描述
MacDermid Alpha Micromax 5421E Lead-Free Platable Ag/Pd C1 Termination for Chip Resistors
Type: Platable Ag/Pd C1 Termination
Application: Chip Resistor
Pd Content: 0.5%
Shelf Life: 6 months
Micromax 5421E is a lead-free, cadmium-free silver/palladium C1 termination for chip resistors. It offers high acid resistance, a dense fired film, platable surface, and fast firing on an 850°C/30 min profile. The 0.5% palladium content balances cost and performance, and the paste is compatible with Micromax 00X0srs resistors.
Micromax 5421E from MacDermid Alpha is a platable lead-free, cadmium-free silver/palladium C1 termination paste developed for chip resistor applications. It is positioned for low cost, high performance, and green product requirements. The 0.5% palladium content keeps material cost down while still supporting a dense fired film and a platable surface. High acid resistance and fast firing on an 850°C / 30 min profile help maintain throughput on standard resistor lines.
The paste carries 75.6–77.6% solids, fineness of grind at ≤20 μm and ≤10 μm, and a viscosity range of 210–260 Pa.s. Micromax 4553 is the listed solvent or thinner. Print with a 325 mesh stainless steel screen with approximately 15 μm emulsion to a dried thickness of 18 ± 2 μm. Recommended film thickness is 16–20 μm. Allow the wet print to level 10–15 minutes at room temperature, then dry at 150°C for 15 minutes in a box oven. Fire in a belt furnace using a 30-minute cycle with a peak temperature of 850°C for 10 minutes. Resistivity is ≤10 mΩ/sq at 12μm, and adhesion is ≥18 N. Substrates are based on 96% alumina. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5421E lead-free platable Ag/Pd C1 termination paste. Original factory TDS and batch-specific COA are available on request for your chip resistor programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5421E
- Platable silver/palladium C1 termination for chip resistor applications
- 0.5% palladium content for cost-effective performance
- Lead free and cadmium free formulation (no intentional addition)
- High acid resistance for demanding plating processes
- Dense fired film for reliable termination
- Platable surface ready for subsequent plating steps
- Fast firing: 850°C / 30 min profile
- Compatible with Micromax 00X0srs resistors
- Solids 75.6–77.6% for consistent deposition
- Viscosity 210–260 Pa.s for stable screen printing
- Screen: 325 mesh stainless steel, 15 μm emulsion; dried thickness 18 ± 2 μm
- Resistivity ≤10 mΩ/sq at 12μm; adhesion ≥18 N
Primary Applications
- Chip resistor edge termination — platable Ag/Pd C1 termination layer
- Resistor termination — per TDS application field
- Lead-free assemblies — designed for lead-free, cadmium-free processes
- Cost-sensitive chip resistor production — 0.5% Pd balances cost and performance
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Platable silver/palladium C1 termination paste | TDS: Platable Termination for Chip Resistors Applications |
| Application | Resistor termination | TDS: Resistor termination |
| Solvent or Thinner | Micromax 4553 | TDS: Micromax 4553 |
| Solid Content | 75.6 to 77.6 % | TDS: 75.6 to 77.6 % |
| Fineness of Grind | ≤ 20 μm; ≤ 10 μm | TDS: ≤20 μm; ≤10 μm |
| Viscosity | 210 to 260 Pa.s | TDS: Brookfield HBT, SC4-14/6R @10 rpm, 25°C |
| Mask Mesh | 325 | TDS: 325 |
| Mask Emulsion | 15 μm | TDS: 15 μm |
| Drying Time | 15 minutes | TDS: 15 min (box oven) |
| Drying Temperature | 150 °C | TDS: 150 °C |
| Recommended Film Thickness | 16 to 20 μm | TDS: 16 to 20 μm |
| Leveling Time | 10 to 15 minutes | TDS: 10 to 15 min |
| Adhesion | ≥ 18 N | TDS: ≥18 N |
| Resistivity | ≤ 10 mΩ/sq at 12μm | TDS: ≤10 mOhm per square @12μm |
| Palladium Content | 0.5 % | TDS: 0.5% palladium content |
| Lead Free | Yes (no intentional addition) | TDS: Product benefits |
| Cadmium Free | Yes (no intentional addition) | TDS: Product benefits |
| Firing Profile | 850°C x 10 minutes peak, 30-minute cycle | TDS: 30-minute cycle, peak 850°C x 10 min |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Compatible Resistor Series | Micromax 00X0srs resistors | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Lead free” and “Cadmium free” as used herein mean these substances are not intentionally added to the referenced product. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Thoroughly mix to redisperse solids | TDS: thoroughly mix |
| Screen Mesh | 325 mesh stainless steel with approx. 15 μm emulsion | TDS: 325 mesh, 15 μm emulsion |
| Dried Thickness | 18 ± 2 μm (recommended film 16–20 μm) | TDS: 18±2 μm dried |
| Leveling | 10–15 minutes at room temperature | TDS: 10-15 min |
| Drying | 150°C for 15 minutes (box oven) | TDS: 150°C, 15 min |
| Firing | 30-minute cycle, peak 850°C for 10 minutes, belt furnace | TDS: 30 min cycle, 850°C x 10 min |
| Thinner | Micromax 4553 | TDS: Micromax 4553 |
| Substrates | 96% alumina; other compositions may vary | TDS: 96% alumina |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5421E original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why does 5421E use only 0.5% palladium?
The 0.5% palladium content is a cost-effective choice. It keeps material cost down while still supporting a dense fired film, platable surface, and high acid resistance for chip resistor terminations.
How fast is the firing profile for 5421E?
The TDS lists a fast firing profile: 30-minute cycle with a peak temperature of 850°C for 10 minutes. This fits standard belt furnace processing for chip resistors.
Which resistor series are compatible with 5421E?
The TDS lists compatibility with Micromax 00X0srs resistors. This makes 5421E suitable for chip resistor builds that already use those resistor systems.
What adhesion and resistivity does 5421E achieve?
Adhesion is 18 N or higher. Resistivity is 10 mΩ/sq or less at 12μm. These values support reliable termination performance in chip resistor assemblies.
Is 5421E lead and cadmium free?
Per the TDS, lead and cadmium are not intentionally added to 5421E. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
What thinner should be used with 5421E?
Micromax 4553 is the listed solvent or thinner. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.
How should opened containers of 5421E be stored?
Keep containers tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.
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We supply authentic MacDermid Alpha Micromax 5421E lead-free platable Ag/Pd C1 termination paste for chip resistor programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Lead free” and “Cadmium free” as used herein mean these substances are not intentionally added to the referenced product. Trace amounts may be present.
