描述
MacDermid Alpha Micromax 5062S Gold Base Layer for Low Temperature Brazing
Type: Gold Base Conductor Paste
Application: Low Temperature Brazing
Solids: 84–86%
Shelf Life: 6 months
Micromax 5062S is the gold base conductor in a two-component thick film paste system with Micromax 5063R. It is designed for high temperature solders and low temperature braze alloys on LTCC, 96% alumina, and multilayer hybrid circuits. Cd, Pb and phthalate free, with a high strength attachment mechanism suited to hermetic packaging.
Micromax 5062S from MacDermid Alpha is the gold base conductor in a two-component all thick film paste system. Paired with Micromax 5063R as the top frit-less gold conductor, it is designed to enable high temperature solders and low temperature braze alloys on low temperature cofired ceramic (Micromax GreenTape 951), 96% alumina, and multilayer hybrid circuits (Micromax QM44). The system is Cd, Pb and phthalate free, with a high strength attachment mechanism and hermetic packaging capability.
The paste carries 84–86% solids and uses Micromax 8672 as the recommended thinner. Print with a 325–280 mesh, 13–15 μm emulsion screen. Allow prints to level for over 10 minutes at room temperature, then dry 10–15 minutes at 150°C. Fire using a standard 850°C, 30-minute profile; total fired thickness should be 9–12 μm. PGA reliability after 1,000 hours in air at 150°C shows tensile pull strength greater than 65 N. Brazing is performed in nitrogen atmosphere with Au/In, Au/Ge, Au/Sn, or similar braze alloys. Store sealed at 5–30°C; unopened shelf life is 6 months.
Genuine MacDermid Alpha Micromax Imported Stock & Technical Support
We hold regular stock of authentic MacDermid Alpha Micromax 5062S gold base conductor paste. Original factory TDS and batch-specific COA are available on request for your brazing and hermetic packaging programs.
Request Sample, TDS & Quotation
Complete TDS, COA, and regulatory documentation available
Key Features of MacDermid Alpha Micromax 5062S
- Gold base conductor paste for the two-component 5062S / 5063R thick film system
- Cd, Pb and phthalate free formulation (no intentional addition)
- High strength, high reliability attachment mechanism
- Supports hermetic packaging
- Enables high temperature solders and low temperature braze alloys
- Suited to LTCC GreenTape 951, 96% alumina, and QM44 multilayer hybrid circuits
- Solids 84–86% for consistent deposition
- Screen build: 325–280 mesh, 13–15 μm emulsion
- Drying: level over 10 minutes at room temperature, then 10–15 minutes at 150°C
- Firing: 850°C for 30 minutes; total fired thickness 9–12 μm
- PGA thermal aging reliability: >65 N after 1,000 hours at 150°C in air
- Brazing in nitrogen atmosphere with Au/In, Au/Ge, or Au/Sn alloys
Primary Applications
- Low temperature cofired ceramic — gold metallization on Micromax GreenTape 951
- 96% alumina substrates — gold base layer for brazed attach
- Multilayer hybrid circuits — gold conductor in Micromax QM44 builds
- Hermetic brazed assemblies — pin, window frame, and heat sink attachment
Full Technical Specifications
| Property | Typical Value | TDS Reference |
| Product Type | Gold base conductor paste | TDS: Gold Base Layer for Low Temperature Brazing |
| Application | Gold conductor | TDS: Gold conductor |
| Solvent or Thinner | Micromax 8672 | TDS: Micromax 8672 |
| Solid Content | 84 to 86 % | TDS: 84 to 86 % |
| Blend Member or Series | 5062S and 5063R | TDS: 5062S and 5063R |
| Screen Mesh | 325 to 280 | TDS: 325-280 mesh |
| Screen Emulsion | 13 to 15 μm | TDS: 13-15 μm emulsion |
| Printing Method | Screen printing, print Micromax 5062S onto fired substrate | TDS: Printing |
| Leveling | Over 10 minutes at room temperature | TDS: level for over 10 minutes |
| Drying Schedule | 10 to 15 minutes at 150°C | TDS: 10-15 minutes at 150°C |
| Firing Profile | 850°C for 30 minutes | TDS: standard 850°C, 30 minutes profile |
| Total Fired Thickness | 9 to 12 μm | TDS: 9 – 12μm |
| PGA Reliability Thermal Aging (N) | > 65 | TDS: 1000 hours in air at 150°C |
| Cd, Pb and Phthalate Free | Yes (no intentional addition) | TDS: Product benefits |
| Brazing Atmosphere | Nitrogen | TDS: Brazing in a nitrogen atmosphere is recommended |
| Brazing Alloys | Au/In, Au/Ge, Au/Sn and similar | TDS: such as Au/In, Au/Ge, Au/Sn, etc. |
| Attach Mechanism | High strength, high reliability; hermetic packaging | TDS: Product benefits |
| Shelf Life | 6 months | TDS: 6 months |
| Storage Temperature | 5 – 30 °C | TDS: 5°C – 30°C |
Note: All listed values are typical and may vary by batch. Values based on MacDermid Alpha official TDS. Independent qualification testing is required prior to production use. “Cd, Pb and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
Recommended Processing Conditions
| Parameter | Recommended Value | TDS Reference |
| Mixing Prior to Use | Slow, gentle hand stirring 1–2 minutes with a clean burr-free spatula; avoid air entrapment | TDS: 1-2 minutes |
| Screen Mesh | 325 to 280 mesh with 13–15 μm emulsion | TDS: 325-280 mesh, 13-15 μm emulsion |
| Printing | Print 5062S onto fired substrate in a well-ventilated area | TDS: Printing |
| Leveling | Over 10 minutes at room temperature | TDS: over 10 minutes |
| Drying | 10–15 minutes at 150°C in a well-ventilated oven or conveyor dryer | TDS: 10-15 minutes at 150°C |
| Firing | Standard 850°C, 30-minute profile; total fired thickness 9–12 μm | TDS: 850°C, 30 minutes |
| Thinning | Not normally required; Micromax 8672 for minor adjustment | TDS: Micromax 8672 |
| Brazing | Nitrogen atmosphere with Au/In, Au/Ge, Au/Sn braze alloys or pastes | TDS: nitrogen atmosphere |
Handling and Storage Recommendations
| Storage Rules | Store tightly sealed in a clean, stable environment at 5-30°C. | TDS: 5°C – 30°C |
| Shelf Life | 6 months in unopened containers from date of shipment. | TDS: 6 months |
| Pre-use Preparation | Thoroughly mix prior to use. Some settling of solids may occur during storage. | TDS: thoroughly mix |
| Transportation | Under normal shipping conditions, no temperature control is expected. For extended transport periods, confirm product suitability. | TDS: normal shipping conditions |
Official Technical Documentation
| Document Type | Document Introduction | Document Request |
| TDS | MacDermid Alpha Micromax 5062S original factory technical data sheet | Request TDS |
| COA | Batch-specific certificate of analysis | Request COA |
| SDS | Safety Data Sheet for handling and storage | Request SDS |
Frequently Asked Questions
Why is 5062S used together with 5063R?
The TDS describes 5062S and 5063R as a two-component all thick film paste system. 5062S is the gold base conductor; 5063R is the top frit-less gold conductor. The pair enables high temperature solders and low temperature braze alloys on LTCC, alumina, and hybrid circuits.
Which substrates suit the 5062S / 5063R system?
Three substrate families are named in the TDS: low temperature cofired ceramic (Micromax GreenTape 951), 96% alumina, and multilayer hybrid circuits (Micromax QM44).
How strong is the brazed joint after thermal aging?
The TDS reports PGA reliability with thermal aging: tensile pull strength exceeds 65 N after 1,000 hours in air at 150°C. This reflects the high strength, high reliability attachment mechanism the system is designed for.
What braze alloys can be used with 5062S / 5063R?
The TDS lists Au/In, Au/Ge, Au/Sn, and similar braze alloys, preforms, or pastes. Brazing is performed in nitrogen atmosphere with fixtures holding the attachment and braze alloy directly on the metallization.
Is 5062S free of cadmium, lead and phthalate?
Per the TDS, cadmium, lead oxide and phthalate are not intentional ingredients and are not intentionally added. Trace amounts may be present. Customers with strict compliance thresholds should verify against their own requirements.
Does 5062S need a specific thinner?
Micromax 8672 is the listed solvent or thinner. Thinning is not normally required since the composition is optimized for screen printing. Use the recommended thinner only for small viscosity adjustments or to replace evaporation loss.
How should 5062S be stored between production runs?
Keep containers tightly sealed at 5–30°C in a clean, stable environment. Unopened shelf life is 6 months from shipment. Some settling may occur, so mix thoroughly before reuse.
Get MacDermid Alpha Micromax 5062S Bulk Pricing and Technical Support
We supply authentic MacDermid Alpha Micromax 5062S gold base conductor paste for low temperature brazing and hermetic packaging programs. Contact our team for bulk quotations, sample availability, technical documentation, and application support.
Inquire Bulk Price & Technical Support
Disclaimer: All technical data on this page are for general guidance only and are not product specifications. Buyers must carry out independent trials and verify suitability before bulk ordering. Actual values may vary between production lots. “Cd, Pb and Phthalate free” as used herein means these substances are not intentional ingredients and are not intentionally added. Trace amounts may be present.
