描述
MacDermid Alpha Micromax 5504N Air-Dry Conductive Silver for Heat-Sensitive Substrates
Type: Air-Dry Conductive Silver
Application: Heat-Sensitive Substrates
Viscosity: 68–92 Pa.s
Shelf Life: 3 months refrigerated
Micromax 5504N is a highly conductive air-dry / thermoset epoxy silver composition for substrates that will not tolerate high-temperature firing. It produces electrically conductive paths on paper, plastics, cloth, wood, and other heat-sensitive materials, and can be applied by screen printing, spraying, dipping, brushing, banding, or stylus. May be electroplated to provide a solderable surface.
Micromax 5504N from MacDermid Alpha is a conductive silver composition based on a suspension of specially prepared silver powder combined with an organic binder system. It is an air-dry or low-temperature cure formulation for substrates that will not tolerate high-temperature firing. The composition is formulated to produce electrically conductive paths on paper, plastics, cloth, wood, and similar materials. It can be screen printed as well as applied by spraying, dipping, brushing, banding, or stylus. Suggested uses include printed electronics, tantalum capacitors, static shielding, electrical games and toys, microwave applications, PC board repair, and electroplating base.
The paste has a viscosity range of 68–92 Pa.s and uses Micromax 4987 as the recommended thinner. It is a single-component epoxy-based preparation suitable for use as a conductive cement in lead and discrete component attachment, with good conductivity, high adhesion, and excellent resistance to abrasion. Two types are available in the family: anhydride-cured, which shows excellent thermal stability up to 250°C, and amine-cured, which starts to degrade appreciably above 200°C. Both can withstand short excursions to higher temperatures. While not suggested for direct solder, 5504N may be electroplated to provide a solderable surface. Cure can be accelerated by heating; a system that dries in 12–16 hours at 25°C can achieve the same degree of drying in less than 2 hours at 60°C or less than 1 hour at 100°C. Store refrigerated at 0–5°C; unopened shelf life is 3 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5504N air-dry conductive silver composition. Original factory TDS and batch-specific COA are available on request for your printed electronics and heat-sensitive substrate programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5504N
- Air-dry / low-temperature thermoset epoxy conductive silver composition
- Formulated for substrates that cannot tolerate high-temperature firing
- Suitable for paper, plastics, cloth, wood, and similar heat-sensitive substrates
- High conductivity for electrically conductive paths
- Single-component epoxy-based preparation, ready to use after stirring
- Good conductivity, high adhesion, and excellent abrasion resistance
- May be electroplated to provide a solderable surface
- Application by screen printing, spraying, dipping, brushing, banding, or stylus
- Viscosity 68–92 Pa.s for consistent application
- Room temperature dry in 12–16 hours at 25°C
- Accelerated dry in less than 2 hours at 60°C or less than 1 hour at 100°C
- Refrigerated storage 0–5°C; 3-month shelf life unopened
Primary Applications
- Printed electronics — conductive paths on heat-sensitive substrates
- Tantalum capacitors — conductive cement and discrete component attachment
- Static shielding — conductive layer for static dissipation
- Electrical games and toys — conductive traces on low-temperature substrates
- Microwave applications — conductive paths on heat-sensitive materials
- PC board repair — conductive repair traces without high-temperature firing
- Electroplating base — conductive base layer for subsequent plating
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Air-dry / thermoset epoxy conductive silver composition | TDS: Conductive Silver Compositions for General Purpose Air-Dry Applications |
| Application | Tantalum capacitor | TDS: Tantalum capacitor |
| Solvent or Thinner | Micromax 4987 | TDS: Micromax 4987 |
| Viscosity | 68 to 92 Pa.s | TDS: Brookfield HBF, #4 spindle, 10 rpm |
| Substrate Compatibility | Paper, plastics, cloth, wood, and other heat-sensitive substrates | TDS: Product Description |
| Application Methods | Screen printing, spraying, dipping, brushing, banding, stylus | TDS: Application methods |
| Cured Film Thickness (Screen Print) | 12 to 20 μm (0.48 to 0.8 mil) | TDS: Coverage |
| Cured Film Thickness (Brush/Band/Dip/Spray) | 13 to 18 μm (0.5 to 0.7 mil) | TDS: Coverage |
| Cure Type | Air dry or low temperature thermoset (epoxy) | TDS: Effect of curing temperatures |
| Room Temperature Dry Time | 12 to 16 hours at 25°C | TDS: Effect of curing temperatures |
| Dry Time at 60°C | Less than 2 hours | TDS: Effect of curing temperatures |
| Dry Time at 100°C | Less than 1 hour | TDS: Effect of curing temperatures |
| Thermal Stability (Anhydride-Cured) | Excellent up to 250°C | TDS: Design |
| Thermal Stability (Amine-Cured) | Degrades above 200°C | TDS: Design |
| Electroplating | May be electroplated to provide a solderable surface | TDS: Design |
| Thermal Conductivity (Cured Film) | 0.04 J/(cm·s·°C) | TDS: Typical Physical Properties |
| Specific Heat (Cured Film) | 0.30 J/(g·°C) | TDS: Typical Physical Properties |
| Modulus of Elasticity (Tensile) | 4 x 10¹⁰ Pa | TDS: Typical Physical Properties |
| Poisson’s Ratio | 0.35 | TDS: Typical Physical Properties |
| Shelf Life | 3 months | TDS: 3 months |
| Storage Temperature | 0 to 5 °C refrigerated | TDS: 0°C – 5°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. Cure schedules are a function of time versus temperature up to the point of degradation of the organic system.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Stir to redisperse solids; use as received consistency | TDS: Application methods |
| Thinning | Micromax 4987 thinner for replacing solvent losses or minor adjustments | TDS: Micromax 4987 |
| Application Methods | Screen printing, spraying, dipping, brushing, banding, stylus | TDS: Application methods |
| Screen Mesh for Printing | 165 or 200 mesh screen for 12–20 μm cured film | TDS: Coverage |
| Drying (Room Temperature) | 12–16 hours at 25°C | TDS: Effect of curing temperatures |
| Drying (Accelerated) | < 2 hours at 60°C; < 1 hour at 100°C | TDS: Effect of curing temperatures |
| Drying Ovens | Continuous, box oven, or infrared | TDS: Effect of curing temperatures |
| Heat Application | Apply heat from the bottom up to permit internal gases to escape | TDS: Effect of curing temperatures |
| Post-Cure Electroplating | May be electroplated to provide a solderable surface | TDS: Design |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at refrigerated temperature between 0°C and 5°C. Room temperature storage is not recommended. | TDS: 0°C – 5°C |
| Shelf Life | 3 months in unopened containers from date of shipment. | TDS: 3 months |
| Ageing Behavior | Gradual polymerization with viscosity increase and mechanical separation can be expected over a few months. | TDS: Storage and shelf life |
| Refrigerated Handling | Allow material to equilibrate to room temperature before opening to prevent moisture pickup from condensation. | TDS: Storage and shelf life |
| Solvent Handling | Observe safety precautions recommended by the solvent supplier when handling and using organic solvents. | TDS: Application methods |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5504N original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why is 5504N suitable for heat-sensitive substrates?
The TDS states that 5504N is an air-dry or low temperature cure formulation for substrates that will not tolerate high-temperature firing. It is formulated for conductive paths on paper, plastics, cloth, wood, and similar materials, with room-temperature drying in 12–16 hours.
How does drying versus curing work for 5504N?
In an air-dry system, the metal-binder film is formed when the solvent evaporates. In a thermoset system, the solvent is removed first, then a chemical reaction of binder materials provides a higher temperature resistant binder film. The TDS treats these as two distinct steps for 5504N.
How fast can 5504N dry at elevated temperature?
A composition that dries in 12–16 hours at 25°C can reach the same degree of drying in less than 2 hours at 60°C or less than 1 hour at 100°C. Apply heat from the bottom up so internal gases can escape before the top surface dries.
How does anhydride-cured versus amine-cured 5504N compare?
The TDS states that anhydride-cured compositions show excellent thermal stability up to 250°C, whereas amine-cured products start to degrade appreciably above 200°C with attendant loss of properties. Both systems can withstand short excursions to higher temperatures.
Can 5504N be soldered directly?
Direct solder is not suggested. However, 5504N may be electroplated to provide a solderable surface. This makes it suitable as an electroplating base layer in applications where solder attachment is required.
What cured film thickness does 5504N give?
Screen printing with a 165 or 200 mesh screen gives a cured film of 12–20 μm (0.48–0.8 mil). Brush, band, dip, or spray application typically gives 13–18 μm (0.5–0.7 mil). Thinner films increase coverage but raise sheet resistivity.
How should 5504N be stored?
Store refrigerated at 0–5°C. Room temperature storage is not recommended. Unopened shelf life is 3 months. Allow the material to equilibrate to room temperature before opening to prevent moisture pickup from condensation.
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We supply authentic MacDermid Alpha Micromax 5504N air-dry conductive silver composition for printed electronics, tantalum capacitors, and heat-sensitive substrate programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots.
