描述
MacDermid Alpha Micromax 5424E Lead-Free Cadmium-Free Platable Ag/Pd C1 Termination for Small Chip Resistors
Type: Platable Ag/Pd C1 Termination
Application: Chip Resistor
Pd Content: 2%
Shelf Life: 6 months
Micromax 5424E is a lead-free, cadmium-free platable silver/palladium C1 termination for chip resistors. It delivers good control of the printed line shape for small chip sizes, high acid resistance, excellent solder leach resistance with lead-free solder, and fast firing on an 850°C/30 min profile. Cadmium, lead, nickel, and phthalate free, with 2% palladium content.
Micromax 5424E from MacDermid Alpha is a platable, lead-free, cadmium-free silver palladium C1 termination paste developed for chip resistor applications. It is positioned for high performance and green product requirements. The paste provides good control of the printed line shape for small chip sizes, which matters when resistor footprints shrink and termination geometry becomes tighter. High acid resistance, platable surface, and excellent solder leach resistance with lead-free solder support subsequent plating and soldering steps. The formulation is cadmium, lead, nickel, and phthalate free, and contains 2% palladium.
The paste carries 75.6–77.6% solids, fineness of grind at ≤20 μm and ≤10 μm, and uses Micromax 4553 as the recommended thinner. Firing follows the standard Micromax profile of 850°C peak with a 10-minute holding time on a 30-minute cycle. Typical fired adhesion is 18 N or higher. Solder compatibility covers lead-free solder with excellent solder leach resistance. The termination is compatible with the Micromax 00X1Z(00X0) resistor series. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5424E lead-free platable Ag/Pd C1 termination paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5424E
- Platable silver/palladium C1 termination for chip resistor applications
- Cadmium, lead, nickel, and phthalate free formulation (no intentional addition)
- 2% palladium content for balanced cost and performance
- Good control of the printed line shape for small chip sizes
- High acid resistance for demanding plating processes
- Platable surface ready for subsequent plating steps
- Excellent solder leach resistance with lead-free solder
- Fast firing: 850°C / 30 min profile
- Compatible with Micromax 00X1Z(00X0) resistor series
- Solids 75.6–77.6% for consistent deposition
- Fineness of grind ≤20 μm and ≤10 μm
- Typical fired adhesion ≥18 N
Primary Applications
- Chip resistor edge termination — platable Ag/Pd C1 termination layer
- Small chip size resistors — good printed line shape control
- Lead-free assemblies — designed for lead-free, cadmium-free processes
- Post-plating processes — where high acid resistance and solder leach resistance matter
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Platable silver/palladium C1 termination paste | TDS: Platable Termination for Chip Resistor Applications |
| Application | Resistor termination | TDS: Resistor termination |
| Solvent or Thinner | Micromax 4553 | TDS: Micromax 4553 |
| Solid Content | 75.6 to 77.6 % | TDS: 75.6 to 77.6 % |
| Fineness of Grind | ≤ 20 μm; ≤ 10 μm | TDS: ≤20 μm; ≤10 μm |
| Pd Content | 2 % | TDS: 2% Palladium content |
| Firing Profile | 850°C x 10 minutes peak, 30-minute cycle | TDS: Standard Profile 850°C x 10 min, 30 min |
| Ascending Rate (200°C → 500°C) | 100 °C/min | TDS: 100°C/min |
| Descending Rate (700°C → 300°C) | 85 °C/min | TDS: 85°C/min |
| Typical Fired Adhesion | ≥ 18 N | TDS: Adhesion (N) ≥18 |
| Cadmium, Lead, Nickel, Phthalate Free | Yes (no intentional addition) | TDS: Product benefits |
| Solder Compatibility | Lead-free solder; excellent solder leach resistance | TDS: Product benefits |
| Line Shape Control | Good control of printed line shape for small chip sizes | TDS: Product benefits |
| Compatible Resistor Series | Micromax 00X1Z(00X0) | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium, Lead, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Thoroughly mix to redisperse solids | TDS: thoroughly mix |
| Firing Peak | 850 °C | TDS: 850°C Peak |
| Firing Holding Time | 10 minutes | TDS: 10 min (850°C Holding Time) |
| Total Firing Cycle | 30 minutes | TDS: 30 min |
| Ascending Rate (200°C → 500°C) | 100 °C/min | TDS: 100°C/min |
| Descending Rate (700°C → 300°C) | 85 °C/min | TDS: 85°C/min |
| Thinner | Micromax 4553 | TDS: Micromax 4553 |
| Substrates | 96% alumina; other compositions may vary | TDS: 96% alumina |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5424E original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why is 5424E suitable for small chip sizes?
The TDS lists good control of the printed line shape for small chip sizes as a product benefit. As resistor footprints shrink, tighter line geometry control helps maintain reliable terminations.
What Pd content does 5424E use?
5424E contains 2% palladium. This sits between the 18% Pd of 5418 and the 0.5% Pd of 5421E, giving a middle option for cost and performance depending on the resistor design.
Does 5424E work with lead-free solder?
Yes. The TDS lists excellent solder leach resistance with lead-free solder, and the paste is positioned as a lead-free, cadmium-free product. This supports lead-free chip resistor assembly.
What adhesion does 5424E achieve after firing?
Typical fired adhesion is 18 N or higher, per the TDS Typical Fired Properties. This supports reliable termination performance in chip resistor assemblies.
Which resistor series are compatible with 5424E?
The TDS lists compatibility with Micromax 00X1Z(00X0) resistor series. This makes 5424E suitable for chip resistor builds that already use those resistor systems.
Is 5424E free of cadmium, lead, nickel and phthalate?
Per the TDS, cadmium, lead, nickel, and phthalate are not intentional ingredients and are not intentionally added. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
What thinner should be used with 5424E?
Micromax 4553 is the listed solvent or thinner. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.
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We supply authentic MacDermid Alpha Micromax 5424E lead-free platable Ag/Pd C1 termination paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium, Lead, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
