描述
MacDermid Alpha Micromax 5430E Low-Temperature Platable Lead-Free Silver Termination for Chip Resistors
Type: Platable Silver Termination
Application: Chip Resistor
Firing Peak: 600–620°C
Shelf Life: 6 months
Micromax 5430E is a screen printable and platable lead-free silver termination for chip resistors. It fires at 600–620°C, delivering excellent cosmetics, excellent post-plating adhesion, high acid resistance, and low material cost. Lead, cadmium, nickel, and phthalate free.
Micromax 5430E from MacDermid Alpha is a screen printable and platable lead-free silver termination paste developed specifically for chip resistor applications. It is positioned for low cost and high performance. The paste fires at a low temperature of 600–620°C, which reduces thermal load on the substrate and supports efficient belt furnace cycles. Excellent cosmetics on the printed termination and excellent post-plating adhesion make it suitable for chip resistors that go through subsequent plating steps. High acid resistance supports long-term reliability, and the formulation is lead, cadmium, nickel, and phthalate free.
The paste carries 74–76% solids, fineness of grind at ≤20 μm and ≤10 μm, and a viscosity range of 265–335 Pa.s. Micromax 8250 is the listed solvent or thinner. Reported properties are based on 96% alumina substrates, printed with a 250 mesh stainless steel screen with approximately 20 μm emulsion to a dried thickness of 15 ± 2 μm. Recommended film thickness is 13–17 μm. Allow the wet print to level 10–15 minutes at room temperature, then dry at 150°C for 15 minutes. Fire in a belt furnace using a 30-minute cycle with a peak temperature of 600–620°C for 10 minutes. Resistivity is ≤3 mΩ/sq at 10μm. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5430E platable silver termination paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5430E
- Platable lead-free silver termination paste for chip resistor applications
- Low temperature firing at 600–620°C peak
- Excellent cosmetics on the printed termination
- Excellent post-plating adhesion for reliable plating results
- High acid resistance for demanding environments
- Screen printable formulation for standard resistor lines
- Lead, cadmium, nickel, and phthalate free (no intentional addition)
- Solids 74–76% for consistent deposition
- Viscosity 265–335 Pa.s for stable screen printing
- Screen: 250 mesh stainless steel, 20 μm emulsion; dried print 15 ± 2 μm
- Resistivity ≤3 mΩ/sq at 10μm
- Thinner Micromax 8250
Primary Applications
- Chip resistor edge termination — platable silver termination layer
- Resistor termination — per TDS application field
- Low-temperature firing processes — where substrate thermal load matters
- Lead-free assemblies — designed for lead-free processes
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Platable silver termination paste | TDS: Platable Termination for Chip Resistors |
| Application | Resistor termination | TDS: Resistor termination |
| Solvent or Thinner | Micromax 8250 | TDS: Micromax 8250 |
| Solid Content | 74 to 76 % | TDS: 74 to 76 % |
| Fineness of Grind | ≤ 20 μm; ≤ 10 μm | TDS: ≤20 μm; ≤10 μm |
| Viscosity | 265 to 335 Pa.s | TDS: Brookfield RVT, SC4-14/6R, 10 rpm, 25°C |
| Mask Mesh | 250 | TDS: 250 |
| Mask Emulsion | 20 μm | TDS: 20 μm |
| Drying Time | 15 minutes | TDS: 15 min |
| Drying Temperature | 150 °C | TDS: 150 °C |
| Recommended Film Thickness | 13 to 17 μm | TDS: 13 to 17 μm |
| Leveling Time | 5 to 10 minutes | TDS: 5 to 10 min |
| Resistivity | ≤ 3 mΩ/sq at 10μm | TDS: ≤ 3 mOhm per square |
| Firing Peak Temperature | 600 to 620 °C | TDS: 600-620°C |
| Firing Peak Hold | 10 minutes | TDS: 10 minutes @600°C |
| Total Firing Cycle | 30 minutes | TDS: 30 minutes cycle |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Lead, Cadmium, Nickel, Phthalate Free | Yes (no intentional addition) | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Lead, Cadmium, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Slow, gentle hand stirring 1–2 minutes with a clean burr-free spatula; avoid air entrapment | TDS: 1-2 minutes |
| Screen Mesh | 250 mesh stainless steel with approx. 20 μm emulsion | TDS: 250 mesh, 20 μm |
| Dried Print Thickness | 15 ± 2 μm (recommended film 13–17 μm) | TDS: 15±2 μm dried |
| Leveling | 10–15 minutes at room temperature | TDS: 10-15 minutes |
| Drying | 150°C for 15 minutes | TDS: 150°C for 15 min |
| Firing | 30-minute cycle, peak 600–620°C for 10 minutes, belt furnace | TDS: 600-620°C x 10 min, 30 min cycle |
| Ascending Rate (300°C → 500°C) | 100 °C/min | TDS: 100°C/min |
| Descending Rate (300°C → 500°C) | 75 °C/min | TDS: 75°C/min |
| Thinner | Micromax 8250 | TDS: Micromax 8250 |
| Substrates | 96% alumina; other compositions may vary | TDS: 96% alumina |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5430E original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why does 5430E fire at 600–620°C instead of 850°C?
The TDS lists 600–620°C low temperature firing as a key benefit. Lower firing temperature reduces thermal load on the substrate and supports energy-efficient belt furnace cycles, while still delivering a platable termination with high acid resistance.
Is 5430E lead-free and RoHS-friendly?
The TDS describes 5430E as a lead-free silver termination. Lead, cadmium, nickel, and phthalate are not intentional ingredients and are not intentionally added. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
What is the resistivity of 5430E?
Resistivity is 3 mΩ/sq or less at 10μm. This supports low-resistance termination performance in chip resistor assemblies.
Can 5430E go through post-plating steps?
Yes. The TDS lists excellent post-plating adhesion and high acid resistance. Both matter when the termination goes through plating chemistries after firing.
What screen configuration is recommended for 5430E?
A 250 mesh stainless steel screen with approximately 20 μm emulsion, printed to a dried thickness of 15 ± 2 μm. Reported properties are based on 96% alumina substrates.
What mixing procedure does 5430E need?
Slow, gentle hand stirring with a clean burr-free spatula (flexible plastic or stainless steel) for 1–2 minutes. Take care to avoid air bubble entrapment during mixing.
What thinner should be used with 5430E?
Micromax 8250 is the listed solvent or thinner. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.
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We supply authentic MacDermid Alpha Micromax 5430E platable silver termination paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Lead, Cadmium, Nickel and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
