描述
MacDermid Alpha Micromax 5402C Platable Silver C2 Edge Termination for Chip Resistors
Type: Platable Silver C2 Edge Termination
Application: Chip Resistor
Firing Peak: 600–620°C
Shelf Life: 6 months
Micromax 5402C is a platable silver C2 edge termination developed for chip resistor applications. It delivers low temperature firing at 600–620°C, excellent dipping performance, excellent cosmetics, excellent post-plating adhesion, and high acid resistance. Cadmium free, with rheology optimized for chip resistor edge dipping.
Micromax 5402C from MacDermid Alpha is a platable silver C2 edge termination paste developed specifically for chip resistor applications. It balances low cost and high performance. The paste rheology has been optimized for dipping of the chip resistor edges after the alumina substrate has been broken into strip form. It delivers low temperature firing, excellent dipping performance, excellent cosmetics, excellent post-plating adhesion, and high acid resistance. The formulation is cadmium free.
The paste has a viscosity range of 45–55 Pa.s and uses Micromax 9245 as the recommended thinner. Reported properties are based on 96% alumina substrates. After dipping, allow parts to level at room temperature for 5–10 minutes, then dry at 150°C for 10 minutes. Fire to a peak temperature of 600–620°C for 10 minutes at peak, with a total firing cycle of 30 minutes. Allow adequate time (10 minutes) during the heating cycle to avoid entrapment of organics in the fired film. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5402C platable silver C2 edge termination paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5402C
- Platable silver C2 edge termination for chip resistor applications
- Low temperature firing at 600–620°C peak
- Excellent dipping performance with rheology optimized for edge dipping
- Excellent cosmetics on dipped terminations
- Excellent post-plating adhesion
- High acid resistance
- Cadmium free formulation (no intentional addition)
- Viscosity 45–55 Pa.s for consistent dipping
- Drying: 150°C for 10 minutes
- Firing: 600–620°C peak, 10-minute hold, 30-minute total cycle
- Heating phase 10 minutes to avoid organics entrapment
- Thinner Micromax 9245; substrate 96% alumina
Primary Applications
- Chip resistor edge termination — platable silver C2 termination layer
- Resistor termination — per TDS application field
- 96% alumina substrates — after break into strip form
- Post-plating processes — where high acid resistance and post-plating adhesion are required
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Platable silver C2 edge termination paste | TDS: Platable C2 Edge Termination for Chip Resistor Applications |
| Application | Resistor termination | TDS: Resistor termination |
| Solvent or Thinner | Micromax 9245 | TDS: Micromax 9245 |
| Viscosity | 45 to 55 Pa.s | TDS: Brookfield RVT, UC&S, 10 rpm |
| Drying Time | 10 minutes | TDS: 10 min |
| Drying Temperature | 150 °C | TDS: 150 °C |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Dipping | Optimized for chip resistor edge dipping after alumina break into strip form; thinner Micromax 9245 for minor adjustments only | TDS: Dipping |
| Leveling | 5 to 10 minutes at room temperature | TDS: 5-10 minutes |
| Firing Peak Temperature | 600 to 620 °C | TDS: 600-620°C |
| Firing Peak Hold | 10 minutes | TDS: 10 minutes at peak |
| Total Firing Cycle | 30 minutes | TDS: 30 minutes |
| Heating Phase | 10 minutes to avoid organics entrapment | TDS: allow adequate time (10 minutes) |
| Cadmium Free | Yes (no intentional addition) | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Thoroughly mix to redisperse solids | TDS: thoroughly mix |
| Dipping | Dip chip resistor edges after alumina break into strip form | TDS: Dipping |
| Leveling | 5–10 minutes at room temperature | TDS: 5-10 minutes |
| Drying | 150°C for 10 minutes | TDS: 150°C for 10 min |
| Firing | Peak 600–620°C, 10-minute hold, total cycle 30 minutes | TDS: 600-620°C, 10 min peak, 30 min total |
| Heating Phase | Allow 10 minutes to avoid organics entrapment | TDS: 10 minutes |
| Thinning | Not normally recommended; Micromax 9245 for minor adjustment | TDS: Micromax 9245 |
| Substrates | 96% alumina; other compositions may vary | TDS: 96% alumina |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5402C original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why is 5402C specifically designed for dipping?
The TDS states that the paste rheology has been optimized for dipping of the chip resistor edges after the alumina substrate is broken into strip form. This is a different process from screen printing and is the core use case for 5402C.
How does 5402C achieve low temperature firing?
The firing peak is 600–620°C for 10 minutes, with a total cycle of 30 minutes. This is lower than typical thick film conductor firings and supports the low temperature requirement stated in the product benefits.
Why is the heating phase important for 5402C?
The TDS advises allowing 10 minutes during the heating cycle. This avoids entrapment of organics in the fired film, which can otherwise affect appearance, adhesion, or post-plating results.
What post-plating performance does 5402C offer?
The product benefits list excellent post-plating adhesion and high acid resistance. These characteristics matter when the termination is subsequently plated and exposed to plating chemistries.
Is 5402C cadmium free?
Per the TDS, cadmium is not intentionally added to 5402C. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
What thinner should be used with 5402C?
Micromax 9245 is the listed solvent or thinner. Thinning is not normally recommended, but Micromax 9245 may be used for minor adjustments to dipping behavior.
How should opened containers of 5402C be stored?
Keep containers tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.
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We supply authentic MacDermid Alpha Micromax 5402C platable silver C2 edge termination paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.
