MacDermid Alpha Micromax 5487 Green Thermoset Epoxy Encapsulant for Hybrid Circuits & Chip Components

基础信息

品名
MacDermid Alpha Micromax 5487 Green Thermoset Epoxy Encapsulant
牌号
Micromax 5487
厂商
Element Solutions/MacDermid Alpha
材料类型
Thermoset Epoxy Encapsulant
产品形态
Paste
特点
Smooth surface with excellent hardness; Non-flammable single component epoxy type; Thermoset process (180-200°C, 20-30 min); High adhesion; Good Printability; Good solvent and environmental resistance

描述




MacDermid Alpha Micromax 5487 Green Thermoset Epoxy Encapsulant for Hybrid Circuits & Chip Components

Product: Micromax 5487
Type: Thermoset Epoxy Encapsulant
Application: Hybrid Circuits, Chip Components
Color: Green
Shelf Life: 3 months refrigerated

⚡ Green Thermoset Epoxy Encapsulant with Smooth Surface and Excellent Hardness
Micromax 5487 is a green, single-component thermoset epoxy encapsulant for hybrid circuits, resistor networks, and chip components. It delivers a smooth surface with excellent hardness, high adhesion, good printability, and good solvent and environmental resistance. Cures at 180–200°C for 20–30 minutes.

Micromax 5487 from MacDermid Alpha is part of the 548X polymer composition series, developed for encapsulation on hybrid circuits, resistor networks, and chip components. The polymer is applied to ceramic substrates by screen printing and then cured at 180–200°C. It is a non-flammable single-component epoxy type, which simplifies handling and eliminates mixing errors. The cured film provides a smooth surface with excellent hardness, high adhesion, good printability, and good solvent and environmental resistance.

The paste carries a viscosity range of 50–110 Pa.s and uses Micromax 5490 as the recommended thinner. For optimum smoothness, double-pass squeegee printing is recommended. A 200 mesh stainless steel screen with 20 μm emulsion and a 70 durometer squeegee gives a cured thickness of 12–14 μm. Print at 20–23°C after bringing the material to that temperature. Allow prints to level 5–10 minutes at room temperature, then dry at 150°C for 10 minutes. Cure at 180–200°C for 20–30 minutes; higher curing temperatures will darken the polymer film, and fast curing can be achieved with an infrared dryer. After PCT, bulk resistivity exceeds 1×10¹² Ω·cm and insulation resistivity exceeds 3×10¹² Ω·cm. No appearance change occurs after 5-hour immersion in acetone, MEK, 10 wt% NaOH, or 10 vol% HCl at 25°C. Store refrigerated at 0–5°C; unopened shelf life is 3 months.

Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5487 green thermoset epoxy encapsulant. Original factory TDS and batch-specific COA are available on request for your hybrid circuit and chip component programs.

Request Sample, TDS & Quotation
Complete TDS, COA, and regulatory documentation available

Key Features of MacDermid Alpha Micromax 5487

  • Green, single-component thermoset epoxy encapsulant
  • Smooth surface with excellent hardness
  • Non-flammable single-component epoxy type
  • Thermoset process at 180–200°C for 20–30 minutes
  • High adhesion on glass and alumina substrates
  • Good printability for hybrid circuits and chip components
  • Good solvent and environmental resistance
  • Viscosity 50–110 Pa.s for consistent screen printing
  • Screen: 200 mesh stainless steel, 20 μm emulsion, 70 durometer squeegee
  • Cured thickness 12–14 μm
  • Solvent resistance: no appearance change in acetone or MEK
  • Acid and alkali resistance: no appearance change in 10% HCl or 10% NaOH

Primary Applications

  • Hybrid circuit encapsulation — protective layer over hybrid circuit assemblies
  • Resistor networks — encapsulation for network-type resistor components
  • Chip components — encapsulation for chip-type electronic components
  • Ceramic substrate circuits — screen-printed encapsulant for 180–200°C cure processes

Full Technical Specifications

Property Typical Value TDS Reference
Product Type Thermoset epoxy encapsulant TDS: Polymer Series Composition
Application Encapsulant TDS: Encapsulant
Color Green TDS: Green
Solvent or Thinner Micromax 5490 TDS: Micromax 5490
Blend Member or Series 548Xsrs TDS: 548Xsrs
Viscosity 50 to 110 Pa.s TDS: Brookfield HAT, UC&SP, SC4-14/6R, 10 rpm, 25°C±0.5°C
Mask Mesh 200 TDS: 200
Cured Thickness 12 to 14 μm TDS: 12-14 μm cured
Printing Screen 200 mesh stainless steel, 20 μm emulsion, 70 durometer squeegee TDS: 200 mesh, 20 μm, 70 durometer
Printing Room Temperature 20 to 23 °C TDS: 20°C – 23°C
Leveling Time 5 to 10 minutes at room temperature TDS: 5-10 minutes
Drying Schedule 10 minutes at 150°C TDS: 150°C for 10 min
Curing Schedule 180 to 200°C for 20 to 30 minutes TDS: 180-200°C for 20-30 min
Bulk Resistivity After PCT > 1×10¹² Ω·cm TDS: > 1×10¹²
Insulation Resistivity After PCT > 3×10¹² Ω·cm TDS: > 3×10¹²
Solvent Resistance (Acetone) No appearance change (5 hrs immersion at 25°C) TDS: No appearance change
Solvent Resistance (MEK) No appearance change (5 hrs immersion at 25°C) TDS: No appearance change
Alkali Resistance (10 wt% NaOH) No appearance change (5 hrs immersion at 25°C) TDS: No appearance change
Acid Resistance (10 vol% HCl) No appearance change (5 hrs immersion at 25°C) TDS: No appearance change
Adhesion (Glass Substrate) OK, initial and after PCT TDS: OK
Adhesion (Alumina Substrate) OK, initial and after PCT TDS: OK
Shelf Life 3 months TDS: 3 months
Storage Temperature 0 to 5 °C refrigerated TDS: 0°C – 5°C

Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. PCT: pressure cooker test at 125°C, 2 atmospheres, for 3 hours. Adhesion test: crosscut Scotch tape peel test on 100 pads.

Recommended Processing Conditions

Parameter Recommended Value TDS Reference
Mixing Prior to Use Slow, gentle hand stirring 1–2 minutes with a clean burr-free flexible plastic spatula; avoid air entrapment TDS: 1-2 minutes
Room Temperature Before Printing 20 to 23 °C TDS: 20°C – 23°C
Screen Mesh 200 mesh stainless steel, 20 μm emulsion, 70 durometer squeegee TDS: 200 mesh, 20 μm, 70 durometer
Printing Method Double pass squeegee recommended for optimum smoothness TDS: Design
Cured Thickness 12–14 μm TDS: 12-14 μm cured
Leveling 5–10 minutes at room temperature TDS: 5-10 minutes
Drying 150°C for 10 minutes TDS: 150°C for 10 min
Curing 180–200°C for 20–30 minutes TDS: 180-200°C for 20-30 min
Thinning Not normally required; Micromax 5490 for minor adjustment TDS: Micromax 5490

Handling and Storage Recommendations

Storage Rules Store tightly sealed in a clean, stable environment at refrigerated temperature between 0°C and 5°C. Room temperature storage is not recommended. TDS: 0°C – 5°C
Shelf Life 3 months in unopened containers from date of shipment. TDS: 3 months
Ageing Behavior Gradual polymerization with viscosity increase and mechanical separation can be expected over a few months. TDS: Storage and shelf life
Refrigerated Handling Allow material to equilibrate to room temperature before opening to prevent moisture pickup from condensation. TDS: Storage and shelf life
Transportation Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. TDS: normal shipping conditions

Official Technical Documentation

Document Type Document Introduction Document Request
TDS MacDermid Alpha Micromax 5487 original factory technical data sheet Request TDS
COA Batch-specific certificate of analysis Request COA
SDS Safety Data Sheet for handling and storage Request SDS

Frequently Asked Questions

How does 5487 differ from 5480 and 5483?

All three belong to the 548X polymer series with the same cure schedule (180–200°C for 20–30 minutes) and the same electrical and chemical resistance profile. 5487 is green with viscosity 50–110 Pa.s. 5480 is white (40–70 Pa.s) and 5483 is blue (85–150 Pa.s). The color and viscosity differences help distinguish encapsulants visually and match the print process.

What electrical performance does 5487 provide after PCT?

Bulk resistivity after PCT is greater than 1×10¹² Ω·cm, and insulation resistivity after PCT is greater than 3×10¹² Ω·cm. The PCT is a pressure cooker test at 125°C, 2 atmospheres, for 3 hours.

How does 5487 handle chemical exposure?

The TDS reports no appearance change after 5-hour immersion at 25°C in acetone, MEK, 10 wt% NaOH, or 10 vol% HCl. This covers common solvents, alkali, and acid exposure.

How is adhesion tested on 5487?

Adhesion is tested by crosscut Scotch tape peel on 100 pads, on both glass and alumina substrates, both initial and after PCT. The TDS reports OK results in all four cases.

How should 5487 be cured?

Cure at 180–200°C for 20–30 minutes. Higher curing temperatures will cause darkening of the polymer film. Fast curing can be achieved with an infrared dryer, with conditions optimized for dryer type and paste color.

How should 5487 be stored?

Store refrigerated at 0–5°C. Room temperature storage is not recommended. Unopened shelf life is 3 months. Allow the material to equilibrate to room temperature before opening to prevent moisture pickup from condensation.

What is the recommended screen setup for 5487?

A 200 mesh stainless steel screen with 20 μm emulsion thickness and a 70 durometer squeegee, printing to a cured thickness of 12–14 μm. Double-pass squeegee printing is recommended for optimum smoothness.

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We supply authentic MacDermid Alpha Micromax 5487 green thermoset epoxy encapsulant for hybrid circuit and chip component programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.

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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots.

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