描述
MacDermid Alpha Micromax 5434I Platable Silver C1 Termination for All-Size Chip Resistors
Type: Platable Silver C1 Termination
Application: Chip Resistor (all sizes incl. 0402)
Solids: 79–80%
Shelf Life: 6 months
Micromax 5434I is a platable silver termination composition developed for chip resistor applications. It is designed to manufacture all size components including 0402, with excellent print definition, high acid resistance, excellent post-plating adhesion, and fast firing on an 850°C/30 min profile.
Micromax 5434I from MacDermid Alpha is a platable silver termination composition developed specifically for chip resistor applications. It is intended to be applied to ceramic substrates by screen printing and fired in a conveyor furnace in an air (oxidizing) atmosphere. The composition is designed to manufacture all size components including 0402, which makes it a versatile choice across a broad chip resistor portfolio. It also delivers excellent print definition, high acid resistance, and excellent post-plating adhesion after firing.
The paste carries 79–80% solids and a viscosity range of 100–130 Pa.s. Micromax 9252 is the listed solvent or thinner. Reported properties are based on 96% alumina substrates. Print with a 325 mesh stainless steel screen with 10–15 μm emulsion to a dried thickness of 16–20 μm, corresponding to a fired thickness of 9–11 μm. Recommended film thickness is 16–20 μm dried and 9–11 μm fired. Allow prints to level at room temperature for 5–10 minutes, then dry at 150°C for 10 minutes. Fire on a 30-minute cycle to a peak of 850°C held for 10 minutes. Resistivity is ≤4 mΩ/sq at 10μm fired thickness. Post-plated adhesion exceeds 20 N after aging 48 hours at 125°C. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5434I platable silver C1 termination paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5434I
- Platable silver C1 termination for chip resistor applications
- Designed for all size components, including 0402
- Excellent print definition for fine termination features
- High acid resistance for demanding plating processes
- Excellent post-plating adhesion (>20 N after aging 48 hrs at 125°C)
- Fast firing: 850°C / 30 min profile
- Solids 79–80% for consistent deposition
- Viscosity 100–130 Pa.s for stable screen printing
- Screen: 325 mesh stainless steel, 10–15 μm emulsion
- Dried thickness 16–20 μm; fired thickness 9–11 μm
- Resistivity ≤4 mΩ/sq at 10μm fired thickness
- Thinner Micromax 9252; substrate 96% alumina
Primary Applications
- Chip resistor edge termination — platable silver C1 termination layer
- 0402 and all-size chip resistors — designed for all size components
- Post-plating processes — where high acid resistance and post-plating adhesion matter
- High-volume chip resistor production — fast firing on 850°C / 30 min profile
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Platable silver C1 termination paste | TDS: Platable Silver C1 Termination |
| Application | Resistor termination | TDS: Resistor termination |
| Solvent or Thinner | Micromax 9252 | TDS: Micromax 9252 |
| Solid Content | 79 to 80 % | TDS: 79 to 80 % |
| Viscosity | 100 to 130 Pa.s | TDS: Brookfield HAT, UC&SP, SC-14/6R, 10 rpm, 25°C |
| Mask Mesh | 325 | TDS: 325 |
| Mask Emulsion | 10 to 15 μm | TDS: 10 to 15 μm |
| Drying Time | 10 minutes | TDS: 10 min |
| Drying Temperature | 150 °C | TDS: 150 °C |
| Recommended Dried Film Thickness | 16 to 20 μm | TDS: 16 to 20 μm |
| Recommended Fired Film Thickness | 9 to 11 μm | TDS: 9 to 11 μm |
| Leveling Time | 5 to 10 minutes | TDS: 5 to 10 min |
| Resistivity | ≤ 4 mΩ/sq at 10μm fired thickness | TDS: ≤4 mOhm per square |
| Firing Peak Temperature | 850 °C | TDS: 850°C |
| Firing Peak Hold | 10 minutes | TDS: held for 10 minutes |
| Total Firing Cycle | 30 minutes | TDS: 30 minute firing cycle |
| Post Plated Adhesion | > 20 N after aging 48 hrs at 125°C | TDS: Post Plated Adhesion aged 48hr@125°C > 20N |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Printing Room Temperature | 20 to 23 °C | TDS: 20°C – 23°C |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. Adhesion test conditions: wire peel test on 2mm × 2mm pad, 4μm Ni + 8μm Sn/Pb plating, Alpha 611 RMA flux, 62Sn/36Pb/2Ag at 220°C second dip.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Slow, gentle hand stirring 0.5–1 minute with a clean burr-free flexible plastic spatula; avoid air entrapment | TDS: 0.5-1 minutes |
| Room Temperature Before Printing | 20 to 23 °C | TDS: 20°C – 23°C |
| Screen Mesh | 325 mesh stainless steel with 10–15 μm emulsion | TDS: 325-mesh, 10-15 μm |
| Dried / Fired Thickness | Dried 16–20 μm; fired 9–11 μm | TDS: 16-20 μm dried / 9-11 μm fired |
| Leveling | 5–10 minutes at room temperature in a clean, draught-free environment | TDS: 5-10 minutes |
| Drying | 150°C for 10 minutes in well-ventilated oven or conveyor dryer | TDS: 150°C for 10 min |
| Firing | 30-minute cycle, peak 850°C held for 10 minutes, air atmosphere | TDS: 850°C x 10 min, 30 min cycle |
| Furnace Atmosphere | Clean, dry air free of contaminants; oxidizing conditions in muffle; avoid halogenated solvent vapors | TDS: Firing |
| Thinner | Micromax 9252 | TDS: Micromax 9252 |
| Substrates | 96% alumina; other compositions and substrate processing may vary | TDS: 96% alumina |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5434I original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Can 5434I handle 0402 chip sizes?
Yes. The TDS states that 5434I is designed to manufacture all size components including 0402. Excellent print definition is one of the reasons it can hold consistent termination geometry on the smallest chips.
What is the post-plated adhesion of 5434I?
Post plated adhesion is greater than 20 N after aging 48 hours at 125°C. The test uses a 2mm × 2mm pad with 4μm Ni and 8μm Sn/Pb plating, Alpha 611 RMA flux, and 62Sn/36Pb/2Ag at 220°C second dip.
What firing atmosphere does 5434I need?
The TDS specifies an air (oxidizing) atmosphere. Air flows and extraction rates should be optimized to maintain oxidizing conditions in the muffle, and furnace gases should not enter the room. Halogenated solvent vapors should be kept out of the furnace.
How thick is the fired 5434I film?
A 325 mesh stainless steel screen with 10–15 μm emulsion gives a dried thickness of 16–20 μm and a fired thickness of 9–11 μm.
Why does 5434I need a specific print room temperature?
The TDS notes that optimum printing characteristics are achieved at 20–23°C. Bringing the material to that range before printing helps keep rheology and print definition consistent.
What is the resistivity of the fired 5434I layer?
Resistivity is 4 mΩ/sq or less at 10μm fired thickness. This supports low-resistance termination performance in chip resistor assemblies.
What thinner should be used with 5434I?
Micromax 9252 is the listed solvent or thinner. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.
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We supply authentic MacDermid Alpha Micromax 5434I platable silver C1 termination paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots.
