor Composition
Application High reliability Au conductor TDS: High reliability Au conductor
Solvent or Thinner Micromax 9450 TDS: Micromax 9450
Viscosity 280 to 350 Pa.s TDS: Brookfield HBT, 20 rpm, SC4-14/6R, 25°C±0.2°C
Mask Mesh 325 TDS: 325
Mask Emulsion 12 μm TDS: 12 μm
Screen Type 325 stainless steel with 12 μm emulsion build-up TDS: 325 stainless steel, 12 μm
Printing Room Temperature 20 to 23 °C TDS: 20-23°C
Printing Area Class 10,000 recommended for complex hybrids and multilayer circuits TDS: Class 10,000
Drying Level at room temperature, then dry TDS: Drying
Firing Profile 850°C peak held for 10 minutes on 30–60 minute cycle, air atmosphere TDS: 850°C peak, 10 min, 30-60 min cycle
Furnace Conditions Well-ventilated belt, conveyor or static furnace; oxidizing conditions in muffle; no exhaust gases entering room TDS: Firing
Substrate Compatibility 96% alumina; bonding pads on Micromax 5704 dielectric TDS: Design notes
Circuit Types Single layer and crossover Pd/Ag circuits; simple multilayer circuits using silver bearing conductors TDS: Product Description
Wire Bonding Manual and automatic Au and Al wire bonding; wide bonding window TDS: Product benefits
Wire Pull Strength After Aging High pull strengths after storage at 150°C for 1,000 hours with Au and Al wires TDS: Product benefits
Mixed Metallurgy Note Caution advised when mixing Pd-Ag and Ag with Au; consult Micromax representative TDS: Design notes
Cadmium Free Yes (no intentional addition) TDS: Product benefits
Phthalate Free Yes (no intentional addition) TDS: Product benefits
Shelf Life 6 months TDS: 6 months
Storage Temperature 5 – 30 °C TDS: 5°C – 30°C

Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.

Recommended Processing Conditions

Parameter Recommended Value TDS Reference
Mixing Prior to Use Slow, gentle hand stirring 1–2 minutes with a clean burr-free spatula; avoid air entrapment TDS: 1-2 minutes
Room Temperature Before Printing 20 to 23 °C TDS: 20-23°C
Screen Mesh 325 stainless steel with 12 μm emulsion build-up TDS: 325 stainless steel, 12 μm
Printing Area Class 10,000 recommended for complex hybrids and multilayer circuits TDS: Class 10,000
Thinning Not normally required; Micromax 9450 for minor adjustment TDS: Micromax 9450
Leveling and Drying Level at room temperature, then dry TDS: Drying
Firing 850°C peak held for 10 minutes on 30–60 minute cycle, air atmosphere TDS: 850°C peak, 10 min, 30-60 min cycle
Furnace Conditions Well-ventilated belt, conveyor or static furnace; oxidizing conditions in muffle TDS: Firing
Mixed Metallurgy Consult Micromax representative when mixing Pd-Ag and Ag with Au conductors TDS: Design notes
Contamination Control Keep composition, screens, and tools free of metal contamination; avoid dust, lint, and particulate matter TDS: General

Handling and Storage Recommendations

Storage Rules Store tightly sealed in a clean, stable environment at 5-30°C. TDS: 5°C – 30°C
Shelf Life 6 months in unopened containers from date of shipment. TDS: 6 months
Pre-use Preparation Thoroughly mix prior to use. Some settling of solids may occur during storage. TDS: thoroughly mix
Transportation Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. TDS: normal shipping conditions

Official Technical Documentation

Document Type Document Introduction Document Request
TDS MacDermid Alpha Micromax 5744R original factory technical data sheet Request TDS
COA Batch-specific certificate of analysis Request COA
SDS Safety Data Sheet for handling and storage Request SDS

Frequently Asked Questions

Why is 5744R suited to Pd/Ag crossover and multilayer circuits?

5744R was developed for bonding pads on alumina and on Micromax 5704 dielectric, which makes it usable in single layer and crossover Pd/Ag circuits as well as simple multilayer circuits using silver bearing conductors. When mixing conductors of different metallurgy, the TDS advises caution and recommends consulting a Micromax representative.

What wire types does 5744R bond to?

5744R is suitable for both manual and automatic gold and aluminum wire bonding, with a wide bonding window. High wire pull strengths are maintained after storage at 150°C for 1,000 hours using Au and Al wires.

What firing profile does 5744R require?

Fire at 850°C peak held for 10 minutes on a 30–60 minute cycle in an air atmosphere. Fire in a well-ventilated belt, conveyor or static furnace, with optimized airflow to maintain oxidizing conditions in the muffle.

What screen setup is recommended for 5744R?

A 325 stainless steel screen with 12 μm emulsion build-up is recommended. A Class 10,000 printing area is also recommended for building complex hybrids and multilayer circuits, otherwise severe yield losses could occur.

Is 5744R cadmium and phthalate free?

Per the TDS, cadmium and phthalate are not intentional ingredients and are not intentionally added. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.

What thinner should be used with 5744R?

Micromax 9450 is the listed solvent or thinner. Thinning is not normally required since the composition is optimized for screen printing; use the recommended thinner only for slight viscosity adjustments or to replace evaporation losses.

How should 5744R be stored?

Store tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.

Get MacDermid Alpha Micromax 5744R Bulk Pricing and Technical Support

We supply authentic MacDermid Alpha Micromax 5744R gold conductor paste for hybrid circuit and wire bonding programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.

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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.

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