描述
MacDermid Alpha Micromax 5063R Top Frit-less Gold Conductor for Low Temperature Brazing
Type: Top Frit-less Gold Conductor
Application: Low Temperature Brazing
Series: 5062S + 5063R
Shelf Life: 6 months
Micromax 5063R is the top frit-less gold conductor in a two-component thick film system with Micromax 5062S. It enables high temperature solders and low temperature braze alloys on LTCC, 96% alumina, and multilayer hybrid circuits. Cd, Pb and phthalate free, with high strength and hermetic packaging capability.
Micromax 5063R from MacDermid Alpha is the top frit-less gold conductor in a two-component all thick film paste system. Paired with Micromax 5062S as the gold base conductor, the system is designed to facilitate the use of high temperature solders and low temperature braze alloys on low temperature cofired ceramic (Micromax GreenTape 951), 96% alumina, and multilayer hybrid circuits (Micromax QM44). The system is Cd, Pb and phthalate free, and supports a high strength, high reliability attachment mechanism with hermetic packaging.
Print 5063R over the fired 5062S using a 325-mesh stainless steel screen, ensuring the 5063R print completely covers the 5062S print. Allow prints to level for over 10 minutes at room temperature, then dry 10–15 minutes at 150°C. Fire using a standard 850°C, 30-minute profile in a well-ventilated belt, conveyor furnace, or static furnace. Total 5063R fired thickness should be ≥30 μm; combined 5062S + 5063R fired thickness should be ≥39 μm. PGA reliability after 1,000 hours in air at 150°C shows tensile pull strength of 65 N or more. Brazing is performed in nitrogen atmosphere with Au/Sn braze alloys, preforms, or pastes. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5063R top frit-less gold conductor paste. Original factory TDS and batch-specific COA are available on request for your brazing and hermetic packaging programs.
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Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5063R
- Top frit-less gold conductor paste for the two-component 5062S / 5063R thick film system
- Cd, Pb and phthalate free formulation (no intentional addition)
- High strength, high reliability attachment mechanism
- Supports hermetic packaging
- Enables high temperature solders and low temperature braze alloys
- Suited to LTCC GreenTape 951, 96% alumina, and QM44 multilayer hybrid circuits
- Screen: 325-mesh stainless steel; must fully cover the 5062S print
- Drying: level over 10 minutes at room temperature, then 10–15 minutes at 150°C
- Firing: 850°C for 30 minutes; total 5063R fired thickness ≥30 μm
- Combined 5062S + 5063R fired thickness ≥39 μm
- PGA thermal aging reliability: ≥65 N after 1,000 hours at 150°C in air
- Brazing in nitrogen atmosphere with Au/Sn alloys, preforms, or pastes
Primary Applications
- Low temperature cofired ceramic — gold metallization on Micromax GreenTape 951
- 96% alumina substrates — top gold layer for brazed attach
- Multilayer hybrid circuits — gold conductor in Micromax QM44 builds
- Hermetic brazed assemblies — pin, window frame, and heat sink attachment
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Top frit-less gold conductor paste | TDS: Gold Brazing Low Temperature Braze System |
| Application | Gold conductor | TDS: Gold conductor |
| Solvent or Thinner | Micromax 9180R | TDS: Micromax 9180R |
| Blend Member or Series | 5062S and 5063R | TDS: 5062S and 5063R |
| Screen Type | 325-mesh stainless steel | TDS: 325-mesh stainless steel |
| Printing Method | Screen printing over fired 5062S; 5063R must fully cover the 5062S print | TDS: ensure 5063R completely covers the 5062S print |
| Leveling | Over 10 minutes at room temperature | TDS: level for over 10 minutes |
| Drying Schedule | 10 to 15 minutes at 150°C | TDS: 10-15 minutes at 150°C |
| Firing Profile | 850°C for 30 minutes | TDS: standard 850°C, 30 minutes profile |
| Total 5063R Fired Thickness | ≥ 30 μm | TDS: ≥30μm |
| Fired Thickness (5062S + 5063R) | ≥ 39 μm | TDS: ≥39 |
| PGA Reliability Thermal Aging (N) | ≥ 65 | TDS: 1000 hrs in air at 150°C |
| Cd, Pb and Phthalate Free | Yes (no intentional addition) | TDS: Product benefits |
| Brazing Atmosphere | Nitrogen | TDS: Brazing is performed in nitrogen atmosphere |
| Brazing Alloys | Au/Sn braze alloys, preforms, or pastes | TDS: Au/Sn, preforms or pastes |
| Attach Mechanism | High strength, high reliability; hermetic packaging | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cd, Pb and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Slow, gentle hand stirring 1–2 minutes with a clean burr-free spatula; avoid air entrapment | TDS: 1-2 minutes |
| Screen Mesh | 325-mesh stainless steel | TDS: 325-mesh stainless steel |
| Printing Sequence | Print 5062S first onto fired substrate, then print 5063R over it; ensure 5063R completely covers 5062S | TDS: Print onto fired 5062S |
| Leveling | Over 10 minutes at room temperature | TDS: over 10 minutes |
| Drying | 10–15 minutes at 150°C in a well-ventilated oven or conveyor dryer | TDS: 10-15 minutes at 150°C |
| Firing | Standard 850°C, 30-minute profile in well-ventilated belt, conveyor furnace, or static furnace | TDS: 850°C, 30 minutes |
| Fired Thickness | 5063R ≥30 μm; 5062S + 5063R ≥39 μm | TDS: ≥30μm / ≥39μm |
| Thinning | Not normally required; Micromax 9180R for minor adjustment | TDS: Micromax 9180R |
| Brazing | Nitrogen atmosphere with Au/Sn braze alloys, preforms, or pastes | TDS: nitrogen atmosphere |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5063R original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why is 5063R used together with 5062S?
The TDS describes 5062S and 5063R as a two-component all thick film paste system. 5062S is the gold base conductor printed first onto the fired substrate; 5063R is the top frit-less gold conductor printed afterward. Together they enable high temperature solders and low temperature braze alloys.
How much 5063R thickness is required after firing?
Total 5063R fired thickness should be 30μm or more. When combined with the 5062S base layer, the total fired thickness should be 39μm or more.
Which substrates suit the 5062S / 5063R system?
Three substrate families are named in the TDS: low temperature cofired ceramic (Micromax GreenTape 951), 96% alumina, and multilayer hybrid circuits (Micromax QM44).
How strong is the brazed joint after thermal aging?
The TDS reports PGA reliability with thermal aging: tensile pull strength is 65 N or more after 1,000 hours in air at 150°C, measured on a standard pin grind array brazed to Micromax GreenTape 951.
What braze alloys can be used with 5062S / 5063R?
The TDS lists Au/Sn braze alloys, preforms, or pastes. Brazing is performed in nitrogen atmosphere with fixed fixtures holding the attachment and braze alloy directly on top of the 5062S / 5063R metallization.
Is 5063R free of cadmium, lead and phthalate?
Per the TDS, cadmium, lead oxide and phthalate are not intentional ingredients and are not intentionally added. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
What thinner should be used with 5063R?
Micromax 9180R is the listed solvent or thinner. Thinning is not normally required since the composition is optimized for screen printing. Use it only for small viscosity adjustments or to replace evaporation loss.
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We supply authentic MacDermid Alpha Micromax 5063R top frit-less gold conductor paste for low temperature brazing and hermetic packaging programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
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Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cd, Pb and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
