MacDermid Alpha Micromax 5715R Gold Conductor for Au and Al Wire Bonding in High-Density Hybrids

基础信息

品名
MacDermid Alpha Micromax 5715R Gold Conductor for Au and Al Wire Bonding
牌号
Micromax 5715R
厂商
Element Solutions/MacDermid Alpha
材料类型
Gold Conductor Composition
产品形态
Paste
特点
Good automatic gold wire bonding yields with 1 & 2 mil gold wire; excellent bond results with 1 mil Al wire; excellent wire bond acceptance over a broad thickness range; cadmium free (no intentional addition)

描述




MacDermid Alpha Micromax 5715R Gold Conductor for Au and Al Wire Bonding in High-Density Hybrids

Product: Micromax 5715R
Type: Gold Conductor
Application: High-Density Hybrids
Viscosity: 450–600 Pa.s
Shelf Life: 6 months

⚡ Gold Conductor for Both Au and Al Wire Bonding with Stable Pull Strengths
Micromax 5715R is a cadmium-free, screen printable gold conductor used as a gold wire bondable conductor in high-density hybrids. It offers good automatic gold wire bonding yields with 1-mil and 2-mil wire, excellent wire bond acceptance over a broad thickness range, and excellent bond results with 1 mil Al wire. Pull strength remains stable at both 6 μm and 10 μm fired thickness.

Micromax 5715R from MacDermid Alpha is a cadmium-free, screen printable gold conductor composition developed for high-density hybrid circuits. It is used as a gold wire bondable conductor, delivering good automatic gold wire bonding yields with both 1-mil and 2-mil gold wire, and excellent wire bond acceptance over a broad thickness range. In addition to gold wire, excellent bond results have been shown with 1 mil Al wire, which gives flexibility in wire material selection. Wirebonded properties show stable pull strengths at different fired thicknesses, with all wire breaks and no bond lifts.

The paste carries a viscosity range of 450–600 Pa.s and uses Micromax 8672 as the recommended solvent or thinner. Reported properties are based on 96% alumina substrates. A 325 mesh stainless steel screen with 12 μm (0.5 mil) emulsion thickness is recommended. Allow the wet print to level 10–15 minutes at room temperature, then dry at 150°C for 15 minutes. Fire dried prints in a belt furnace on a 30-minute cycle with a peak temperature of 850°C for 10 minutes. No significant changes in performance characteristics were seen after multiple refiring at 850°C. Bonding was tested on a Hughes 2460-III Automatic Gold Wire Bonder, stage 150°C, ceramic tool, 1.0 mil Au wire, tensile strength 8 g min, elongation 3–5%. Store sealed at 5–30°C; unopened shelf life is 6 months.

Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5715R gold conductor paste. Original factory TDS and batch-specific COA are available on request for your high-density hybrid programs.

Request Sample, TDS & Quotation
Complete TDS, COA, and regulatory documentation available

Key Features of MacDermid Alpha Micromax 5715R

  • Cadmium-free, screen printable gold conductor composition
  • Developed for gold wire bondable applications in high-density hybrids
  • Good automatic gold wire bonding yields with 1-mil and 2-mil wire
  • Excellent bond results with 1 mil Al wire
  • Excellent wire bond acceptance over a broad thickness range
  • Stable pull strength at both 6 μm and 10 μm fired thickness
  • Stable after multiple refiring at 850°C
  • Viscosity 450–600 Pa.s for stable screen printing
  • Screen: 325 mesh stainless steel with 12 μm (0.5 mil) emulsion
  • Drying: 150°C for 15 minutes after 10–15 minutes leveling
  • Firing: 30-minute cycle, 850°C peak for 10 minutes
  • Thinner Micromax 8672; substrate 96% alumina

Primary Applications

  • High-density hybrids — gold wire bondable conductor layer
  • High reliability Au conductor — per TDS application field
  • Automatic gold wire bonding — 1-mil and 2-mil gold wire
  • Aluminum wire bonding — excellent results with 1 mil Al wire

Full Technical Specifications

Property Typical Value TDS Reference
Product Type Gold conductor composition TDS: Gold Conductor Composition
Application High reliability Au conductor TDS: High reliability Au conductor
Solvent or Thinner Micromax 8672 TDS: Micromax 8672
Viscosity 450 to 600 Pa.s TDS: Brookfield HBT, UC&SP, SC4-14/6R, 10 rpm, 25°C
Mask Mesh 325 TDS: 325
Mask Emulsion 12 μm (0.5 mil) TDS: 12 μm
Drying Time 15 minutes TDS: 15 min
Drying Temperature 150 °C TDS: 150 °C
Theoretical Coverage 50 to 80 cm²/g TDS: 50 to 80 cm²/g
Recommended Film Thickness 10 μm TDS: 10 μm
Substrate Compatibility 96% alumina TDS: 96% alumina
Printing Screen 325 mesh stainless steel, 12 μm (0.5 mil) emulsion TDS: 325 mesh, 12 μm
Leveling Time 10 to 15 minutes at room temperature TDS: 10 to 15 min
Firing Profile 30-minute cycle, 850°C peak for 10 minutes TDS: 30 min cycle, 850°C for 10 min
Refiring Stability No significant changes after multiple refiring at 850°C TDS: Firing
Au Wire Bonding Good automatic gold wire bonding yields with 1-mil and 2-mil wire TDS: Product Description
Al Wire Bonding Excellent bond results with 1 mil Al wire TDS: Product Description
Wire Bond Acceptance Excellent over a broad thickness range TDS: Product Description
Bonding Test Conditions Hughes 2460-III Automatic Gold Wire Bonder, stage 150°C, ceramic tool, 1.0 mil Au wire, tensile strength 8 g min, elongation 3–5% TDS: Bonding
Pull Strength 1.0 mil Au at 6 μm 13.7 g TDS: Wirebonded Properties
Pull Strength 1.0 mil Au at 10 μm 13.0 g TDS: Wirebonded Properties
Pull Strength 2.0 mil Au at 6 μm 40.5 g TDS: Wirebonded Properties
Pull Strength 2.0 mil Au at 10 μm 39.6 g TDS: Wirebonded Properties
Failure Mode All wire breaks, no bond lifts TDS: Wirebonded Properties
Cadmium Free Yes (no intentional addition) TDS: Product Description
Shelf Life 6 months TDS: 6 months
Storage Temperature 5 – 30 °C TDS: 5°C – 30°C

Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.

Recommended Processing Conditions

Parameter Recommended Value TDS Reference
Mixing Prior to Use Thoroughly mix to redisperse solids TDS: thoroughly mix
Screen Mesh 325 mesh stainless steel with 12 μm (0.5 mil) emulsion TDS: 325 mesh, 12 μm
Leveling 10–15 minutes at room temperature TDS: 10-15 minutes
Drying 150°C for 15 minutes TDS: 15 minutes at 150°C
Firing 30-minute cycle, 850°C peak for 10 minutes, belt furnace TDS: 30 min cycle, 850°C for 10 min
Refiring Stable after multiple refiring at 850°C TDS: Firing
Thinner Micromax 8672 TDS: Micromax 8672

Handling and Storage Recommendations

Storage Rules Store tightly sealed in a clean, stable environment at 5-30°C. TDS: 5°C – 30°C
Shelf Life 6 months in unopened containers from date of shipment. TDS: 6 months
Pre-use Preparation Thoroughly mix prior to use. Some settling of solids may occur during storage. TDS: thoroughly mix
Transportation Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. TDS: normal shipping conditions

Official Technical Documentation

Document Type Document Introduction Document Request
TDS MacDermid Alpha Micromax 5715R original factory technical data sheet Request TDS
COA Batch-specific certificate of analysis Request COA
SDS Safety Data Sheet for handling and storage Request SDS

Frequently Asked Questions

How does 5715R compare with 5715G?

Both are cadmium-free gold conductors for high-density hybrids with wire bonding capability. 5715R additionally documents excellent bond results with 1 mil Al wire and includes pull strength data at both 6 μm and 10 μm fired thickness for 1.0 mil and 2.0 mil Au wire.

What pull strengths does 5715R deliver?

For 1.0 mil Au wire: 13.7 g at 6 μm fired thickness and 13.0 g at 10 μm. For 2.0 mil Au wire: 40.5 g at 6 μm and 39.6 g at 10 μm. All failures were wire breaks, with no bond lifts.

Can 5715R bond aluminum wire?

Yes. The TDS states that excellent bond results have been shown with 1 mil Al wire, in addition to the gold wire bonding capability with 1-mil and 2-mil gold wire.

What wire bonding test conditions were used for 5715R?

Bonding was tested on a Hughes 2460-III Automatic Gold Wire Bonder, stage 150°C, ceramic tool, 1.0 mil Au wire, tensile strength 8 g min, elongation 3–5%.

How stable is 5715R after refiring?

The TDS states that no significant changes in performance characteristics were seen after multiple refiring at 850°C. This supports multilayer builds where the conductor is fired more than once.

What screen setup works with 5715R?

A 325 mesh stainless steel screen with 12 μm (0.5 mil) emulsion thickness is recommended. Recommended film thickness is 10 μm, with theoretical coverage of 50–80 cm²/g.

Is 5715R cadmium free?

Per the TDS, cadmium is not intentionally added to 5715R. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.

Get MacDermid Alpha Micromax 5715R Bulk Pricing and Technical Support

We supply authentic MacDermid Alpha Micromax 5715R gold conductor paste for high-density hybrid programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.

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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium free” as used herein means cadmium is not intentionally added to the referenced product. Trace amounts may be present.

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