描述
MacDermid Alpha Micromax 5164N Pt/Ag Conductor for Hybrid Circuits
Type: Pt/Ag Conductor Paste
Application: Hybrid Circuits
Resistivity: ≤2 mΩ/sq
Shelf Life: 6 months
Micromax 5164N is a Pt/Ag thick film conductor paste developed for automotive hybrid circuits. It combines high thermal cycled adhesion and long term aging adhesion with excellent solderability, good wire bondability, fine line capability around 125 μm, and a wide process window. Resistivity is 2 mΩ/sq or less.
Micromax 5164N from MacDermid Alpha is a Pt/Ag thick film conductor paste that balances low cost and high performance. It was developed for automotive hybrid circuit applications and features a dense fired film with a newly developed inorganic binder. The conductor delivers electrical conductivity comparable to Cu thick film, distinct thermal cycled adhesion (TCA), and long term aging adhesion (LTAA). It also offers excellent solderability and super printability with fine line capability around 125 μm.
The paste has a viscosity range of 150–250 Pa.s and uses Micromax 4553 as the recommended thinner. Print with a 200–325 mesh stainless steel screen to a recommended film thickness of 10–14 μm. Allow leveling 5–10 minutes at room temperature, then dry at 150°C for 10 minutes. Fire on a 30-minute profile to a peak of 850°C for 10 minutes; a 60-minute profile is also acceptable. Resistivity is ≤2 mΩ/sq. Solder-ball spread test is 4.4 mm at 230°C with 62Sn/36Pb/2Ag solder over 30 seconds. Solder leach resistance is 4 minutes at 220°C. No conductor cracks occur after 2,000 cycles from −40°C to +125°C, plus 3,000 hours at 150°C aging. It is the standard conductor for the Micromax resistor Series 00X0. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5164N Pt/Ag conductor paste. Original factory TDS and batch-specific COA are available on request for your hybrid circuit programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5164N
- Pt/Ag thick film conductor paste for hybrid circuits
- Developed for automotive applications requiring long-term reliability
- High thermal cycled adhesion: no conductor cracks after 2,000 cycles (−40°C to +125°C)
- Long term aging adhesion: 3,000 hours at 150°C
- Excellent solderability and high electrical conductivity (resistivity ≤2 mΩ/sq)
- Good wire bondability
- Excellent printability with fine line capability around 125 μm
- Wide process window: insensitive to firing temperature, firing period, firing times, and film thickness
- Good compatibility with substrate, printing resistor, cross-over glass, and over-coat glass
- Good TCA and LTAA with 2% Ag solder and 10Sn/90Pb solder
- Standard conductor for Micromax resistor Series 00X0
- Screen: 200–325 mesh stainless steel
Primary Applications
- Automotive hybrid circuits — Pt/Ag conductor for high-reliability automotive builds
- Hybrid microcircuits — conductor layer in thick film hybrid assemblies
- Silver hybrid Ag conductors — per TDS application field
- Thick film resistor systems — standard conductor for Micromax resistor Series 00X0
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Pt/Ag thick film conductor paste | TDS: Pt/Ag Conductor Paste for Hybrid Circuit |
| Application | Silver hybrid Ag conductors | TDS: Silver hybrid Ag conductors |
| Solvent or Thinner | Micromax 4553 | TDS: Micromax 4553 |
| Viscosity | 150 to 250 Pa.s | TDS: Brookfield HBT, 10 rpm, 25°C±1°C |
| Mask Mesh | 200 to 325 | TDS: 200 to 325 |
| Drying Time | 10 minutes | TDS: 10 min |
| Drying Temperature | 150 °C | TDS: 150 °C |
| Recommended Film Thickness | 10 to 14 μm | TDS: 10 to 14 μm |
| Leveling Time | 5 to 10 minutes | TDS: 5 to 10 min |
| Resistivity | ≤ 2 mΩ/sq | TDS: ≤ 2 mOhm per square |
| Substrate Compatibility | 96% alumina | TDS: 96% alumina |
| Firing Profile | 30-minute profile, peak 850°C for 10 minutes; 60-minute profile also acceptable | TDS: 30 min profile, peak 850°C, 10 min |
| Fine Line | ~125 μm | TDS: ~125 |
| Soldering | 4.4 mm solder-ball spread at 230°C, 62Sn/36Pb/2Ag, 30 sec | TDS: 4.4 (mm) |
| Solder Leach Resistance | 4 minutes dipping at 220°C, 62Sn/36Pb/2Ag | TDS: 4 minutes |
| Thermal Cycled Adhesion | No conductor crack after 2,000 cycles (−40°C to +125°C) and 3,000 hrs at 150°C | TDS: Product benefits |
| Wire Bondability | Good | TDS: Product benefits |
| Compatible Resistor Series | Micromax resistor Series 00X0 | TDS: Standard conductor for Micromax resistor Series 00X0 |
| Solder Compatibility | 2% Ag solder and 10Sn/90Pb solder | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Mix well before printing to redisperse solids | TDS: Please mix well before printing |
| Screen Mesh | 200–325 mesh stainless steel | TDS: 200-325 mesh stainless steel |
| Recommended Film Thickness | 10–14 μm | TDS: 10 to 14 μm |
| Leveling | 5–10 minutes at room temperature | TDS: 5-10 min |
| Drying | 150°C for 10 minutes | TDS: 150°C for 10 min |
| Firing | 30-minute profile, peak 850°C for 10 minutes; 60-minute profile also acceptable | TDS: 30 min profile, peak 850°C, 10 min |
| Thinner | Micromax 4553 | TDS: Micromax 4553 |
| Substrates | 96% alumina; other compositions and manufacturers may vary | TDS: 96% alumina |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5164N original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why is 5164N suited to automotive hybrid circuits?
The TDS states 5164N was developed for automotive use. It shows no conductor cracks after 2,000 cycles from −40°C to +125°C and after 3,000 hours at 150°C aging, which supports long-term reliability in underhood and body electronics.
How wide is the 5164N process window?
The TDS describes it as insensitive to firing temperature, firing period, firing times, and film thickness. Both 30-minute and 60-minute firing profiles are acceptable, which reduces sensitivity to furnace variation.
What solders can be used with 5164N?
The TDS reports good TCA and LTAA with both 2% Ag solder and 10Sn/90Pb solder. The solder-ball spread test uses 62Sn/36Pb/2Ag at 230°C for 30 seconds, giving a 4.4 mm spread.
How well does 5164N resist solder leaching?
Solder leach resistance is 4 minutes dipping in 62Sn/36Pb/2Ag solder at 220°C, measured to a 2 mm line.
Can 5164N be wire bonded?
Yes. The TDS lists good wire bondability as a product benefit, with properties measured on 2.2 mm pads using a 0.8 mm wire peeling test.
Is 5164N compatible with Micromax resistor systems?
Yes. The TDS lists 5164N as the standard conductor for the Micromax resistor Series 00X0, and also notes good compatibility with printing resistor, cross-over glass, and over-coat glass.
What thinner should be used with 5164N?
Micromax 4553 is the listed solvent or thinner. Using the recommended thinner helps keep viscosity and print behavior consistent with the TDS values.
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We supply authentic MacDermid Alpha Micromax 5164N Pt/Ag conductor paste for hybrid circuit and automotive programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots.
