描述
MacDermid Alpha Micromax 5499 Co-Curable Black Thermoset Encapsulant for Hybrid Circuits
Type: Thermoset Epoxy Encapsulant
Application: Hybrid Circuits, Chip Components
Color: Black
Shelf Life: 3 months refrigerated
Micromax 5499 is a black thermoset epoxy encapsulant for hybrid circuits, resistor networks, and chip components. It is halogen-free by design, cures at 180°C for 20–30 minutes, and supports a co-curing process with edge termination, encapsulant, and marking. Cadmium, lead, nickel, and phthalate free.
Micromax 5499 from MacDermid Alpha is a black thermoset epoxy encapsulant intended for encapsulation on hybrid circuits, resistor networks, and chip components. The polymer is applied to ceramic substrates by screen printing and cured at 180°C. It is designed without halogen components, and cadmium, lead, nickel, and phthalate are not intentionally added. The cured film stays black both before and after curing for consistent appearance. A key feature of 5499 is that co-curing with edge termination, encapsulant, and marking is possible, which can consolidate process steps in hybrid circuit production.
The paste carries 73–83% solids and a viscosity range of 80–125 Pa.s. Micromax J8744 is the listed solvent or thinner and clean-up solvent. For optimum smoothness, double-pass squeegee printing is recommended. A 200 mesh stainless steel screen with 20 μm emulsion and a 70 durometer squeegee gives a cured thickness of 30 μm ± 5 μm. Print at 20–23°C after bringing the material to that temperature. Allow prints to level 5–10 minutes at room temperature, then dry at 150°C for 10 minutes. Cure at 180°C for 20–30 minutes; fast curing can be achieved with an infrared dryer, with conditions optimized for the dryer type. Store refrigerated at 0–5°C; unopened shelf life is 3 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5499 black thermoset epoxy encapsulant. Original factory TDS and batch-specific COA are available on request for your hybrid circuit and chip component programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5499
- Black, single-component thermoset epoxy encapsulant
- Non-use of halogen component as designed
- Co-curing process possible with edge termination, encapsulant, and marking
- Thermoset process at 180°C for 20–30 minutes
- Black color prior to and after curing for consistent appearance
- Cadmium, lead, nickel, and phthalate free (no intentional addition)
- Solids 73–83% at 150°C for higher film build
- Viscosity 80–125 Pa.s for consistent screen printing
- Screen: 200 mesh stainless steel, 20 μm emulsion, 70 durometer squeegee
- Cured thickness 30 ± 5 μm
- Thinner and clean-up solvent: Micromax J8744
- Refrigerated storage at 0–5°C; 3-month shelf life unopened
Primary Applications
- Hybrid circuit encapsulation — protective layer over hybrid circuit assemblies
- Resistor networks — encapsulation for network-type resistor components
- Chip components — encapsulation for chip-type electronic components
- Co-curing processes — possible with edge termination, encapsulant, and marking in a single cure
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Thermoset epoxy encapsulant | TDS: Polymer Encapsulant Composition |
| Application | Encapsulant | TDS: Encapsulant |
| Color | Black | TDS: Black |
| Solvent or Thinner | Micromax J8744 | TDS: Micromax J8744 |
| Solid Content | 73 to 83 % | TDS: 73 to 83 % |
| Viscosity | 80 to 125 Pa.s | TDS: Brookfield HBT, #14 spindle & UC, 10 rpm, 25°C |
| Mask Mesh | 200 | TDS: 200 |
| Cured Thickness | 30 ± 5 μm | TDS: 30 μm ± 5 μm |
| Printing Screen | 200 mesh stainless steel, 20 μm emulsion, 70 durometer squeegee | TDS: 200 mesh, 20 μm, 70 durometer |
| Printing Room Temperature | 20 to 23 °C | TDS: 20-23°C |
| Leveling Time | 5 to 10 minutes at room temperature | TDS: 5-10 minutes |
| Drying Schedule | 10 minutes at 150°C | TDS: 150°C for 10 min |
| Curing Schedule | 180°C for 20 to 30 minutes | TDS: 180°C for 20-30 min |
| Co-Curing Process | Possible with edge termination, encapsulant, and marking | TDS: Product benefits |
| Halogen Free | Yes (non-use of halogen component as designed) | TDS: Product benefits |
| Cadmium, Lead, Nickel, Phthalate Free | Yes (no intentional addition) | TDS: Product benefits |
| Shelf Life | 3 months | TDS: 3 months |
| Storage Temperature | 0 to 5 °C refrigerated | TDS: 0°C – 5°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cadmium, Lead, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Slow, gentle hand stirring 1–2 minutes with a clean burr-free flexible plastic spatula; avoid air entrapment | TDS: 1-2 minutes |
| Room Temperature Before Printing | 20 to 23 °C | TDS: 20-23°C |
| Screen Mesh | 200 mesh stainless steel, 20 μm emulsion, 70 durometer squeegee | TDS: 200 mesh, 20 μm, 70 durometer |
| Printing Method | Double pass squeegee recommended for optimum smoothness | TDS: Design |
| Cured Thickness | 30 ± 5 μm | TDS: 30 μm ± 5 μm |
| Leveling | 5–10 minutes at room temperature | TDS: 5-10 minutes |
| Drying | 150°C for 10 minutes | TDS: 150°C for 10 min |
| Curing | 180°C for 20–30 minutes | TDS: 180°C for 20-30 min |
| Thinning | Not normally required; Micromax J8744 for minor adjustment | TDS: Micromax J8744 |
| Clean-up Solvent | Micromax J8744 | TDS: Micromax J8744 |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at refrigerated temperature between 0°C and 5°C. Room temperature storage is not recommended. | TDS: 0°C – 5°C |
| Shelf Life | 3 months in unopened containers from date of shipment. | TDS: 3 months |
| Ageing Behavior | Gradual polymerization with viscosity increase and mechanical separation can be expected over a few months. | TDS: Storage and shelf life |
| Refrigerated Handling | Allow material to equilibrate to room temperature before opening to prevent moisture pickup from condensation. | TDS: Storage and shelf life |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5499 original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
What does co-curing mean for 5499?
The TDS lists co-curing with edge termination, encapsulant, and marking as a product benefit. This means multiple layers can potentially be cured together in a single cycle, consolidating process steps in hybrid circuit production.
Is 5499 halogen free?
Yes. The TDS states that non-use of halogen component is by design. Cadmium, lead, nickel, and phthalate are also not intentionally added. Trace amounts may be present.
What is the solid content of 5499?
Solid content at 150°C is 73–83%. This is higher than many solvent-based encapsulants, which supports thicker films at the specified cured thickness of 30 μm ± 5 μm.
What color is 5499 before and after curing?
The TDS lists black color prior to and after curing as a product benefit. Keeping the same color before and after curing helps maintain consistent appearance on the resistor body.
How should 5499 be cured?
Cure at 180°C for 20–30 minutes. Fast curing can be achieved with an infrared dryer, with conditions optimized for the type of dryer used.
How should 5499 be stored?
Store refrigerated at 0–5°C. Room temperature storage is not recommended. Unopened shelf life is 3 months. Allow the material to equilibrate to room temperature before opening to prevent moisture pickup from condensation.
What is the recommended screen setup for 5499?
A 200 mesh stainless steel screen with 20 μm emulsion thickness and a 70 durometer squeegee, printing to a cured thickness of 30 μm ± 5 μm. Double-pass squeegee printing is recommended for optimum smoothness.
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We supply authentic MacDermid Alpha Micromax 5499 black thermoset epoxy encapsulant for hybrid circuit and chip component programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cadmium, Lead, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
